• Journal of the Korean Graphic Arts Communication Society
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• v.18 no.2
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• pp.69-82
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• 2000

Recently, as the prepress mainstream is changed to the digital workflow, various digital proofing systems such as high price dye sublimation printers and low price ink jet printers are widely used in printing industry. CRT monitors are also often used as a soft proofing device. However, it is very difficult to match the color image displayed on CRT monitors to the actual images printed on papers, because the color space of CRT monitors is RGB color system, and it is different with the CMY color system of the printing devices. Therefore, proper color compensations are needed to match the colors between hard-copy proofs on the printing device and soft copy proofs on CRT monitors. This paper shows the LUT and gamut mapping method considering the printing characteristics of output device is useful for the compensation.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.236-237
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• 2007

A single-wall carbon nanotube (SWNT) transparent conductive film (TCF) was fabricated using a simple inkjet printing method. The TCF could be selectively patterned by controlling the dot size to diameters as small as 34${\mu}m$. In thisrepeatable and scalable process, we achieved 71% film transmittance and a resistance of 900 ohm/sq sheet with an excellent uniformity, about $\pm$5% deviation overall. Inkjet printing of SWNT is substrate friendly and the TCF is printed on a flexible substrate. This method of fabrication using direct printing permits mass production of TCF in a large area process, reducing processing steps and yielding low-cost TCF fabrications on a designated area using simple printing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.426-426
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• 2007

We report the field emission characteristics of transparent single-walled carbon nanotube (SWNT) film printed using an inkjet. Pure SWNTs dispersed in dimethylformamide were printed in a transparent layer on indium-tin oxide-coated glass and annealed at $350^{\circ}C$. After taping treatment, SWNTs were oriented vertically on the substrate. The front and the back of the fabricated device produced simultaneous emissions of identical quality. In addition, inkjet printing directly achieved a patterned emission, without a secondary pattern process. This method allows simple fabrication using only SWNTs, without the use of other additives.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2001.11a
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• pp.54-54
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• 2001

지필의 수축 현상은 섬유의 특성, Forming 공정에서 섬유배향Drying, 온도조건, Size P Press Y- Coating 공정 에서 Rewetting, 공정 중의 Tension, Draw등에 의 해 영 향을 받게 된다. 특히 Drying 공정에서는 지필 수분이 증발하면서 섬유의 자체 수축 및 섬유결합 부의 Micro compression이 발생하게 된다. 그리고 Draw, Canvas Tension, Cylinder 온도둥과 같은 공정 조건의 변동에 따라 지필 수축률의 차이가 발생하며 제품의 M MD/CD의 강도적 특성 및 칫수안정성 컬등의 품질과 상관성을 갖는다. 일반적으로 제 품의 신축률을 측정하는 일반적인 방법은 Reel 샘플을 일정시간 침수하여 종이 내부의 응력을 제거한 후 전후의 치수 차이를 비교하는 것이다. 그러나 이 방법을 통해서는 실 질적으로 Dryer 내부의 어느 단계에서 어느 정도의 수축이 발생하는지를 판단할 수는 없다. 본 연구는 Dryer에서 Reel 까지의 종이 수축 변화를 On - Line상에서 직접 측정한 적 용 사례와 공정 조건에 따른 지필 수축의 변화를 측정한 결과에 대한 것이다. 여기서 사용된 On-Line 지필 수축기는 직진성의 레이저를 이동식 지지대에 설치하여 전/후측 의 지필과 Cy linder 양끝의 거리 차이를 측정하여 지필의 폭을 계산할 수 있도록 자체 개발하였다. 이 설비를 이용하여 Dryer 내부에서 지필 수축이 급격이 일어나는 C Cylinder 군을 찾아 스팀압력과 Bel Run의 진공도, Canvas Tension, Draw 공정조건을 조정하였고 결과적으로 제품의 신축률 개선 효과를 가져올 수 있었다. 본 연구에서 개발한 On-Line 지필 수축 측정 기법은 종이 칫수 안정성과 관련하여 향후 공정 최적화 작업의 진단 도구로서 적극적으로 활용할 수 있을 것으로 기대된다.었다. 특히 지분의 경우, 참여한 회사의 지분관련 complain이 약 80% 정도 감소하는 결과를 나타 내었다. 또한 백상지의 경우 ink jet 프린터에 많이 사용됨으로 ink jet 프린터의 인쇄 적성을 image analyzer로 측정한 결과 산화전분 보다 향상된 결과를 나타내었다. 있다 고 사료되었다.칼비터에 의한 고해나 큰 물성적으로 큰 차이를 보이지는 않고 있 었다. 단지 섬유의 차이가 고해방식의 차이보다 월등히 크다는 사실을 보이고 있다 이러한 점은 섬유장의 길이에서도 볼 수 있다. 칼비터가 섬유를 절단하기만 하고 닥방망이 고해가 섬유장의 변화를 일으키지 않는다면 틀림없이 평균 섬유장의 차이가 생길것이다.의 여수도가 7 70% 이상 개선되는 것으로 나타났다.측정하였다. 또한 카르복실기 정량과 종이의 pH 측정 및 X -ray Diffractometer를 이용하여 결정화도를 측정하였다. 본 연구의 결과, 시간의 경과에 따라서 탄소의 결합에너지는 분포가 C-H에서 COO-, 또는 C=O로 달라짐으로써 종 이가 산화되고 있다는 것을 알 수 있었다. 또한 이 결합에너지 분포의 변화가 펄프의 종류 에 따라서 다르게 이동함으로써 제조된 시트의 표면 산화반응이 서로 다르게 일어나고 있음 을 알 수 있었으며, 이는 사용한 펄프의 화학 조성분의 차이에 기인한 것이라 사료된다.>NW 단열군이 연구지역 내에서 지하수 유동성이 가장 높은 단열군으로 추정된다. 이러한 사실은 3개 시추공을 대상으로 실시한 시추공 내 물리검층과 정압주입시험에서도 확인된다.. It was resulted from increase of weight of single cocoon. "Manta"2.5ppm produced 22.2kg of cocoon. It is equal to 9% increase in index, as compared to that of control.

• Journal of the Korean Ceramic Society
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• v.40 no.7
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• pp.657-661
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• 2003

The elastic moduli or fracture strengths of multi-layered film (SiO$_2$/po1y-Si/SiN/SiO$_2$, 2.77 $\mu\textrm{m}$ thick), CVD diamond film (1.6 $\mu\textrm{m}$ thick), SiO$_2$ film (1.0 $\mu\textrm{m}$ thick) and SiN film (0.43 $\mu\textrm{m}$ thick) made for the membrane of ink-jet printer head were measured with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam (${\mu}$-CLB). And the elastic moduli of ${\mu}$-CLB of SiO$_2$ film and SiN film were compared with the value of each film on silicon substrate determined with nanoindentation method. The results showed that the modulus and strength of multi-layered film decrease from 68.08 ㎬ and 2.495 ㎬ to 56.53 ㎬ and 1.834 ㎬, respectively as the width of CLB increases from 18.5 $\mu\textrm{m}$ to 58.5 $\mu\textrm{m}$. And the elastic moduli of SiO$_2$ and SiN films measured with ${\mu}$-CLB bending method are 68.16 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with nanoindentation method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with ${\mu}$-CLB bending technique, moduli can be measured to within 2%.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.421-427
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• 2009

We successfully fabricated 4.7-inch organic thin film transistors array with $640{\times}480$ pixels on flexible substrate. All the processes were done by photolithography, spin coating and ink-jet printing. The OTFT-Electrophoretic (EP) pixel structure, based on a top gate OTFT, was fabricated. The mobility, ON/OFF ratio, subthreshold swing and threshold voltage of OTFT on flexible substrate are: 0.01 ^2/V-s, 1.3 V/dec, 10E5 and -3.5 V. After laminated the EP media on OTFT array, a panel of 4.7-inch $640{\times}480$ OTFT-EPD was fabricated. All of process temperature in OTFT-EPD is lower than $150^{\circ}C$. The pixel size in our panel is $150{\mu}m{\times}150{\mu}m$, and the aperture ratio is 50 %. The OTFT channel length and width is 20 um and 200um, respectively. We also used OTFT to drive EP media successfully. The operation voltages that are used on the gate bias are -30 V during the row data selection and the gate bias are 0 V during the row data hold time. The data voltages that are used on the source bias are -20 V, 0 V, and 20 V during display media operation.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.2-19.2
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• 2010

Printed electronics using printing process has broadened in all respects such as electrics (lighting, batteries, solar cells etc) as well as electronics (OLED, LCD, E-paper, transistor etc). Copper is considered to be a promising alternative to silver for printed electronics, due to very high conductivity at a low price. However, Copper is easily oxidized, and its oxide is non-conductive. This is the highest hurdle for making copper inks, since the heat and humidity that occurs during ink making and printing simply accelerates the oxidation process. A variety of chemical treatments including organic capping agents and metallic coating have been used to slow this oxidation. We have established synthetic conditions of copper nanoparticles (CuNPs) which are resistant to oxidation and average diameter of 20 to 50nm. Specific resistivity should be less than $4\;{\mu}{\Omega}{\cdot}cm$ when sintered at lower temperature than $250^{\circ}C$ to be able to apply to conductive patterns of FPCBs using ink-jet printing. Through this study, the parameters to control average diameter of CuNPs were found to be the introduction of additive agent, the feeding rate of reducing agent, and reaction temperature. The CuNPs with various average diameters (58, 40, 26, 20nm) could be synthesized by controlling these parameters. The dispersed solution of CuNPs with an average size of 20 nm was made with nonpolar solvent containing 3 wt% of binder, and then coated onto glass substrate. After sintering the coated substrates at $250^{\circ}C$ for 30 minutes in nitrogen atmosphere, metallic copper film resulted in a specific resistivity of $4.2\;{\mu}{\Omega}{\cdot}cm$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.81-81
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• 2009

Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.145-150
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• 2000

Micro punching is one of general methods to fabricate simple holes such as permanent ink-jet printer nozzles. A thin punch, that is need for micro punching, usually has been obtained by mechanical machining. There are some method to obtain a thin punch from a cylindrical rod, e.g., microgrinding and WEDG (Wire Electro-Discharge Grinding). Inefficiently, only one punch can be obtained from these machining methods. In contrast with these methods, many punches can be fabricated simultaneously by electrochemical process. Electrochemical process has usually aimed to obtain very sharp probe for atomic force microscopy (AFM) or scanning tunneling microscopy (STM), and it has not been considered the whole shape of a probe in spite of good merits. In this paper, an ultrathin punch with a tapered shape and a cylindrical tip is newly fabricated by electrochemical process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1294-1298
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• 2005

In this study, combined micro press and surface finishing process are proposed to fabricate the micro nozzle array on a stainless steel sheet metal. In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. For this reason, subsequent magnetic field-assisted finishing technique is applied to remove the burr which exists around the nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals were investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.