• 한국정보통신학회논문지
• /
• 제8권3호
• /
• pp.686-693
• /
• 2004

WCDMA용 SAW 필터를 제작하기 위하여 mathematica package를 이용한 모의 실험기를 개발하였으며, 전극재료로는 Al-Cu를 사용하였다. 모의실험한 자료를 바탕으로 전극에서 발생하는 ultimate rejection을 줄이기 위해 SFIT형태의 필터를 설계 및 제작하였다. 회절에 의한 현상을 최소화하기 위해 필터의 입력단은 block weighted IDT 형태로, 출력단은 withdrawal weighted IDT형태로 구성하였다. Langasite 기판위에 형성시킨 입 출력 빗살무늬 변환기 전극 수는 50쌍, 두께와 폭은 5000$\AA$와 1λ4(((equation omitted) 3.6$\mu\textrm{m}$)로 하였으며, IDT 전극 폭과 전극간격 은 각각 1λ/16와 1λ/8로 하였다. 제작한 SAW 필터의 특성은 중심주파수는 190MHz, 통과대역은 4MHz이며 저지대역은 -60dB이하로 측정되었다.

• 한국환경보건학회지
• /
• 제31권2호
• /
• pp.134-146
• /
• 2005

Environmental monitoring system has been adopted and supplemented as inspection measures for the quantitative and qualitative changes of environmental impact assessment (EIA). This study compares the results of environmental impact assessment with the results of post-environmental investigation using a correction and principal component analysis (PCA) in the housing development project. Correlation analysis showed that most of air quality variables including TSP, $PM_{10},\;NO_2$, CO were linearly correlated with each other in the environmental impact assessment and the post-environmental investigation. In the water quality, pH and BOD were well correlated with the DO and SS, respectively. As a result of correlation analysis in the noise and vibration, noise in day and night and vibration in day and night were related to each other between EIA and the post-environmental investigation. From the results of analysis of soil, Cu with Cd, Cu with Pb, and Cd with Pb were related to each other in EIA. Principal component analysis (PCA) showed a powerful pattern recognition that had attempted to explain the variance of a large dataset of inter-correlated variable with a smaller set of independent variables (principal components). Principal component (PC1) and principal component (PC2) were obtained with eigenvalues> 1 summing almost $90\%$ of the total variance in the all of the items(air, water, noise, vibration and soil) in EIA and post-environmental investigation.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.251-251
• /
• 2016

For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. Wastewaters are consisting of complex mixture of different inorganic and organic compounds and some of them can be toxic, hazardous and hard to degrade. These effluents are mainly treated by conventional technologies such are aerobic and anaerobic treatment and chemical coagulation. But, these processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that could be show higher purification results. Among them, boron doped diamond (BDD) attract attention as electrochemical electrode due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD on Nb, Ta, W and Si substrates, but, their application in effluents treatment is not suitable due to high cost of metal and low conductivity of Si. To solve these problems, Ti has been candidate as substrate in consideration of cost and property. But there are adhesion issues that must be overcome to apply Ti as BDD substrate. Al, Cu, Ti and Nb thin films were deposited on Ti substrate to improve adhesion between substrate and BDD thin film. In this paper, BDD films were deposited by hot filament chemical vapor deposition (HF-CVD) method. Prior to deposition, cleaning processes were conducted in acetone, ethanol, and isopropyl alcohol (IPA) using sonification machine for 7 min, respectively. And metal layer with the thickness of 200 nm were deposited by DC magnetron sputtering (DCMS). To analyze microstructure X-ray diffraction (XRD, Bruker gads) and field emission scanning electron microscopy (FE-SEM, Hitachi) were used. It is confirmed that metal layer was effective to adhesion property and improved electrode property. Electrochemical measurements were carried out in a three electrode electrochemical cell containing a 0.5 % H2SO4 in deionized water. As a result, it is confirmed that metal inter layer heavily effect on BDD property by improving adhesion property due to suppressing formation of titanium carbide.

• Environmental Engineering Research
• /
• 제22권2호
• /
• pp.141-148
• /
• 2017

Globalization, industrialization, mining, and uncontrolled population growth have fostered a shortage of potable water. Therefore, it has become imperative to understand an effective and reasonable water purification technique. A renewed interest in electrocoagulation (EC) has been spurred by the search for reliable, cost-effective, water-treatment processes. This paper has elucidated a technical approach for getting rid of heavy metals and total suspended solids (TSS) from synthetic water using an aluminum electrode. The effect of operational parameters, such as current density, inter-electrode distance, operating time, and pH, were studied and evaluated for maximum efficiency. This study corroborates the correlation between current density and removal efficiency. Neutral pH and a low electrode gap have been found to aid the efficacy of the EC setup. The outcome indicates that a maximum TSS removal efficiency of 76.6% occurred at a current density of $5.3mA/cm^2$ during a contact time of 30 min. In the case of heavy metals remediation, 40 min of process time exhibited extremely reduced rates of 99%, 59.2%, and 82.1%, for Cu, Cr, and Zn, respectively. Moreover, kinetic study has also demonstrated that pollutants removal follows first-and second-order model with current density and EC time being dependent.

• Journal of Magnetics
• /
• 제5권1호
• /
• pp.19-22
• /
• 2000

The effects of a hard-biased Held on the magnetic and magnetoresistive properties of a crossed spin-valve head are investigated by computer simulation with particular emphasis on the asymmetry of the output signal. The spin-valve considered in this work is NiMn (25 nm)/NiFe (2.5 m)/Cu (3 nm)/NiFe (5.5 m), with a length of 1500 m and a width of 600 nm. A simple model is used where each magnetic layer consists of a single domain, and the magnetoresistance is a function of the angle between the magnetization directions of the two magnetic layers. The ideal crossed spin-valve structure is not realized with the present model and magnetic parameters, but the deviation from ideality is decreased by the hard-biased field. This results in the improvement of the linearity of the output signal with the use of the bias field. The magnetoresistance ratio and magnetoresistive sensitivity, however are reduced. The magnetic properties including the magnetoresistance are found to be strongly affected by magnetostatic interactions, particularly the inter-layer magnetostatic field.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 International Symposium
• /
• pp.261-278
• /
• 2003

Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

• Korean Chemical Engineering Research
• /
• 제45권5호
• /
• pp.466-472
• /
• 2007

웨이퍼 레벨(WL) 3차원(3D) 집적을 구현하기 위해 저유전체 고분자를 본딩 접착제로 이용한 웨이퍼 본딩과, 적층된 웨이퍼간 전기배선 형성을 위해 구리 다마신(damascene) 공정을 사용하는 방법을 소개한다. 이러한 방법을 이용하여 웨이퍼 레벨 3차원 칩의 특성 평가를 위해 적층된 웨이퍼간 3차원 비아(via) 고리 구조를 제작하고, 그 구조의 기계적, 전기적 특성을 연속적으로 연결된 서로 다른 크기의 비아를 통해 평가하였다. 또한, 웨이퍼간 적층을 위해 필수적인 저유전체 고분자 수지를 이용한 웨이퍼 본딩 공정의 다음과 같은 특성 평가를 수행하였다. (1) 광학 검사에 의한 본딩된 영역의 정도 평가, (2) 면도날(razor blade) 시험에 의한 본딩된 웨이퍼들의 정성적인 본딩 결합력 평가, (3) 4-점 굽힘시험(four point bending test)에 의한 본딩된 웨이퍼들의 정량적인 본딩 결합력 평가. 본 연구를 위해 4가지의 서로 다른 저유전체 고분자인 benzocyclobutene(BCB), Flare, methylsilsesquioxane(MSSQ) 그리고 parylene-N을 선정하여 웨이퍼 본딩용 수지에 대한 적합성을 검토하였고, 상기 평가 과정을 거쳐 BCB와 Flare를 1차적인 본딩용 수지로 선정하였다. 한편 BCB와 Flare를 비교해 본 결과, Flare를 이용하여 본딩된 웨이퍼들이 BCB를 이용하여 본딩된 웨이퍼보다 더 높은 본딩 결합력을 보여주지만, BCB를 이용해 본딩된 웨이퍼들은 여전히 칩 back-end-of-the-line (BEOL) 공정조건에 부합되는 본딩 결합력을 가지는 동시에 동공이 거의 없는 100%에 가까운 본딩 영역을 재현성있게 보여주기 때문에 본 연구에서는 BCB가 본딩용 수지로 더 적합하다고 판단하였다.

• 한국자기학회지
• /
• 제11권2호
• /
• pp.72-77
• /
• 2001

DC 마그네트론 방식으로 제조한 PtMn계 상부층형(top) 스핀밸브 박막을 반강자성층인 PtM의 fcc (111) 구조에서 fat (111)구조 천이를 위하여 27$0^{\circ}C$에서 3 kOe의 외부자장을 가해주면서 일차적인 열처리를 한 후, 이차적으로 무자장 열처리를 하여 상온에서 자기적 특성을 조사하였다. Si/A1$_2$O$_3$ (500$\AA$)/Ta(50$\AA$)NiFe(40$\AA$)/CoFe(17$\AA$)/Cu(28$\AA$)/CoFe (30$\AA$)PtMn(200$\AA$)Ta(50$\AA$) top 스핀밸브 시료에서 자기저항비를 조사한 결과 열처리 온도가 높아질수록 자기저항비가 완만히 감소하나 325 $^{\circ}C$ 이상에서 급격히 감소하여 1 %까지 감소하는 것을 확인하였으며, 이것은 열처리 온도가 높아질수록 반강자성층과 피고정층사이의 교환 결합력이 약해지는 것에 기인하는 것으로 판단하였다. 열처리 온도 증가에 따른 교환 바이어스 자장은 325 $^{\circ}C$ 이상에서 급격히 감소하였고, 고정층과 자유층사이의 상호 결합 세기(interlayer coupling field, $H_{int}$)는 $325^{\circ}C$ 이상에서 크게 증가하였는데, 이것은 열처리 온도가 증가함에 다라 Mn의 상호 확산(inter-diffusion)dl 증가하여 계면에서의 거칠기(roughness)가 커지기 때문이라고 생각하였다. 이와 같은 결과에서 PtMn 스핀밸브의 급격한 자기적 특성변화가 일어나는 열처리 온도가 PtMn계 스핀밸브 박막의 블로킹 온도(blocking temperature, $T_b$)와 잘 일치함을 호가인할 수 있었다.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2009년 추계학술발표대회
• /
• pp.40-40
• /
• 2009

The Cu-bearing PFS-700 steel which has yield strength over 700 MPa was developed to replace the existing submarine structural material, HY-100. PFS-700 steel has good combination of mechanical properties and superior weldability which can be welded without pre-heating before welding. Application PFS-700 steel to submarine or battle ship will give a great reduction of cost by removing or lowing pre-heating. To develop pre-heat free welding consumables that matches and take advantage of PFS-700 steel, new welding consumables have been designed for the GMAW, SAW processes and explosion bulge test(EBT) were conducted to see the reliability of welded structure. All welding was conducted without pre-heating before welding, the inter-pass temperatures were below $50^{\circ}C$ for SAW50 and $150^{\circ}C$ for GMAW and SAW150. All EBT specimens show over 14% reduction of thickness without through-thickness crack or propagation of crack to the hole-down area. Tensile properties for all welding conditions show higher(GMAW) or similar values(SAW50, SAW150) to the base metal. Charpy impact values for the weld metal also show 163.5J(GMAW), 95.4J(SAW50) and 69.0J(SAW150), which meet the goal, 50J, of this project.

• 약학회지
• /
• 제52권2호
• /
• pp.93-100
• /
• 2008

A liquid chromatographic method with tandom spectrometric detection (LC/MS/MS) for the simultaneous determination of doxifluridine and its active metabolite, 5-fluorouracil (5-FU) was developed over the concentration range of $5{\sim}2000$ ng/ml, respectively. Doxifluridine, 5-FU and internal standard, 5-chlorouracil (5-CU), were extracted from liver and intestine tissue via protein precipitation. Acetonitrile was used as the extraction solvent and the supernatant was evaporated and reconstructed in mobile phase. Optimum chromatographic separation was achieved on a Agilent Zorbax $C_{18}$ ($100\;mm{\times}2.1\;mm$, $3.5\;{\mu}m$) column with mobile phase run in isocratic with methanol : water (20 : 80, v/v). The flow rate was 0.2 ml/min with total cycle time of 5 min. The lower limit of quantification was validated at 5.0 ng/ml of liver and intestine tissue, for both doxifluridine and 5-FU, respectively. The intra-day and inter-day precision and accuracy of quality control (QC) samples were <11% coefficient of variation and <7% relative error from theoretical concentration for both analytes. In addition, the special designed stability study was performed, because the metabolism of doxifluridine occurs spontaneously even in ice bath for monkey liver. The stability of doxifluridine in liver and intestine of monkey and beagle dog was compared. It was found that bioanalytical validation could not be performed for the monkey liver; however, beagle dog's liver has relatively low speed of metabolism compared to monkey liver and instead of monkey liver, beagle dog's liver could be used for the validation. Bioanalytical validation could be performed in monkey intestine. Eventually, this developed method for liver and intestine will be useful in support of the toxicokinetic and pharmacokinetic studies of doxifluridine and 5-FU.