• 제목/요약/키워드: Integrated Molding

검색결과 80건 처리시간 0.034초

트랜스퍼 금형에 있어서 IC 폐키지의 성형 유동 해석에 관한 연구 (A Study on the Molding Analysis of IC Package in Transfer mold)

  • 구본권
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1995년도 추계학술대회 논문집
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    • pp.64-67
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    • 1995
  • Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

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열-유동 상호작용을 고려한 유도가열 적용 미세 사출성형의 통합적 수치해석 (Integrated Numerical Analysis of Induction-Heating-Aided Injection Molding Under Interactive Temperature Boundary Conditions)

  • 엄혜주;박근
    • 대한기계학회논문집A
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    • 제34권5호
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    • pp.575-582
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    • 2010
  • 최근 박육사출성형이나 마이크로 사출성형에서의 성형성을 높이기 위해 급속 금형가열 기술이 사용되고 있다. 고주파 유도가열은 전자기 유도현상을 이용하여 금형 표면만을 효율적으로 가열할 수 있어 급속 금형가열 기술로서 활용되고 있다. 본 연구에서는 고주파 유도가열 적용 사출성형 과정의 수치적 모사를 위해 전자기장 해석, 열전달 해석, 사출성형 유동해석을 연계한 통합적 전산모사 기법에 관한 연구를 수행하였다. 본 연구에서 제안된 통합적 전산모사 기법을 유도가열 적용 박육 사출성형의 해석에 적용하여 실험결과와 비교하였고, 특히 금형온도 경계조건의 부여방식에 따른 해석의 신뢰성에 대한 고찰이 이루어졌다.

AN ANALYSIS OF MOLDING AND CURING OF SMC BY THE FINITE ELEMENT METHOD

  • Kim, Naksoo-
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1992년도 춘계학술대회 논문집 92
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    • pp.177-200
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    • 1992
  • A thermo-viscoplastic finite element program was developed to analyze the compression molding of SMC process. Deformation of the material was modelled by using the flow-rule. Heat balance during the process was coupled to the deformation. In the cure study, a kinetic model was adopted to describe the cure behavior. The numerical kinetic model was integrated with the thermo-viscoplastic numerical analysis by adding heat generation due to the chemical reaction of the workpiece in the heat transfer analysis. The integrated finite element program can simulate a whole sequential molding process including deformation, heat transfer, and chemical reaction. A practical SMC molding process with T-shaped substructure was simulated. The simulated results showed good agreements with experiments.

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광통신 용 VCSEL Array상에 Microlens Array를 집적하기 위한 UV성형 공정기술 개발 (Development of UV molding Process to Integrate Microlens Array on VCSEL Array for Optical Communication)

  • 한정원;김석민;김홍민;이지승;임지석;강신일
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.840-843
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    • 2004
  • UV molding is a process for integrating micro/nano polymeric optical components on optoelectronic modules. In the present study, a microlens array for vertical cavity surface emitting laser(VCSEL) to fiber coupling was designed, integrated and tested. At the design stage, design variables ware optimized to maximize the coupling efficiency, and tolerance analysis was carried out. At the integration stage, the UV transparent mold was fabricated and the microlens array on VCSEL array was integrated by UV molding process. Finally the coupling efficiency of VCSEL to fiber was measured and analyzed.

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통합 만족도를 고려한 사출성형공정의 강건 설계 (Robust Design of an Injection Molding Process Considering Integrated Desirability)

  • 김경모;박종천
    • 한국기계가공학회지
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    • 제18권10호
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    • pp.34-41
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    • 2019
  • Warpage and weld line are two major cosmetic defects in the injection molding process. These defects are very sensitive to uncontrollable parameters within the process. The optimization of the design variables can be treated with the use of robust designs. Therefore, in order to minimize the warpage and weld line, a special design method to diminish defects is required. In this study, a new robust design method using designer preference to achieve the optimal robust design conditions in the injection molding process is proposed. The effectiveness of the proposed method is shown with an example of the part of warpage and weld line.

DSI 성형을 이용한 금속/플라스틱 복합 부품 제조에 관한 연구 (A study on the manufacturing of metal/plastic multi-components using the DSI molding)

  • 하석재;차백순;고영배
    • Design & Manufacturing
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    • 제14권4호
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    • pp.71-77
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    • 2020
  • Various manufacturing technologies, including over-molding and insert-injection molding, are used to produce hybrid plastics and metals. However, there are disadvantages to these technologies, as they require several steps in manufacturing and are limited to what can be reasonably achieved within the complexities of part geometry. This study aims to determine a practical approach for producing metal/plastic hybrid components by combining plastic injection molding and metal die casting to create a new hybrid metal/plastic molding process. The integrated metal/plastic hybrid injection molding process developed in this study uses the proven method of multi-component technology as a basis to combine plastic injection molding with metal die casting into one integrated process. In this study, the electrical conductivity and ampacity were verified to qualify the new process for the production of parts used in electronic devices. The electrical conductivity was measured, contacting both sides of the test sample with constant pressure, and the resistivity was measured using a micro ohmmeter. Also, the specific conductivity was subsequently calculated from the resistivity and contact surface of the conductor path. The ampacity defines the maximum amount of current a conductive path can carry before sustaining immediate or progressive deterioration. The manufactured hybrid multi-components were loaded with increasing currents, while the temperature was recorded with an infrared camera. To compare the measured infrared images, an electro-thermal simulation was conducted using commercial CAE software to predict the maximum temperature of the power loaded parts. Overall, during the injection molding process, it was demonstrated that multifunctional parts can be produced for electric and electronic applications.

최적 축류팬 개발을 위한 통합공정 (설계, 시제품제작, 측정, 금형가공, 사출, 조립) (Integrated Process for Development of an Optimal Axial Flow Fan (Design, RP, Measurement, Injection Molding, Assembly))

  • 박성관;최동규
    • 한국CDE학회논문집
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    • 제3권3호
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    • pp.201-209
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    • 1998
  • To develop timely an optimal fan, a design system and a new manufacturing process used step by step have to be integrated. A small sized optimal fan for refrigerators, that was the goal on this project, was developed by the following principal processes. All processes are technologically linked in many directions: The existing fan was measured through reverse engineering. The measured data was used for the basic source of 3D design. The performance tests were carried and used as the data for the evaluation of the existing fan. Flow analysis by FANS-3D/sup [1]/ was performed at the given information (pressure drop and flow rate) to find out the configuration of optimal fan design. The flow patterns were investigated to measure the performance of fan through numerical experiment. The grid point data obtained by the above analysis turned into 3D high efficiency fan model by using CATIA. The product was manufactured by RP process (SLS, SLA) and tested the characteristic curves of the developed fan to compare with the existing fan. The modification of fan design were all examined to see any change in performance and checked to find any deficiency in assembling the fan into a duct. After the plastics flow analysis of the injection molding cycle to ensure acceptable quality fan, an optimal mold was processed by using tool-path for the newly designed fan.

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사출성형시 굴절율 변화를 고려하기 위한 플라스틱 비구면 렌즈의 광선추적기법 (Ray Tracing of a Plastic Aspheric Lens by Considering Index Distribution Induced from Injection Molding)

  • 엄혜주;박근
    • 소성∙가공
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    • 제18권2호
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    • pp.128-134
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    • 2009
  • The present study covers an integrated simulation method to evaluate optical performance of an aspheric plastic lens by connecting an injection molding analysis with a ray tracing simulation. Traditional ray tracing methods have based on the assumption that the optical properties of a lens are homogeneous throughout the entire volume. This assumption is to a certain extent unrealistic for injection-molded plastic lenses because material properties vary at every point due to the injection molding effects. To take into account the effects of the inhomogeneous optical properties of the molded lens, a numerical scheme is developed to calculate the distribution of refractive index induced from the injection molding process. This index distribution is then reflected onto CODE $V^{(R)}$ simulation and used to calculate ray paths in inhomogeneous media. The proposed tracing scheme is implemented on the tracing of an aspheric lens for a mobile phone camera module.

Stamp-to-Stick Bonding 및 Microtransfer Molding 방법을 이용한 미세유체 채널이 집적된 광전기유체소자의 제작 (Fabrication of channel-integrated optoelectrofluidic device using stamp-to-stick bonding and microtransfer methods)

  • 황현두;이도현;박제균
    • 센서학회지
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    • 제18권2호
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    • pp.154-159
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    • 2009
  • This paper describes two methods - stamp-to-stick bonding and microtransfer molding - to integrate microfluidic channel into an optoelectrofluidic device for in-channel microparticle manipulation. We have demonstrated the optoelectronic microparticle manipulation in the channel-integrated optoelectrofluidic device using a liquid crystal display. As injecting a liquid sample containing $15{\mu}m$-diameter polystyrene particles into the fabricated channel, trapping and transport of individual microparticles have been successfully demonstrated. This channel-integrated optoelectrofluidic device may be useful for several in-channel applications based on the optoelectrofluidics such as optoelectronic flow control, droplet-based protein assay and bead-based immunoassay.

사출성형 공정에서의 통합정비방법에 관한 연구 (An Integrated Maintenance in Injection Molding Processes)

  • 박철순;문덕희;성홍석;송준엽;정종윤
    • 산업경영시스템학회지
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    • 제38권3호
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    • pp.100-107
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    • 2015
  • Recently as the manufacturers want competitiveness in dynamically changing environment, they are trying a lot of efforts to be efficient with their production systems, which may be achieved by diminishing unplanned operation stops. The operation stops and maintenance cost are known to be significantly decreased by adopting proper maintenance strategy. Therefore, the manufacturers were more getting interested in scheduling of exact maintenance scheduling to keep smooth operation and prevent unexpected stops. In this paper, we proposedan integrated maintenance approach in injection molding manufacturing line. It consists of predictive and preventive maintenance approach. The predictive maintenance uses the statistical process control technique with the real-time data and the preventive maintenance is based on the checking period of machine components or equipment. For the predictive maintenance approach, firstly, we identified components or equipment that are required maintenance, and then machine parameters that are related with the identified components or equipment. Second, we performed regression analysis to select the machine parameters that affect the quality of the manufactured products and are significant to the quality of the products. By this analysis, we can exclude the insignificant parameters from monitoring parameters and focus on the significant parameters. Third, we developed the statistical prediction models for the selected machine parameters. Current models include regression, exponential smoothing and so on. We used these models to decide abnormal patternand to schedule maintenance. Finally, for other components or equipment which is not covered by predictive approach, we adoptedpreventive maintenance approach. To show feasibility we developed an integrated maintenance support system in LabView Watchdog Agent and SQL Server environment and validated our proposed methodology with experimental data.