• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.227-228
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.167-168
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• 2010

• Journal of the Korean Society for Precision Engineering
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• v.32 no.1
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• pp.63-68
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• 2015

Micro/nano patterns for optical concentration and diffusion have been studied in the various fields such as displays, optics, and sensors. Conventional micro patterns were continuous and linear shapes due to using linear-type light sources, however, recently non-continuous patterns have been applied as point sources are used for dot-type light sources such as LEDs and OLEDs. In this study, a hybrid machining technology combining an indentation machining method and an AAO process was developed for manufacturing the non-continuous micro patterns having nano patterns. First, mirror-like surfaces ($R_a<20nm$) of pure Aluminum substrates were obtained by optimizing cutting conditions. Then, The letter of 'K' consisting of the arrays of the micro patterns was manufactured by the indentation machining method which has a similar principle to indentation hardness testing. Finally, nano patterns were machined by AAO process on the micro patterns. Conclusively, a specific letter having nano-micro hybrid patterns was manufactured in this study.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.42-50
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• 2005

This paper presents an ultra precision machining system using a high sensitive force sensing module to measure machining forces and penetration displacement in a tip-based nanopatterning. The force sensing module utilizes a leaf spring mechanism and a capacitive displacement sensor and it has been designed to provide a measuring range from 80 ${\mu}N$ to 8 N. This force sensing module is mounted on a PZT driven in-feed motion stage with 1 nm resolution. The sample can be moved by X-Y scanning motion stage with 5 nm resolution. In nano indentation experiments and patterning experiments, the machining forces were controlled and monitored by the force sensing module. Then, the patterned samples were measured by AFM. Experimental results demonstrated that the developed system can be used as an effective device in nano indentation and nanopatterning operation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.1-6
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• 2018

Recently nano meter size pattern (sub-micro scale) can be machined mechanically using a diamond tool. Many studies have found a 'size effect' which referred to a specific cutting energy increase with the decrease in the uncut chip thickness at micro scale machining. A new analysis method was suggested in order to observe 'size effect' in nano scale machining and to verify the cause of the 'size effect' in this study. The diamond tool was indented to a vertical depth of 1,000nm depth in order to simplify the stress state and the normal force was measured continuously. The tip rounding was measured quantitatively by AFM. Based on the measurements and theoretical analysis, it was verified that the main cause of the 'size effect' in nano scale machining is geometrically necessary dislocations, one of the intrinsic material characteristics. st before tool failure.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.9
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• pp.135-141
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• 2003

MEMS structures generally have been fabricated using surface-machining method, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to the residual stress inducing by the applied the various loads. And the very important physical property in the heated environment is the linear coefficient of thermal expansion. Therefore this paper studied the residual stress caused the thermal loads in the thin film and introduced the simple method to measure the trend of the residual stress by the indentation. Specimens were made of materials such as Al, Au and Cu and thermal load was applied repeatedly. The residual stress was measured by nano-indentation using AFM and FEA. The existence of the residual stress due to thermal load was verified by the experimental results. The indentation length of the thermal loaded specimens increased minimum 11.8％ comparing with the virgin thin film caused by tensile residual stress. The finite element analysis results are similar to indentation test.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.05a
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• pp.51-55
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• 1999

Recently, manufacturing work has been transformed to advanced technology intensive form from mass production with a little items required in the past. It was demanded that superior workpiece surface integrity. However, the study of ductile mode machining was proceeded actively.In this paper, it is developed Ultra-Micro Indentation Device using the PZT actuator. Experimentally, by using theUltra-Micro Indentation device, the micro fracture behavior of the silicon wafer was invesgated. It was possible that ductile-brittle transition point in ultimate surface of brittle material can be detected by adding an acoustic emission sensor system to the Ultra-Micro Indentation apparatus.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.6
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• pp.1-6
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• 2010

Patterned optical components are widely used for optical products such as LCD and lighting. Since CCFL was used as a light source in the products, prism films having linear continuous optical patterns were widely used. However, LED which is a dot light source is popular recently, therefore, the optical products need new optical components having non-continuous optical patterns. Indentation machining method is a powerful method for machining of non-continuous pattern. When a copper mold and a brass mold were machined by this method, severe plastic deformation called pile-up was observed around the patterns. Since pile-up has negative relationship to ductility, this deformation can be eliminated by annealing treatment which makes the materials ductile. No plastic deformation occurred when machined after annealing at $600{^{\circ}C}$ and $575{^{\circ}C}$ for copper and brass, respectively. Finally, non-continuous optical patterns with high quality were machined on a copper mold and a brass mold successively.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.2
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• pp.198-202
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• 2015

We present a series of simple but novel nanopatterning methodologies inspired by traditional mechanical machining processes involving rolling, pullout, and forging. First, we introduce roll-to-roll nanopatterning, which adapts conventional rolling for continuous nanopatterning. Then, nano-inscribing and nano-channel lithography are demonstrated, whereby seamless nanogratings can be continuously pulled out, as in a pullout process. Finally, we discuss vibrational indentation micro- and nanopatterning. Similarly to the forging/indentation process, this technique employs high-frequency vertical vibration to indent periodic micro/nanogratings onto a horizontally fed substrate. We discuss the basic principles of each process, along with its advantages, disadvantages, and potential applications. Adopting mature and reliable traditional technologies for small-scale machining may allow continuous nanopatterning techniques to cope with scalable and low-cost nanomanufacturing in a more productive and trustworthy way.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.820-823
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• 2002

MEMS structures Generally have been fabricated using surface-machining, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to difference of linear coefficient of thermal expansion. Therefore this paper studied the effect of the residual stress caused by variable external loads. This study did not analyzed accurate quantity of the residual stress but trend for the effect of residual stress. Several specimens were fabricated using other material(Al, Au and Cu) and thermal load was applied. The residual stress was measured by nano-indentation using AFM. The results showed the existence of the residual stress due to thermal load. The indentation area of the thermal loaded thin film reduced about 3.5% comparing with the virgin thin film caused by residual stress. The finite element analysis results are similar to indentation test.