• 한국발생생물학회:학술대회논문집
• /
• 한국발생생물학회 2005년도 제5회 발생공학 국제심포지엄 및 학술대회
• /
• pp.130-130
• /
• 2005

• 마이크로전자및패키징학회지
• /
• 제23권4호
• /
• pp.43-48
• /
• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• 한국발생생물학회:학술대회논문집
• /
• 한국발생생물학회 2005년도 제5회 발생공학 국제심포지엄 및 학술대회
• /
• pp.131-131
• /
• 2005

• 한국수정란이식학회:학술대회논문집
• /
• 한국수정란이식학회 2005년도 제5회 발생공학 국제심포지엄 및 학술대회
• /
• pp.131-131
• /
• 2005

• Journal of Microbiology and Biotechnology
• /
• 제2권4호
• /
• pp.243-247
• /
• 1992

The thr operon of Escherichia coli TF427, an $\alpha$-amino-$\beta$-hydroxyvaleric acid (AHV)-resistant threonine overproducer, was cloned in a pBluescriptII $KS^＋$ plasmid by complementation of E. coli mutants. All clones contained a common 8.8 kb HindIII-generated DNA fragment and complemented the thrA, thrB, and thrC mutants by showing that these clones contained the whole thr operon. This thr operon was subcloned in the plasmid vectors pBR322, pUC18, and pECCG117, an E. coli/Corynebacterium glutamicum shuttle vector, to form recombinant plasmids pBTF11, pUTF25 and pGTF18, respectively. The subcloned thr operon was shown to be present in a 6.0 kb insert. A transformant of E. coli TF125 with pBTF11 showed an 8~11 fold higher aspartokinase I activity, and 15~20 fold higher L-threonine production than TF125, an AHV-sensitive methionine auxotroph. Also, it was found that the aspartokinase I activity of E. coli TF125 harboring pBTF11 was not inhibited by threonine and its synthesis was not repressed by threonine plus isoleucine.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
• /
• pp.127-133
• /
• 2001

솔더볼의 피로강도에 대한 솔더 조성의 영향을 조사하기 위하여 패키지 신뢰성 시험을 실시하였다. 공정조성 솔더, S $n_{62}$P $b_{36}$A $g_2$, S $n_{63}$P $b_{34.5}$A $g_2$S $b_{0.5}$ 솔더를 사용해 제조된 시편을 MRT Lv 2a 조건에서 전처리 후 TC 시험을 수행하였다. 제조 직후, 전처리 후, TC 후 각각에 대하여 전단강도를 측정하였으며, 미세 조직 사진을 얻었다. 또한, SEM과 EDX를 이용하여 파괴 기구에 대한 분석을 실시하였으며, 신뢰성 시험 후 전단강도의 저하에 대하여 논의하였다.다.

• Genomics & Informatics
• /
• 제8권1호
• /
• pp.19-27
• /
• 2010

To discover genetic markers for autism spectrum disorder (ASD), we previously applied genome-wide BAC array comparative genomic hybridization (array-CGH) to 28 autistic patients and 62 normal controls in Korean population, and identified that chromosomal losses on 8p23.1 and on 17p11.2 are significantly associated with autism. In this study, we developed an 8.5K ASD-specific BAC array covering 27 previously reported ASD-associated CNV loci including ours and examined whether the associations would be replicated in 8 ASD patient cell lines of four different ethnic groups and 10 Korean normal controls. As a result, a CNV-loss on 8p23.1 was found to be significantly more frequent in patients regardless of ethnicity (p<0.0001). This CNV region contains two coding genes, DEFA1 and DEFA3, which are members of DEFENSIN gene family. Two other CNVs on 17p11.2 and Xp22.31 were also distributed differently between ASDs and controls, but not significant (p=0.069 and 0.092, respectively). All the other loci did not show significant association. When these evidences are considered, the association between ASD and CNV of DEFENSIN gene seems worthy of further exploration to elucidate the pathogenesis of ASD. Validation studies with a larger sample size will be required to verify its biological implication.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
• /
• pp.109-112
• /
• 2007

In this paper we describe a robust method of improving precision in monitoring high energy ion implantation processes. Ion implant energy accuracy was measured in the device manufacturing process using an unpatterned implanted layer on an intrinsic p-type silicon wafer. To increase Rs sensitivity to energy at the well implant process, a PN junction structure was formed by P-well and deep N-well implants into the p-type Si wafer. It was observed that the depletion layer formed by the PN junction was very sensitive to energy variation of the well implant. Conclusively, it can be recommended to monitor well implant processes using the Rs measurement method described herein, i.e., a PN junction diode structure since it shows excellent Rs sensitivity to variation caused by energy difference at the well implant step.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
• /
• 제51권3호
• /
• pp.133-141
• /
• 2002

Most maximum power point tracking(MPPT) control algorithm is based on Perturb and Observe(P&O) and Incremental Conductance(IncCond). In comparison with P&O and IncCond algorithm, the dynamic and tracking characteristic of IncCond algorithm is better than P&O algorithm in condition of rapidly changing solar radiation. But in the case of digital implementation, the InCond algorithm has error en decision of maximum power operation point(MPOP). To solve this problem, this paper proposes a improved IncCond algorithm, which can determine the MPOP correctly by inserting the test signal in control input. This paper proposes a novel MPPT control algorithm for the digitally implemented photovoltaic system in condition of rapidly changing solar radiation. To verify the validity of the proposed control algorithm. the computer simulation and experiment are carried out.

• 마이크로전자및패키징학회지
• /
• 제24권4호
• /
• pp.91-95
• /
• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.