• Title/Summary/Keyword: Infeed grinding

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웨이퍼 연마용 지능형 연삭시스템 개발 (Development of the intelligent grinding system for wafer grinding)

  • 김동석;최춘규;하상백;이상직
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2004년도 춘계학술대회
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    • pp.1082-1086
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    • 2004
  • In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.

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원통연삭시 연삭휠의 종류에 따른 연삭 가공특성에 관한 연구 (A Study on the Grinding Characteristics for Various Grinding Wheels in the Cylindrical Grinding)

  • 이충석;채승수;김택수;이상민;박휘근;이종찬
    • 한국기계가공학회지
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    • 제7권1호
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    • pp.3-8
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    • 2008
  • This paper reports some experimental results of cylindrical external grinding using CBN wheels. Many experimental studies for surface grinding have been done, but not for the cylindrical grinding due to the difficulty of grinding force measurement. In this paper a new experimental device has been proposed for the grinding force measurement in cylindrical grinding. The cylindrical grinding experiments were carried out at various grinding conditions with several CBN grinding wheels. The experimental results indicate that the CBN wheels with smaller grains result in the higher grinding forces in both SCM415 and STD11 workpieces. The grinding forces of all wheels were proportional to the infeed speeds and the difference of each wheels was prominent at high infeed speed for SCM415.

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구면 전용 Infeed 연삭기의 개발과 성능평가 (Develvopment of Infeed Grinding Machine and Its Effects on Spherical Surface Grinding)

  • 이상직;정해도;최헌종
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.1028-1032
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    • 1995
  • This paper describes the manufacture of spherical and aspherical surface on glass, superalloy and ceramic components. The rotationally symmetricallenses, and the ceramic or superalloy molds with spherical shapes are mainly generated by cutting processes on CNC lathe machine or 4,5 axis CNC machining centers. Recently, spherical shape parts require more precise and efficent machining technologies for wide material range such as optical lens of the lithography device in semiconductor manufacturing processes or the high precision mold machining of anti-chemical, anti-wear materials. In this paper, we introduce a newly developed infeed grinding machine with metal with metal bonded cup type wheel and its effects on spherical surface grinding.

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실리콘 웨이퍼의 고정밀 단면 연삭에 관한 연구 (A Study on Precision Infeed Grinding for the Silicon Wafer)

  • 안대균;황징연;최성주;곽창용;하상백
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1-5
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    • 2005
  • The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

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무심 연삭 공정의 3차원 형상화기구 (I) -인피드 연삭- (3-D Form Generation Mechanism in the Centerless Grinding Process (I) -Infeed Grinding-)

  • 김강;주종남
    • 한국정밀공학회지
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    • 제15권5호
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    • pp.128-136
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    • 1998
  • A mathematical model for investigating the form generation mechanism in the centerless infeed grinding process is described. For 3-D modeling of form generation, contact points are assumed to be on least squares contact lines at the grinding wheel, regulating wheel, and work-rest blade. Using force and deflection analysis, the validity of this assumption is shown. Based on the 2-D simulation model developed in the previous work and the least squares contact line assumption, a 3-D model is presented. To validate this model, simulation results were compared with the experimental works. The experiments and computer simulations were carried out using three types of cylindrical workpiece shapes with varying flat length. The experimental results agree well with the simulation. It can be seen that the effect of flat end propagated to the opposite end through workpiece reorientation.

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Modeling of the Centerless Infeed (Plunge) Grinding Process

  • Kim, Kang
    • Journal of Mechanical Science and Technology
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    • 제17권7호
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    • pp.1026-1035
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    • 2003
  • A computer simulation method for investigating the form generation mechanism in the centerless infeed (plunge) grinding process is described. For a 3-D simulation model of form generation, contact points are assumed to be on least squares contact lines at the grinding wheel, regulating wheel, and work-rest blade. Using force and deflection analyses, the validity of this assumption is shown. Based on the 2-D simulation model developed in the previous work and the least squares contact line assumption, a 3-D model is presented. To validate this model, simulation results were compared with the experimental works. The experiments and computer simulations were carried out using three types of cylindrical workpiece shapes with varying flat length. The experimental results agree well with the simulation. It can be seen that the effect of flat end propagated to the opposite end through workpiece reorientation.

주축모터전류신호를 이용한 원통 연삭시 가공 특성에 관한 연구 (A Study on the Machining characteristics in the Cylindrical Plunge Grinding using Spindle Motor Current Signal)

  • 김남훈
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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    • pp.507-512
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    • 1999
  • In modern engineering practice, the grinding process is one of the most important and widely used operations for the precision finishing of components. In this paper, machining characteristics of external plunge grinding were investigated by using spindle motor current signal through hall sensor. Grinding experiments were performed in terms of various grinding conditions such as wheel speed, workpiece speed, infeed rate and spark-out time with conventional vitrified bonded WA wheel. The relationship between spindle motor current signal and metal removal rate in terms of infeed rate was induced the by analyzing spindle motor current signal.

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내면 플런지 연삭에 있어서 연삭력 특성에 관한 연구 (A Study on the Grinding Force Characteristics in the Internal Plunge Grinding)

  • 서영일;허만승;최환;이종찬;정선환
    • 한국정밀공학회지
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    • 제16권12호
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    • pp.54-59
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    • 1999
  • High precision internal plunge grinding is difficult because of the decrease in the quill stiffness due to the small diameter of wheel. In this paper, the characteristics of internal plunge grinding were investigated. Grinding experiments were performed at various grinding conditions with vitrified bonded CBN wheels. The grinding period was assumed to be consisted of rough grinding and fine grinding. The classification of grinding was determined int terms of the normal grinding forces and actual depth of cut. The experimental results indicate that the higher depth of cut and infeed speed result in the longer rough grinding time. The maximum normal grinding force was nearly equal to the static force and it decreases exponentially as the grinding continues.

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연삭시스템의 최적연삭가공조건 (The Optimum Grinding Condition Selection of Grinding System)

  • 이석우;최영재;허남환;최헌종
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.563-564
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    • 2006
  • In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

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주속 200m/sec 영역에서의 원통플런지 연삭특성 (Characteristics of cylindrical plunge grinding in 200m/sec of grinding velocity)

  • 주종길;박규열;전종업
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.1047-1050
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    • 2002
  • In this paper, grinding characteristics of cylindrical plunge grinding in 200m/sec of grinding velocity was investigated by use of vitrified CBN wheel. From the experimental result, it was convinced that grinding power is decreased 2.5times and grinding efficiency is heightened 3times more according to increasing wheel velocity 80m/sec to 200m/sec And also, be expected to improvement of surface roughness and roundness by increasing the wheel velocity.

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