• 한국기계가공학회지
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• 제4권1호
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• pp.18-23
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• 2005

This paper reports experimental results on microdrilling process for silicon parts used in semiconductor equipments. An experimental system was developed consisting of a high speed precision machine, microscope system, and project profile instrument. The experimental results indicate that the amount of chipping at the entrance and exit of micro hole decreases as the spindle speed increases up to 18,000 rpm. At higher spindle speed, however, the amount of chipping increases rapidly. The amount of chipping and infeed rate show proportional relationship up to 20 m/min of infeed rate. Beyond that infeed rate, however, sudden increase in the amount of chipping has occurred.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1-5
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• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.85-86
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• 2007

• 한국기계가공학회지
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• 제7권1호
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• pp.3-8
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• 2008

This paper reports some experimental results of cylindrical external grinding using CBN wheels. Many experimental studies for surface grinding have been done, but not for the cylindrical grinding due to the difficulty of grinding force measurement. In this paper a new experimental device has been proposed for the grinding force measurement in cylindrical grinding. The cylindrical grinding experiments were carried out at various grinding conditions with several CBN grinding wheels. The experimental results indicate that the CBN wheels with smaller grains result in the higher grinding forces in both SCM415 and STD11 workpieces. The grinding forces of all wheels were proportional to the infeed speeds and the difference of each wheels was prominent at high infeed speed for SCM415.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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• pp.507-512
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• 1999

In modern engineering practice, the grinding process is one of the most important and widely used operations for the precision finishing of components. In this paper, machining characteristics of external plunge grinding were investigated by using spindle motor current signal through hall sensor. Grinding experiments were performed in terms of various grinding conditions such as wheel speed, workpiece speed, infeed rate and spark-out time with conventional vitrified bonded WA wheel. The relationship between spindle motor current signal and metal removal rate in terms of infeed rate was induced the by analyzing spindle motor current signal.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.413-414
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.28-32
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• 1995

Bacause the chatter vibration is a main factor to damage on the quality and integrity, The cure is required peticurity in cykinderical plunge grinding. The chatter vibration relatied with wheel speed, workpiece and infeed rate. Therefore, we expressed more credible normal signal and chatter signal Pattern in accrdiance with wheel speed and acquired RMS signal of the accelerrometer. In thos study, after finding the chatter pattern, we applied two parameters, standard deviation and Kurtosis, to Neural Network.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.25-31
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• 2003

A computer simulation model for investigating a two-dimensional (2-D) rounding mechanism in a centerless grinding process is described. This model includes the interference phenomena and the concept of machining elasticity. Since initial contact points are used as a reference, the result of this simulation is not affected by the location of the reference circle center and the radius of the reference circle. Also, details of the machining factor are studied by using process variables (grinding wheel speed, wheel specification, workpiece speed, dressing condition, etc.). The effect of the threshold grinding force on the size of ground workpiece is investigated. For the verification of this method, simulation results are compared with the experimental work.

• 한국정밀공학회지
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• 제16권12호
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• pp.54-59
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• 1999

High precision internal plunge grinding is difficult because of the decrease in the quill stiffness due to the small diameter of wheel. In this paper, the characteristics of internal plunge grinding were investigated. Grinding experiments were performed at various grinding conditions with vitrified bonded CBN wheels. The grinding period was assumed to be consisted of rough grinding and fine grinding. The classification of grinding was determined int terms of the normal grinding forces and actual depth of cut. The experimental results indicate that the higher depth of cut and infeed speed result in the longer rough grinding time. The maximum normal grinding force was nearly equal to the static force and it decreases exponentially as the grinding continues.