• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.3
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• pp.133-138
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• 2017

We evaluated the structural, electrical and optical properties of tungsten (W)-doped $Ge_8Sb_2Te_{11}$ thin films. In a previous work, GeSbTe alloys were doped with different materials in an attempt to improve thermal stability. 200 mm thick $Ge_8Sb_2Te_{11}$ and W-doped $Ge_8Sb_2Te_{11}$ films were deposited on p-type Si (100) and glass substrates using a magnetron co-sputtering system at room temperature. The fabricated films were annealed in a furnace in the $0{\sim}400^{\circ}C$ temperature range. The structural properties were analyzed using X-ray diffraction (X'pert PRO, Phillips). The results showed increased crystallization temperature ($T_c$) leading to thermal stability in the amorphous state. The optical properties were analyzed using an UV-Vis-IR spectrophotometer (Shimadzu, U-3501, range : 300~3,000 nm). The results showed an increase in the crystalline material optical energy band gap ($E_{op}$) and an increase in the $E_{op}$ difference (${\Delta}E_{op}$). This is a good effect to reduce memory device noise. The electrical properties were analyzed using a 4-point probe (CNT-series). This showed increased sheet resistance ($R_s$), which reduces programming current in the memory device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.229-230
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• 2008

본 논문에서는 비정질-결정질간 가역적 상변화 기록 매질로 이용되고 있는 $(Ag_{5.5}In_{6.5}Sb_{59}Te_{29})$ 합금 박막의 Ag 조성 증가에 따른 원자구조와 상변화 특성간의 상관관계를 연구하였다. 실험에 사용된 AgInSbTe 조성은 5N의 금속 파우더를 용융-냉각법으로 벌크를 제작하였고 열증착 방법으로 Si (100) 및 유리(corning glass, 7059) 기판위에 200 nm 두께로 박막을 증착하였다. 비정질 박막의 결정화속도를 평가하기 위해서 658 nm의 LD가 장착된 나노-펄스 스캐너를 이용하여 power; 1~17mW, pulse duration; 10~460 ns의 범위에서 각 조성의 상변화에 따른 반사도 차이를 측정, 비교 분석하였다. 또한 각각의 박막을 $100^{\circ}C$ 에서 $300^{\circ}C$까지 $50^{\circ}C$ 간격으로 $N_2$ 분위기에서 1시간동안 열처리 한 후 XRD와 UV-Vis-NIR spectrophotometer를 사용하여 각 상의 구조분석 및 광학적 특성을 분석하였으며, 4-point probe로 면저항을 측정하였다.

• Bulletin of the Korean Chemical Society
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• v.34 no.7
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• pp.2167-2170
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• 2013

A low-cost and simple recycling process of waste thermoelectric modules has been investigated using chemical reduction methods. The recycling is separated by two processes, such as dissolving and reduction. When the waste thermoelectric chips are immersed into a high concentration of $HNO_3$ aqueous solution at $100^{\circ}C$, oxide powders, e.g., $TeO_2$ and $Sb_2O_3$, are precipitated in the $Bi^{3+}$ and $HTeO{_2}^+$ ions contained solution. By employing a reduction process with the ions contained solutions, $Bi_2Te_3$ nanoparticles are successfully synthesized. Due to high reduction potential of $HTeO{_2}^+$ to Te, Te elements are initially formed and subsequently $Bi_2Te_3$ nanoparticles are formed. The average particle size of $Bi_2Te_3$ was calculated to be 25 nm with homogeneous size distribution. On the other hand, when the precipitated powders reduced by hydrazine, $Sb_2O_3$ and Te nanoparticles are synthesized because of higher reduction potentials of $TeO_2$ to Te. After the washing step, the $Sb_2O_3$ are clearly removed, results in Te nanoparticles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.69-69
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• 2009

In other to progress better crystallization transition and long phase-transformation data of phase-change memory (PRAM), we investigated about the effect of Sb doping and Ag ions percolating into Ge-Se-Te phase-change material. Doped Sb concentrations was determined each of 10 wt%, 20 wt% and 30 wt%. As the Sb-doping concentration was increased, the resistivity decreased and the crystallization temperature increased. Ionization of Ag was progressed by DPSS laser (532 nm) for 1 hour. The resistivity was more decreased and the crystallization temperature was more increased in case of adding Ag layer under Sh-(Ge-Se-Te) thin film. At the every condition of thin films included Ag layer more stable states were indicated compare with just Sh-doped Ge-Se-Te thin films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.203-204
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• 2005

PRAM (Phase change Random Access Memory) is one of the most promising candidates for next generation Non-volatile Memories. The Phase change material has been researched in the field of optical data storage media. Among the phase change materials $Ge_2Sb_2Te_5$(GST) is very well known for its high optical contrast in the state of amorphous and crystalline. However, the characteristics required in solid state memory are quite different from optical ones. In this study, the structural properties of GST thin films with composition were investigated for PRAM. The 100-nm thick GeTe and $Sb_2Te_3$ films were deposited on $SiO_2$/Si substrates by RF sputtering system. In order to characterize the crystal structure and morphology of these films, we performed x-ray diffraction (XRD) and atomic force microscopy (AFM).

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.3
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• pp.146-152
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• 2011

Thermal stability of $Ge_2Sb_2Te_5$ (GST) and $SiO_2$ doped GST (SGST) films for phase change random access memory applications was investigated by observing the change of surface roughness, layer density and composition of both films after isothermal annealing. After both GST and SGST films were annealed at $325^{\circ}C$ for 20 min, root mean square (RMS) surface roughness of GST was increased from 1.9 to 35.9 nm but that of SGST was almost unchanged. Layer density of GST also steeply decreased from 72.48 to 68.98 $g/cm^2$ and composition was largely varied from Ge : Sb : Te = 22.3 : 22.1 : 55.6 to 24.2 : 22.7 : 53.1, while those of SGST were almost unchanged. It was confirmed that the addition of a small amount of $SiO_2$ into GST film restricted the deterioration of physical and chemical properties of GST film, resulting in the better thermal stability after isothermal annealing.

• Journal of the Korean Vacuum Society
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• v.15 no.2
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• pp.180-185
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• 2006

Microwatt power level at relatively high voltage(order of volt) was produced by $Bi_{0.5}Sb_{1.5}Te_{3}/Bi_{2}Te_{2.4}Se_{0.6}$ thin film thermoelectric generators, and maximum output power varied with temperature difference in the square-law relation. Output voltage and current were possible to control by changing the way of electrical connection as well as the number of stacking plate-modules. Variation of open circuit voltage and short circuit current with temperature difference showed a linear relationship. There were, however, some differences in variations; open circuit voltage were dependent on the number of plate-module when connected in series, but it was not for parallel connection. On the other hand, short circuit current showed the opposite behavior to the case of open circuit current.

• Korean Journal of Materials Research
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• v.6 no.7
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• pp.678-683
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• 1996

In the fabrication processes of thin film thermoelectrics, a subsequent annealing treatment is inevitable to reduce the defects and residual stresses introduced during the film growth, and to make the uniform carrier concentration of the film. However, the diffusion-induced atomic redistribution and the broadening of p/n junction region are expected to affect the thermoelectric properties of thin film modules. The present study intends to investigate the diffusion at the p/n junctions of thermoelectric thin films and to relate it to the property changes. The film junctions of p-type(Bi0.5Sb1.5Te3)and n-type(Bi2Te2.4Se0.6)were prepared by the flash evaporation method. Aluminum thin layer was employed as a diffusion barrier between p-and n-type films of the junction. This was found to be an effective barrier by showing a negligible diffusion into both type films. After annealing treatment, the thermoelectric properties of p/n couples with aluminum barrier layer were accordingly retained their properties without any deterioration.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.305-306
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• 2008

본 논문에서는 PRAM 에서 기록매질로 이용될 수 있는 최적의 물질을 찾고자 $Ge_2Sb_2Te_5$ 박막에 Al을 첨가하여 비정질-결정질 천이시의 원자구조와 상변화 특성간의 관계를 연구하였다. 이 실험에 사용된 $Al_x(Ge_2Sb_2Te_5)_{1-x}$ 조성은 5N의 금속 파우더를 용융-냉각법으로 벌크를 제작하였고 열증착 방법으로 Si (100) 및 유리 (corning glass, 7059) 기판위에 200nm 두께로 박막을 증착하였다. 비정질 박막의 상변화에 따른 반사도 차이를 평가하기 위해서 658 nm의 LD가 장착된 나노펄스 스캐너를 이용하여 power; 1~17mW, pulse duration; 10~460 ns의 범위에서 각 조성의 비정질-결정질 상변화속도를 측정, 비교 분석하였다. 또한 각각의 박막을 $100^{\circ}C$ 에서 $400^{\circ}C$ 까지 $50^{\circ}C$ 간격으로 $N_2$ 분위기에서 1시간동안 열처리 한 후 XRD와 UV-Vis-NIR spectrophotometer를 사용하여 각 상의 구조분석 및 광학적 특성을 분석하였다. 또한 4-point probe로 면저항을 측정하였다.

• Korean Journal of Materials Research
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• v.14 no.1
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• pp.41-45
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• 2004

P-type $Bi_{0.5}$$Sb_{1.5}$ $Te_3$ thin films were deposited by the flash evaporation technique, and their thermoelectric properties and electronic transport parameters were investigated. The effective mean free path model was adopted to examine the thickness effect on the thermoelectric properties. Annealing effects on the carrier concentration and mobility were also studied, and their variations were analyzed in conjunction with the antisite defects. Seebeck coefficient and electrical resistivity versus inverse thickness showed a linear relationship, and the effective mean free path was found to be 3150$\AA$. No phase transformation and composition change were observed after annealing treatment, but carrier mobility increased due to grain growth. Carrier concentration decreased considerably due to reduction of the antisite defects, so that electrical conductivity decreased and Seebeck coefficient increased. When annealed at 473 K for 1 hr, Seebeck coefficient and electrical conductivity were $160\mu$V/K and 610 $W^{-1}$ $cm^{ -1}$, respectively. Therefore, the thermoelectric quality factor were also enhanced to be $16\mu$W/cm $K^2$.>.