• Journal of the Korea Computer Industry Society
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• v.6 no.2
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• pp.357-364
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• 2005

The prefabricated type used generally in Korea to join cable runs on new installations or to repair broken Cable runs on existing installations, because installation is very simple and save time. This type is a permanent, shielded and submersible cable joint for direct burial or vault application. It confirms to the requirements of IEEE std. 404-1993 by factory testing, but many problems of insulated cable systems are caused by internal defects of the joint part which have to be mounted ensile. Faults arise from impurities or voids. A suitable solution for a monitoring of cable joints during the after-laying test and service is partial discharge detection. Specimen obtained 1mm thickness from the insulation of real power cable and cable joint. <중략>The partial discharges are measured to determine their time dependence for 60 minutes and the influence of applied electrical stress under 30kV. $\Phi-q-n$ properties were measured using detection impedance, high pass filter and computerized data acquisition system. Statistic Value like maximum charge, repetition rate, average charge, etc. are calculated. It is possible to quantitative analysis of $\Phi-q-n$ properties from this statistic value and pattern analysis.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.4
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• pp.347-355
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• 2014

Thermal problems that are directly related to the lifetime of an electronic device are becoming increasingly important owing to the miniaturization of electronic devices. To solve thermal problems, it is essential to study thermal stability through thermal diffusion and insulation. A honeycomb sandwich plate has anisotropic thermal conductivity. To analyze the thermal deformation and temperature distribution of a system that employs a honeycomb sandwich plate, the thermal and elastic properties need to be determined. In this study, the thermal and elastic properties of a honeycomb sandwich plate, such as thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and shear modulus, are predicted. The properties of a honeycomb sandwich plate vary according to the hexagon size, thickness, and material properties.