• Title/Summary/Keyword: Integrated RF module

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Design, Fabrication and Frequency Analysis of Transmitter Optical Sub-assembly for a 10 Gb/s XFP Transceiver (10 Gb/s XFP Transceiver용 Transmitter Optical Sub-assembly(TOSA)의 RF 설계/제작 및 주파수 특성 해석)

  • 김동철;심종인;박문규;어영선
    • Korean Journal of Optics and Photonics
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    • v.15 no.4
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    • pp.349-354
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    • 2004
  • As a transmitter sub-assembly in the XFP(10 Gb/s Small Form Factor Pluggable) transceiver module, a transmitter optical sub-assembly(TOSA) is designed, fabricated and characterized in view of electrical and thermal performances. For a low-cost and compact packaging TOSA, the bias-tee and the matching resistor are monolithically integrated on the AlN sub-mount and a newly designed coplanar waveguide is drawn in the TO-stem. All optoelectronic components packaged in the TOSA are modeled by the equivalent circuit, which helps to improve and characterize the TOSA performance. The fabricated TOSA shows the -3㏈ bandwidth as high as 11 GHz at an elevated temperature of 85$^{\circ}C$.

A RF MEMS Transmitter Based on Flexible Printed Circuit Boards (연성 인쇄 회로 기판을 이용한 초고주파 MEMS 송신기 연구)

  • Myoung, Seong-Sik;Kim, Seon-Il;Jung, Joo-Yong;Yook, Jong-Gwan
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.1
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    • pp.61-70
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    • 2008
  • This paper presents the flexible MEMS transmitter based on flexible printed circuit board or FPCB, which can be transformed to arbitrary shape. The FPCB is suitable to fabricate light weight and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface due to its flexible enough to be lolled up like paper. In this paper, the flexible MEMS transmitter integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing(OFDM) communication system is proposed. The active device of the proposed flexible MEMS transmitter is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. Moreover, the passive devices such as the filter and signal lines are integrated and fabricated on the FPCB board. The performance of the fabricated flexible MEMS transmitter is analyzed with EVM characteristics of the output signal.

Development of an Integrated Forecasting and Warning System for Abrupt Natural Disaster using rainfall prediction data and Ubiquitous Sensor Network(USN) (농촌지역 돌발재해 피해 경감을 위한 USN기반 통합예경보시스템 (ANSIM)의 개발)

  • Bae, Seung-Jong;Bae, Won-Gil;Bae, Yeon-Joung;Kim, Seong-Pil;Kim, Soo-Jin;Seo, Il-Hwan;Seo, Seung-Won
    • Journal of Korean Society of Rural Planning
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    • v.21 no.3
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    • pp.171-179
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    • 2015
  • The objectives of this research have been focussed on 1) developing prediction techniques for the flash flood and landslide based on rainfall prediction data in agricultural area and 2) developing an integrated forecasting system for the abrupt disasters using USN based real-time disaster sensing techniques. This study contains following steps to achieve the objective; 1) selecting rainfall prediction data, 2) constructing prediction techniques for flash flood and landslide, 3) developing USN and communication network protocol for detecting the abrupt disaster suitable for rural area, & 4) developing mobile application and SMS based early warning service system for local resident and tourist. Local prediction model (LDAPS, UM1.5km) supported by Korean meteorological administration was used for the rainfall prediction by considering spatial and temporal resolution. NRCS TR-20 and infinite slope stability analysis model were used to predict flash flood and landslide. There are limitations in terms of communication distance and cost using Zigbee and CDMA which have been used for existing disaster sensors. Rural suitable sensor-network module for water level and tilting gauge and gateway based on proprietary RF network were developed by consideration of low-cost, low-power, and long-distance for communication suitable for rural condition. SMS & mobile application forecasting & alarming system for local resident and tourist was set up for minimizing damage on the critical regions for abrupt disaster. The developed H/W & S/W for integrated abrupt disaster forecasting & alarming system was verified by field application.

High Resolution Spaceborne SAR Operation and Target Recognition Simulator Using STK (STK를 이용한 고해상도 위성 SAR 운용 및 표적물 추출 기법)

  • Lee, Bo-Yun;Lee, Seul-Ki;Lee, Woo-Kyung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.3
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    • pp.299-309
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    • 2013
  • A comprehensive SAR(Synthetic Aperture Radar) simulation is considered to be a complicated task since a full knowledge of the signal propagation characteristics, antenna pattern, system internal errors and interference noises should be taken into account. In high resolution target application modes, the time varying nature of target RCS(Radar Cross Section) strongly affects the generated SAR images. In this paper, in-depth SAR simulations are performed and analyzed incorporating the STK tools and MATLAB software. STK provides realistic orbit parameters while its radar module helps to extract accurate radiometric parameters of ground targets. SAR raw data corresponding to a given target is generated and processed using MATLAB simulator. The performance is measured by PSLR(Peak Sidelobe Ratio) and ISLR(Integrated Sidelobe Ratio) for a point target, which can be used as reference parameters for accurate radiometric calibration. Finally, high resolution target simulations are performed by adopting time varying target RCS characteristics.

GPU Based Feature Profile Simulation for Deep Contact Hole Etching in Fluorocarbon Plasma

  • Im, Yeon-Ho;Chang, Won-Seok;Choi, Kwang-Sung;Yu, Dong-Hun;Cho, Deog-Gyun;Yook, Yeong-Geun;Chun, Poo-Reum;Lee, Se-A;Kim, Jin-Tae;Kwon, Deuk-Chul;Yoon, Jung-Sik;Kim3, Dae-Woong;You, Shin-Jae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.80-81
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    • 2012
  • Recently, one of the critical issues in the etching processes of the nanoscale devices is to achieve ultra-high aspect ratio contact (UHARC) profile without anomalous behaviors such as sidewall bowing, and twisting profile. To achieve this goal, the fluorocarbon plasmas with major advantage of the sidewall passivation have been used commonly with numerous additives to obtain the ideal etch profiles. However, they still suffer from formidable challenges such as tight limits of sidewall bowing and controlling the randomly distorted features in nanoscale etching profile. Furthermore, the absence of the available plasma simulation tools has made it difficult to develop revolutionary technologies to overcome these process limitations, including novel plasma chemistries, and plasma sources. As an effort to address these issues, we performed a fluorocarbon surface kinetic modeling based on the experimental plasma diagnostic data for silicon dioxide etching process under inductively coupled C4F6/Ar/O2 plasmas. For this work, the SiO2 etch rates were investigated with bulk plasma diagnostics tools such as Langmuir probe, cutoff probe and Quadruple Mass Spectrometer (QMS). The surface chemistries of the etched samples were measured by X-ray Photoelectron Spectrometer. To measure plasma parameters, the self-cleaned RF Langmuir probe was used for polymer deposition environment on the probe tip and double-checked by the cutoff probe which was known to be a precise plasma diagnostic tool for the electron density measurement. In addition, neutral and ion fluxes from bulk plasma were monitored with appearance methods using QMS signal. Based on these experimental data, we proposed a phenomenological, and realistic two-layer surface reaction model of SiO2 etch process under the overlying polymer passivation layer, considering material balance of deposition and etching through steady-state fluorocarbon layer. The predicted surface reaction modeling results showed good agreement with the experimental data. With the above studies of plasma surface reaction, we have developed a 3D topography simulator using the multi-layer level set algorithm and new memory saving technique, which is suitable in 3D UHARC etch simulation. Ballistic transports of neutral and ion species inside feature profile was considered by deterministic and Monte Carlo methods, respectively. In case of ultra-high aspect ratio contact hole etching, it is already well-known that the huge computational burden is required for realistic consideration of these ballistic transports. To address this issue, the related computational codes were efficiently parallelized for GPU (Graphic Processing Unit) computing, so that the total computation time could be improved more than few hundred times compared to the serial version. Finally, the 3D topography simulator was integrated with ballistic transport module and etch reaction model. Realistic etch-profile simulations with consideration of the sidewall polymer passivation layer were demonstrated.

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