• The Transactions of the Korean Institute of Electrical Engineers A
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• v.48 no.9
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• pp.1096-1102
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• 1999

This paper discusses the evaluation of interconnection capacity of small cogeneration(SCOGN) systems to the power distribution systems from the viewpoint of voltage regulation. Power utilities are required to keep the customers' voltage profile over a feeder close to the rated value under all load conditions. However, it is expected that the interconnection of SCOGNs to the power distribution systems impacts on the existing voltage regulation method and customers' voltage variations. Therefore, SCOGNs should be integrated to the automated power distribution systems to prevent interconnection problems and supply high quality electricity to the customers. For these reasons, we should proceed with the evaluation of interconnection capacity of SCOGNs to the power distribution systems. However, it is generally impossible to perform actual testing on the power distribution systems, and standardized methodologies and guidelines are not developed to evaluate it. The criterion indexes for voltage regulation and variations are presented in order to evaluate the interconnection capacity of SCOGNs to the power distribution systems. In addition, the evaluation methodology of interconnection capacity of SCOGNs for power distribution systems is presented. It is expected that the resulted of this paper are useful for power system planners to determine the interconnection capacity of SCOGNs and dispersed storage and generation (DSG) systems to the power distribution systems.

• Proceedings of the Korea Technology Innovation Society Conference
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• 2004.05a
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• pp.25-36
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• 2004

The key objective of this paper is to suggest a pilot model for mobile network interconnection charge calculation by bottom-up long-run incremental costing methodology. Interconnection issues have lately attracted considerable attention by network operators and regulators. However there is no standard by all the network operators' agreement. The costing method is an acute problem because the interconnection charge is directly related to the network operators' revenue. Thus Korea has planned to launch the new interconnection policy based on the current traffic distribution and then we simulate the model in a sample area with virtual data. The results propose objective and reasonable guideline for the mobile network element cost calculation. It can be helpful for calculating price floor or bottom-up long run incremental interconnection charge by regulator.

• The Journal of Society for e-Business Studies
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• v.8 no.1
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• pp.1-14
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• 2003

The first edition of ebXML which aims at unimarket was announced at May 1 of 2001. OASIS continues working on the framework of ebXML, and UN/CEFACT does on the contents. In our country, 30 vertical B2B markets are being constructed and most of them adopted ebXML as their main standard. In this situation, we need to make a guideline which can interconnect individual vertical B2B systems. In our study, we propose an architecture for i) Central Registry/Repository for the interconnection of between vertical B2Bs, between ebXML and non-ebXML, and between nations. ii) Information modeling for interconnection. iii) Distributed modeling. We hope our work could be extended by following discussion of academical and industrial researchers.

• ETRI Journal
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• v.28 no.6
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• pp.777-786
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• 2006

Since the introduction of competition in the telecommunication market due to the growth of the interconnection between heterogeneous networks, particularly fixed and mobile networks, the interconnection charge based on traffic-sensitive (TS) and non-traffic-sensitive (NTS) costs has become more important. Although there have been many studies of the public switched telephone network (PSTN), previous studies of TS and NTS costs in mobile networks are very few. In this paper, as a pilot study, we propose three criteria and a procedure for the classification of TS and NTS costs based on mobile systems. The three criteria are the following: function type, investment requirement, and main exhaust driver. Moreover, for a CDMA mobile system, strongly TS, strongly NTS, and mixed components are classified by the proposed criteria and procedure. The proposed criteria, procedure, and classification can provide a systematic and useful guideline to decide the scope of mobile facilities and to determine the terminating cost on mobile networks from fixed networks.

• Journal of Korea Technology Innovation Society
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• v.8 no.3
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• pp.1139-1156
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• 2005

The explosive growth in wireless networks and Internet services has created considerable demand for mobile Internet services based on the mobile phone. Mobile Internet has become the new business model in telecommunication market, therefore the open network policy for mobile Internet has been formulated and implemented by the government in Korea. In spite of the open network policy for mobile Internet, there has been no systematic analysis of the various interconnection issues, including pricing, in mobile Internet network. This paper aims to suggest the interconnection pricing methods for mobile Internet network by reviewing the current pricing models for various communications services, and adapting them to mobile Internet communications circumstances. Results of this paper can be used as a guideline for government policy directions and management decision making after the introduction of the open network policy for mobile Internet.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.12
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• pp.1705-1710
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• 2018

This paper deals with an analysis of the causes of over current relay(OCR) misoperation in power system with distributed generations(DG). In general, Y-D and Y-Y-D transformer connections are used for grid interconnection of DG. According to the interconnection guideline, the neutral point on Y side should be grounded. However, these transformer connections can lead to OCR misoperation as well as over current ground relay(OCGR) misoperation. Several researches have addressed the OCGR misoperation due to the interaction between transformer connections and zero-sequence voltage of distribution system. Recently, a misoperation of OCR at the point of DG interconnection to the utility system has been also reported. With increasing the interconnections of DG, such OCR as well as OCGR misoperations are expected to increase. In this paper, PSCAD/EMTDC modeling including DG interconnection transformer was performed and various case studies was carried out for identifying the cause of OCR misoperation.

• Asian Journal of Innovation and Policy
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• v.1 no.2
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• pp.148-167
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• 2012

This paper analyzes the impact of the change in telecommunication regulation changes including the unification of telecommunication service on network investment. The unification of telecommunication service plays a role of separating behavior regulation from entrance regulation and reducing entrance constraints. Therefore, it is expected that the market spillover effect is high through the improvement of behavior regulation. In addition, the effects of the other regulation changes in the 2010 Telecommunications Business Act revision are analyzed. This paper discusses critical factors affecting the decision making process in respect to the firm level and analyzes the impact path guiding investment and innovation. The key findings are as follows. First, the impact of entrance deregulation depends on the intensity of deregulation. If the intensity is not high, this regulation increases the incentive on investment and innovation. However, if the intensity is high as shown in abolishing of licensing, it affects the incentive negatively. Second, if interconnection regulation focuses on existing facilities or the intensity is not strong, this light handed regulation might increase investment and innovation. However, if interconnection obligation is expanded to the facility not constructed or the facility applying new technology, this regulation might deteriorate investment. Third, price deregulation increases the competition of service but it also increases the business opportunity, which means positive effect on investment. Finally, the paper proposes the guideline for telecommunications policy.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.3
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• pp.416-420
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• 2008

This paper proposes a new method to improve signal characteristics at branches frequently met in system-level routing. We also introduce the numerical formula which can estimate the time delay due to branches and the simple design guideline for system-level routing. Finally, we propose the routing method which can eliminate the signal reflection for the case of one driver and two receivers (multi-drop topology).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.193-215
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• 2003

Fracture Mechanism of Flip Chip Electromigration Failure - Mostly caused by Cathode Depletion at the UBM/Solder Interface Guideline to Increase Electromigration Resistance Material Selection: Sn/Ag(/Cu) > Pb/63Sn Cu UBM > Ni UBM (but, Solder Material combination) UBM Design: thick UBM is preferable (but, Stress Issue) Pad open/UBM size: as large as possible (but, pad size & pitch limit)