• International Journal of High-Rise Buildings
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• v.6 no.4
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• pp.307-313
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• 2017

This paper outlines the processes and strategies studied and selected by the team during the design stages of the project for the incorporation of BIPV into the tower's façade. The goal was to create a system that helps reduce internal heating and cooling loads while collecting energy through photovoltaic panels located throughout the building. The process used to develop this façade system can be broken down into three stages. 1. Concept: BIPV as design catalyst for a high-rise building. 2. Optimization: Balancing BIPV and Human comfort. 3. Integration: Incorporating BIPV into a custom curtain wall design. The FKI Project clearly illustrates the evolution building enclosures from simple wall systems to high performance integrated architectural and engineering design solutions. This design process and execution of this project represent the design philosophy of our firm.

• International Journal of High-Rise Buildings
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• v.11 no.1
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• pp.31-39
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• 2022

The seamless integration of the architecture and structure of a tall building plays a key role in establishing a recognizable and iconic design. The structural system developed for Shenzhen Rural Commercial Bank Headquarters (SRCBH) utilizes enhanced structural innovations unique to the tower's geometry to improve structural and sustainability performance. SRCBH utilizes a steel diagrid system pulled outside of the enclosure line with diaphragm forces resolved primarily by corner diagonal beams. During the design process the structural systems underwent performance based design and optimization for wind and seismic loading. Resiliency was prioritized for structural design as well as fire resistance. More closely integrating the structure of a building with its architecture and sustainability goals can lead to unique and innovative towers with a timeless expression.

• International Journal of High-Rise Buildings
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• v.7 no.2
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• pp.161-170
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• 2018

Rapid urbanization, resource depletion, and limited land are further increasing the need for skyscrapers in city centers; therefore, it is imperative to enhance tall building performance efficiency and energy-generative capability. Potential performance improvements can be explored using parametric multi-objective optimization, aided by evaluation tools, such as computational fluid dynamics and energy analysis software, to visualize and explore skyscrapers' multi-resource, multi-system generative potential. An optimization-centered, software-based design platform can potentially enable the simultaneous exploration of multiple strategies for the decreased consumption and large-scale production of multiple resources. Resource Generative Skyscrapers (RGS) are proposed as a possible solution to further explore and optimize the generative potentials of skyscrapers. RGS can be optimized with waste-energy-harvesting capabilities by capitalizing on passive features of integrated renewable systems. This paper describes various resource-generation technologies suitable for a synergetic integration within the RGS typology, and the software tools that can facilitate exploration of their optimal use.

• International Journal of High-Rise Buildings
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• v.1 no.2
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• pp.117-123
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• 2012

This paper discusses major strengths of tall buildings that distinguish them as sustainable solutions for the built environment. It sheds light on some of the key attributes of tall buildings as well as materials and technologies that could boost their performance environmentally, economically and technically as well as the natural habitats containing them. Tall buildings are portrait as major successful options for accommodating the ever increasing urban world population, with little negative impact on ecologies and environmental habitats worldwide. The role of tall buildings as 'vertical garden sub-cities' mitigating modern city problems of 'urban heat islands' and sprawling cities is explored. A few building examples as well as city developments are presented which represent the new generation of sustainable tall buildings that are setting trends for future projects incorporating innovations in materials and building systems and designs.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.13 no.12
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• pp.5904-5927
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• 2019

Many artificial intelligence (AI) techniques have been embedded into various engineering technologies to assist them in achieving different goals. The integration of modern technologies with energy consumption management system and occupant's comfort inside buildings results in the introduction of intelligent building concept. The major aim of this integration is to manage the energy consumption effectively and keeping the occupant satisfied with the internal environment of the building. The last few couple of years have seen many applications of AI techniques for optimizing the energy consumption with maximizing the user comfort in smart buildings but still there is much room for improvement in this area. In this paper, a hybrid of two AI algorithms called firefly algorithm (FA) and genetic algorithm (GA) has been used for user comfort maximization with minimum energy consumption inside smart building. A complete user friendly system with data from various sensors, user, processes, power control system and different actuators is developed in this work for reducing power consumption and increase the user comfort. The inputs of optimization algorithms are illumination, temperature and air quality sensors' data and the user set parameters whereas the outputs of the optimization algorithms are optimized parameters. These optimized parameters are the inputs of different fuzzy controllers which change the status of different actuators according to user satisfaction.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.344-348
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• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Journal of KIISE:Computer Systems and Theory
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• v.37 no.5
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• pp.257-271
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• 2010

As the end of photolithographic integration era is approaching fast, numerous nanoscale devices and systems based on novel nanoscale materials and assembly techniques are recently emerging. Notably, various reconfigurable architectures with considerable promise have been proposed based on nanowire crossbar structure as the primitive building block. Unfortunately, high-density sys-tems consisting of nanometer-scale elements are likely to have numerous physical imperfections and variations. Therefore, defect-tolerance is considered as one of the most exigent challenges in nanowire crossbar systems. In this work, three different defect-avoidant logic mapping algorithms to circumvent defective crosspoints in nanowire reconfigurable crossbar systems are evaluated in terms of various performance metrics. Then, a novel method to find the most cost-effective repair solution is demonstrated by considering all major repair parameters and quantitatively estimating the performance and cost-effectiveness of each algorithm. Extensive parametric simulation results are reported to compare overall repair costs of the repair algorithms under consideration and to validate the cost-driven repair optimization technique.