• ETRI Journal
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• 제43권1호
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• pp.64-73
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• 2021

Two-dimensional torus network nodes are typically interconnected using XY routing algorithm for transmitting a packet from a source node to a destination node. In XY routing, if all the paths are used efficiently, the throughput and latency can be improved. In this paper, to utilize all the paths efficiently, we propose a novel binary optical routing algorithm (BORA) to improve the throughput and latency. The throughput is calculated according to the injection rate and number of packets received at the destination. The XY routing algorithm and proposed BORA are implemented using objective modular network testbed in C++ simulation software and the results are analyzed and compared. In this paper, the simulation results show that the network latency reduces to 50% while using the proposed algorithm; moreover, the throughput is also improved.

• Journal of Electrical Engineering and information Science
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• 제2권5호
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• pp.17-26
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• 1997

Interconnect characterization on a wafer level was performed. Test patterns for single, two-coupled, and triple-coupled lines ere designed by using 0.5$\mu\textrm{m}$ CMOS process. Then interconnect capacitances and resistances were experimentally extracted by using tow port network measurements, Particularly to eliminate parasitic effects, the Y-parameter de-embedding was performed with specially designed de-embedding patterns. Also, for the purpose of comparisons, capacitance matrices were calculated by using the existing CAD model and field-solver-based commercial simulator, METAL and MEDICI. This work experimentally verifies that existing CAD models or parameter extraction may have large deviation from real values. The signal transient simulation with the experimental data and other methodologies such as field-solver-based simulation and existing model was performed. as expected, the significantly affect on the signal delay and crosstalk. The signal delay due to interconnects dominates the sub-micron-based a gate delay (e.g., inverter). Particularly, coupling capacitance deviation is so large (about more than 45% in the worst case) that signal integrity cannot e guaranteed with the existing methodologies. The characterization methodologies of this paper can be very usefully employed for the signal integrity verification or he electrical design rule establishments of IC interconnects in the industry.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.201-212
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• 2005

[ $Epoxy/BaTiO_3$ ] composite embedded capacitor films (ECFs) were newly designed fur high dielectric constant and low tolerance (less than ${\pm}15\%$) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent, and in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ composite ECF is measured with MIM capacitor at 100 kHz using LCR meter. Dielectric constant of $BaTiO_3$ ECF is bigger than that of $SrTiO_3$ ECF, and it is due to difference of permittivity of $BaTiO_3\;and\;SrTiO_3$ particles. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ ECF in high frequency range $(0.5\~10GHz)$ is measured using cavity resonance method. In order to estimate dielectric constant, the reflection coefficient is measured with a network analyzer. Dielectric constant is calculated by observing the frequencies of the resonant cavity modes. About both powders, calculated dielectric constants in this frequency range are about 3/4 of the dielectric constants at 1 MHz. This difference is due to the decrease of the dielectric constant of epoxy matrix. For $BaTiO_3$ ECF, there is the dielectric relaxation at $5\~9GHz$. It is due to changing of polarization mode of $BaTiO_3$ powder. In the case of $SrTiO_3$ ECF, there is no relaxation up to 10GHz. Alternative material for embedded capacitor fabrication is $epoxy/BaTiO_3$ composite embedded capacitor paste (ECP). It uses similar materials formulation like ECF and a screen printing method for film coating. The screen printing method has the advantage of forming capacitor partially in desired part. But the screen printing makes surface irregularity during mask peel-off, Surface flatness is significantly improved by adding some additives and by applying pressure during curing. As a result, dielectric layer with improved thickness uniformity is successfully demonstrated. Using $epoxy/BaTiO_3$ composite ECP, dielectric constant of 63 and specific capacitance of 5.1nF/cm2 were achieved.

• 한국통신학회논문지
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• 제21권12호
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• pp.3132-3143
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• 1996

In the evaluation of Broadband-ISDN, the main issue is to interconnect existing LANs and MANs to B-ISDN based on Asynchrous Transfer Mode. However, LANs provide connectionless services, whereas the ATM network provides connection-oriented services. So some problem arises from accessing ATM switchs to transparently transmit connectionless data via B-ISDN. Two methods then were recommended by ITU-TS to support the connectionaless services. In the paper, we do the numerical analysis, using the stochastic fluid flow method, of dynamic bandwidth allocation sheme with two class traffics in the virtual path established between Interworking Units(JWUS) interconnecting LANs to an ATM network and Connectionless Servers(CLSs). The loss mechanism of each traffic is controlled by the contents of buffer. The vandwidth which the IWU requests the CLS is estimated by the number of On-Off sources in the On state. We use the stochsastic fluide flow method which is to find the steady-state joint probability in each level of the IWU buffer. The length of the IWU buffer as the real random variable is changed by traffics entering the IWU.

• 한국경영과학회지
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• 제19권1호
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• pp.69-83
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• 1994

This paper deals with a capacitated ring-star network design problem (CRSNDP) with node capacity constraints. The CRSNDP is formulated as a mixed 0-1 integer problem, and a 2-phase heuristic solution procedure, ADD & VAM and RING, is developed, in which the CRSNDP is decomposed into two subproblems : the capacitated facility location problem (CFLP) and the traveling sales man problem (TSP). To solve the CFLP in phase I the ADD & VAM procedure selects hub nodes and their appropriate capacity from a candidate set and then assigns them user nodes under node capacity constraints. In phase II the RING procedure solves the TSP to interconnect the selected hubs to form a ring. Finally a solution of the CRSNDP can be achieved through combining two solution of phase I & II, thus a final design of the capacitated ring-star network is determined. The analysis of computational results on various random problems has shown that the 2-phase heuristic procedure produces a solution very fast even with large-scale problems.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2013년도 전력전자학술대회 논문집
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• pp.538-539
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• 2013

LIN(Local Interconnect Network) 통신은 CAN(Controller Area Network) 통신과 더불어 차량용 통신으로 많이 사용되고 있다. LIN 통신은 필요 성능의 수준이 높지 않은 장치 및 시스템이나 비용의 경제적인 측면에서 CAN 통신의 하부버스로 많이 사용되며 LIN 노드에 개수도 점차 늘어나고 있다. 그렇기 때문에 LIN통신으로 시스템 제어 및 모니터링 프로그램을 GUI(Graphic User Interface)로 제작한다면 시스템 상태의 디스플레이 및 모니터링이 수월해진다. 함수와 GUI로 제작되는 LabVIEW는 다른 텍스트 언어기반 개발 프로그램에 비해 설계 시간 단축 및 사후 관리도 쉽다는 장점이 있다. 본 논문에서는 LabVIEW로 제작한 IBS 모듈 기능 검사 장비개발을 통해 LIN 통신으로 송수신되는 데이터를 확인하고 모니터링, 그리고 설계가 용이하다는 것을 소개하고자 한다.

• ETRI Journal
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• 제36권4호
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• pp.643-653
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• 2014

To reduce interconnect delay and power consumption while improving chip performance, a three-dimensional integrated circuit (3D IC) has been developed with die-stacking and through-silicon via (TSV) techniques. The power supply problem is one of the essential challenges in 3D IC design because IR-drop caused by insufficient supply voltage in a 3D chip reduces the chip performance. In particular, power bumps and TSVs are placed to minimize IR-drop in a 3D power delivery network. In this paper, we propose a design methodology for 3D power delivery networks to minimize the number of power bumps and TSVs with optimum mesh structure and distribute voltage variation more uniformly by shifting the locations of power bumps and TSVs while satisfying IR-drop constraint. Simulation results show that our method can reduce the voltage variation by 29.7% on average while reducing the number of power bumps and TSVs by 76.2% and 15.4%, respectively.

• Current Optics and Photonics
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• 제7권2호
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• pp.166-175
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• 2023

We theoretically analyze and experimentally demonstrate a polarization-diversified four-channel optical demultiplexer (DeMUX) comprising a hybrid mode conversion-type polarization splitter rotator (PSR) and delayed Mach-Zehnder interferometer optical DeMUX for use in coarse wavelength division multiplexing (CWDM)-based optical interconnect applications. The Si wire-based device fabricated by a complementary metal-oxide semiconductor-compatible process exhibited nearly the same filter spectral response irrespective of the input polarization state under the PSR. The device had an extremely low insertion loss of <1.0 dB, polarization-dependent loss of <1.0 dB, and interchannel imbalance of <0.5 dB, suppressing unwanted wavelength and polarization crosstalk from neighboring channels of <-20 dB at each peak transmission channel grid.

• 대한전자공학회논문지SD
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• 제44권4호
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• pp.24-31
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• 2007

현재까지 다수의 버스 프로토콜과 구조가 발표되었지만, 대부분 공유 버스 구조를 가져 시스템 성능 저하의 원인이 되었다. 기존의 공유버스가 갖는 문제점들을 해결하기 위해 고성능의 버스 프로토콜인 SNP (SoC Network Protocol)와 버스 구조인 SNA (SoC Network Architecture)가 제안되었는데, 이를 수정/개선한 버스 구조를 제안하고자 한다. 개선된 SNA는 다중 마스터의 다중 버스 요청에 대해 다중 라우팅을 지원함으로써 성능을 향상시켰으며, 내부 라우팅 로직의 최적화로 면적을 감소시켰다. 또한 성능감소 없이 AMBA AHB 프로토콜과 완벽히 호환 가능한 XSNP(Extended SNP)를 인터페이스 프로토콜로 사용한다. 현재 라우팅 로직을 최적화하여 개선된 SNA의 하드웨어 복잡도가 크게 증가하지 않았고, 기존 SNP를 사용하는 IP는 호환성 문제나 성능 감소 없이 개선된 SNA를 통해 통신할 수 있다. 더불어, SNA는 AMBA AHB와 인터커넥트 버스 매트릭스를 대체할 수 있으며, 다중 채널을 동시에 보장하고 다양한 토플로지를 지원가능 하도록 설계되어 사용하는 IP 수에 따라 설계자에 의해 다양한 토플로지를 선택할 수 있다. 한편, SNA는 적은 수의 인터페이스 와이어를 가지기 때문에 오프 칩 버스로도 사용될 수 있다. 제안된 버스 구조는 시뮬레이션과 어플리케이션 동작을 통해 검증이 완료되었다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.756-760
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• 2005

By development of a robot technology, personal robot is being developed very actively. Various infra-technologies are accumulated in hardware and software how by internal a lot of research and development efforts, and it is circumstance that actual commodity is announced. But, personal robot is applied to be acting near human, and takes charge of safety and connected directly a lot of works of home security, gas-leakage, fire-warning facilities, or/and etc. So personal robot must do safe and stable action even if any unexpected accidents are happened, important functions are always operated. In this paper, we are wished to show design structures for supporting fault-tolerant operation from our real-time robot middleware viewpoint. Personal robot, in being developed, was designed by module structure to do to interconnect and to interoperate among each module that is mutually implemented by each research facilities or company. Also, each modules can use appreciate network system that is fit for handling and communicating its data. To guarantee this, we have being developed a real-time network middleware, for especially personal robot. Recent our working is to add and to adjust some functions like connection management, distributed routing mechanism, remote object management, and making platform independent robot application execution environment with self-moving of robot application, for fault-tolerant personal robot.