• Journal of Powder Materials
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• v.8 no.4
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• pp.258-267
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• 2001

In this work, the conventional transient liquid phase(TLP) bonding was modified. An attempt was made of using a liquid phase sintered alloy, which will be a liquid phase coexisting with a solid phase at the bonding temperature, as an interlayer for bonding metals. With an aim of revealing the fundamental features of this modified TLP bonding, the kinetics concerned with the growth of solid particles and the isothermal solidification process in Fe-1.16wt%B and Fe-4.5wt%P interlayers for the bonding pure iron, as well as the morphological change of the solid particle, were investigated.

• Journal of Korea Foundry Society
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• v.13 no.1
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• pp.42-49
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• 1993

Conventional manufacturing process for cast iron-babbitt metal composite is complicate and bimetallic bonding by centrifugal casting is also difficult because their melting point is largely different and nonmetallic inclusion exists on outer shell. This study is aiming to simplify multistage process by adding Cu-powder as insert metals during cast iron solidification. The variables on fabrication of composite pipe are mold rotating speed and inner surface temperature of outer metal. The optimum temperature range for fusion bonding between cast iron and Cu-layer was $1100^{\circ}C-1140^{\circ}C$ in case of mold rotating speed was 700rpm. When the inner surface of Cu-layer was at $900^{\circ}C$, the value of interfacial hardness between Cu-layer and babbitt metal were higher than Cu-matrix by forming diffusion layer, interfacial products between Cu-layer and babbitt metal are proved to be $Cu_6Sn_5({\eta})$by XRD.

• Korean Journal of Metals and Materials
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• v.48 no.4
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• pp.289-296
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• 2010

The effects of heat input and different microstructureswere investigated on the tensile-shear properties of an arc-brazed joint of theferritic stainless steel 429EM using a Cu-Si insert alloy. The brazing speed was fixed at 800 mm/min whilethe brazing current varied from 80 to 120A. For abrazing current lower than 100A, fracturing occurred at the joint root in the direction perpendicular to the tensile load. As the brazing current increased to 120A, fracturing occurred at the base metal or the joint root. The joint and the base metal had very similar yield and tensile load values. However, the amount of elongation was decreased considerably compared to when the base metal was used. The fracturing began at the triple point of the root part and was classified into three types. The difference in the tensile-shear properties was closely related to the three fracture types.

• Transactions of the Korean Society of Automotive Engineers
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• v.7 no.9
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• pp.112-118
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• 1999

Shrinkage behavior was investigated to obtain more accurate dimensions of injected molding parts for free and restricted shrinkage conditions. various parameters for metal inserted injection process, such as thickness of resin, holding pressure and time, mo이 temperature and restriction condition of mold, were considered for the analysis of shrinkage phenomena. For numerical analysis, MOLDFLOW software was used to find the deterministic parameters of filling time, temperature, pressure and holding time. Also , experimental shrinkage effects were measured through actual injection molding process and the resin thickness was under controlled as 3 mm , 5 mm, and 7mm for the shapes of plastic gear made of Polymide(PA) and Polyxymethlene(POM). The main parameters of these injection processes were found to be holding pressure, holding time and mold temperature in the case of metal inserted molding.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.96-103
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• 2000

This study investigated the effects of bonding temperature and bonding atmosphere on high temperature mechanical properties of transient liquid phase(TLP) bonded joints of heat resistant alloy using MBF-50 insert metal. Specimens were bonded at 1,423~1,468K for 600s. Microconstituents of {TEX}$Cr_{7}(C,B)_{3}${/TEX}were formed in the bonded region when the bonding temperature was low. The amount of microcostituents in the bonded layer decreased with increasing the bonding temperature, and the microconstituents in the bonded layer disappeared at the bonding temperature above 1,468K. The tensile strength of the joints at elevated temperatures increased with the increase the bonding temperature and was the same level as one of the base metal in the bonding temperature over 1,453K. Microstructure and alloying element distributions of the bonded region bonded in Ar and $N_2$atmosphere were similar to those of the bonded in vacuum. The creep rupture strength and rupture lives of joints were almost identical to those of base metal.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.315-320
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• 2000

The optimal design for the shape of metal ring obturator under the high pressure using parameter study on the stress analysis considering effects of design variable is presented and is compared to experimental results. The design variables are such as thickness, taper, radius of shape of the obturation ring. For optimization of the obturation ring, the weight is maximized subject to maximum stress of the obturator within allowable stress. The design constraints are geometric elements of design variables. The trends of parametric study are in good agreement with the experimental results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1084-1090
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• 1998

As device sizes are scaled down to submicron dimensions, planarization technology becomes increasingly important for both device fabrication and formation of multilevel interconnects. Chemical mechanical polishing (CMP) has emerged recently as a new processing technique for achieving a high degree of planarization for submicron VLSI applications. The polishing process has many variables, and most of which are not well understood. The factors determine the planarization performance are slurry and pad type, insert material, conditioning technique, and choice of polishing tool. Circuit density, pattern size, and wiring layout also affect the performance of a CMP planarization process. This paper presents the results of studies on CMP process window characterization for 0.35 micron process with 5 metal layers.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.10a
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• pp.287-291
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• 2001

In this study, we designed and constructed a multi-forming progressive die with a bending, embossing on the multi-stage and performed through the try out. Out of the characteristics of this paper that nothing might be ever seen before such as this type of research method on the all of processes of thin and high precision production part.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.204-206
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• 2003

Ti/Steel 클래드 판재를 제조하기 위하여 티타늄과 강판을 직접 접합하는 경우 접합 계면에 취성이 강한 금속간화합물 및 TiC 탄화물이 발생하여 계면접합강도를 저하시키는 단점이 있다. 이러한 단점을 보완하기 위하여 본 연구에서는 티타늄과 강판 사이에 니켈 박판을 삽입한 후 1223-1323K 온도구간에서 접합 실험하였다. 특히, 온도의 변화에 따라 티타늄과 강판의 계면에 발생되는 금속간화합물의 종류 및 반응층의 크기 변화에 따른 기계적 특성을 조사하였다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.298-301
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• 2009

In this study, the casting process using forged insert was investigated to characterize the manufacturing process by which good mechanical properties can be obtained when compared with existing casting products. Process analysis for the casting design was performed by using FVM (Finite Volume Method) software. In filling process, three kinds of candidate gating systems are considered and analyzed respectively. The molten metal behavior in gating system is so important that it affects the solidification behavior of the cast.