• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1082-1086
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• 2004

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of wafer. The grinding of wafer is usually used by the infeed grinding machine. The infeed grinding machine has been depended on imports. Therefore, it is necessary to develop the infeed grinding machine because the demand of the infeed grinding machine is increasing more and more. This paper describes the technologies of infeed grinding machine and intend to introduce the studies in the development of the intelligent grinding system for grinding of wafer. The air bearing spindle for the infeed grinding machine was developed by domestic technologies and the grinding part design of the intelligent grinding system for wafer grinding was completed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.1
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• pp.3-8
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• 2008

This paper reports some experimental results of cylindrical external grinding using CBN wheels. Many experimental studies for surface grinding have been done, but not for the cylindrical grinding due to the difficulty of grinding force measurement. In this paper a new experimental device has been proposed for the grinding force measurement in cylindrical grinding. The cylindrical grinding experiments were carried out at various grinding conditions with several CBN grinding wheels. The experimental results indicate that the CBN wheels with smaller grains result in the higher grinding forces in both SCM415 and STD11 workpieces. The grinding forces of all wheels were proportional to the infeed speeds and the difference of each wheels was prominent at high infeed speed for SCM415.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.1028-1032
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• 1995

This paper describes the manufacture of spherical and aspherical surface on glass, superalloy and ceramic components. The rotationally symmetricallenses, and the ceramic or superalloy molds with spherical shapes are mainly generated by cutting processes on CNC lathe machine or 4,5 axis CNC machining centers. Recently, spherical shape parts require more precise and efficent machining technologies for wide material range such as optical lens of the lithography device in semiconductor manufacturing processes or the high precision mold machining of anti-chemical, anti-wear materials. In this paper, we introduce a newly developed infeed grinding machine with metal with metal bonded cup type wheel and its effects on spherical surface grinding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1-5
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• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.128-136
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• 1998

A mathematical model for investigating the form generation mechanism in the centerless infeed grinding process is described. For 3-D modeling of form generation, contact points are assumed to be on least squares contact lines at the grinding wheel, regulating wheel, and work-rest blade. Using force and deflection analysis, the validity of this assumption is shown. Based on the 2-D simulation model developed in the previous work and the least squares contact line assumption, a 3-D model is presented. To validate this model, simulation results were compared with the experimental works. The experiments and computer simulations were carried out using three types of cylindrical workpiece shapes with varying flat length. The experimental results agree well with the simulation. It can be seen that the effect of flat end propagated to the opposite end through workpiece reorientation.

• Journal of Mechanical Science and Technology
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• v.17 no.7
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• pp.1026-1035
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• 2003

A computer simulation method for investigating the form generation mechanism in the centerless infeed (plunge) grinding process is described. For a 3-D simulation model of form generation, contact points are assumed to be on least squares contact lines at the grinding wheel, regulating wheel, and work-rest blade. Using force and deflection analyses, the validity of this assumption is shown. Based on the 2-D simulation model developed in the previous work and the least squares contact line assumption, a 3-D model is presented. To validate this model, simulation results were compared with the experimental works. The experiments and computer simulations were carried out using three types of cylindrical workpiece shapes with varying flat length. The experimental results agree well with the simulation. It can be seen that the effect of flat end propagated to the opposite end through workpiece reorientation.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.507-512
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• 1999

In modern engineering practice, the grinding process is one of the most important and widely used operations for the precision finishing of components. In this paper, machining characteristics of external plunge grinding were investigated by using spindle motor current signal through hall sensor. Grinding experiments were performed in terms of various grinding conditions such as wheel speed, workpiece speed, infeed rate and spark-out time with conventional vitrified bonded WA wheel. The relationship between spindle motor current signal and metal removal rate in terms of infeed rate was induced the by analyzing spindle motor current signal.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.12
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• pp.54-59
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• 1999

High precision internal plunge grinding is difficult because of the decrease in the quill stiffness due to the small diameter of wheel. In this paper, the characteristics of internal plunge grinding were investigated. Grinding experiments were performed at various grinding conditions with vitrified bonded CBN wheels. The grinding period was assumed to be consisted of rough grinding and fine grinding. The classification of grinding was determined int terms of the normal grinding forces and actual depth of cut. The experimental results indicate that the higher depth of cut and infeed speed result in the longer rough grinding time. The maximum normal grinding force was nearly equal to the static force and it decreases exponentially as the grinding continues.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.1047-1050
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• 2002

In this paper, grinding characteristics of cylindrical plunge grinding in 200m/sec of grinding velocity was investigated by use of vitrified CBN wheel. From the experimental result, it was convinced that grinding power is decreased 2.5times and grinding efficiency is heightened 3times more according to increasing wheel velocity 80m/sec to 200m/sec And also, be expected to improvement of surface roughness and roundness by increasing the wheel velocity.