• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.33-36
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• 1996

AIN thin films were prepared using by Rf sputtering method on the GaAs(170) substrate and investigated by X-ray diffractometer, IR spectroscopy, n&k system. The parameters were the substrate temperature, RF power, sputtering duration and the $N_2$/Ar ratio. The AlN thin films of (101) orientation were obtained under the conditions of room temperature and the nitrogen of 60 vol.%. The crystallinity of the films, which were grown respectively under the different conditions, were determined by the comparison of the band width of an E$_1$[TO:680$cm^{-1}$ /] phonon mode. The thicknesses of AlN films were decreased dramatically in the region of the nitrogen of 40~60 vol.% according to the increment of the $N_2$/Ar ratio by which the sputter yield got lower.

• Journal of the Optical Society of Korea
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• 제12권2호
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• pp.65-68
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• 2008

The miniband structure of a quantum dot lattice based on GaN/AlN nanowire arrays has been investigated using the finite element method and Floquet theorem. The quantum dot modes and the quantum wire modes in the nanowire arrays were graphically verified. The optimum geometries of GaN/AlN quantum wire arrays were investigated by using a correlation between the width of nanowires and the separation of the minibandgap which is to be larger than the thermal energy at room temperature.

• ETRI Journal
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• 제28권6호
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• pp.787-789
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• 2006

In this letter, we report that vertically well-aligned ZnO nanowires were grown on GaN epilayers and c-plane sapphire via a vapor-liquid-solid process by introducing a 3 nm Au thin film as a catalyst. In our experiments, epitaxially grown ZnO nanowires on Au-coated GaN were vertically well-aligned, while nanowires normally tilted from the surface when grown on Au-coated c-$Al_2O_3$ substrates. However, pre-growth annealing of the Au thin layer on c-$Al_2O_3$ resulted in the growth of well-aligned nanowires in a normal surface direction. High-resolution transmission electron microscopy measurements showed that the grown nanowires have a hexagonal c-axis orientation with a single-crystalline structure.

• 한국결정성장학회지
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• 제29권3호
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• pp.83-90
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• 2019

본 논문에서는 전력 반도체 소자용 Mg-doped AlN 에피층을 혼합 소스 수소화물 기상 에피택시 방법에 의해 성장하였다. p형 재료로는 Mg을 사용하였다. 소자응용을 위한 기초 기판으로서 역할을 하기 위하여 GaN 에피층이 성장된 기판과 GaN 에피층이 성장되어 패턴이 형성된 사파이어 기판 위에 Mg-doped AlN 에피층을 선택 성장하였다. Mg-doped AlN 에피층의 표면과 결정 구조는 FE-SEM 및 HR-XRD에 의해 조사하였다. XPS 스펙트럼과 라만 스펙트럼 결과로부터 혼합소스 HVPE 방법에 의해 성장된 Mg-doped AlN 에피층은 전력소자 등에 응용이 가능할 것으로 판단된다.

• 한국결정성장학회지
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• 제11권3호
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• pp.102-105
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• 2001

A parametric cmpariosn of etch rate and etch selectivity has been performed for GaN, InN and AIN etched in chlorine- and boron halides-based Inductively Coupled Plasma (ICP) discharges. Chlorine-based chemistries produced controllable etch rates (50~150 nm/min) and maximum etch selectivities ~6 for InN over GaN and ~10 for InN over AlN. Maximum etch selectivities of ~100 for InN over GaN and InN over AlN were obtained in boron halides-based discharges and smooth etched surface morphologies were also achieved.

• 한국재료학회지
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• 제12권6호
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• pp.431-435
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• 2002

The dark current and photocurrent(PC) spectrum of Mg-doped GaN thin film were investigated with various bias voltages and temperatures. At high temperature and small bias, the dark current is dominated by holes thermally activated from an acceptor level Al located at about 0.16 eV above the valence band maximum $(E_v)$, The PC peak originates from the electron transition from deep level A2 located at about 0.34 eV above the $E_v$ to the conduction band minimum $(E_ C)$. However, at a large bias voltage, holes thermally activated from A2 to Al experience the field-in-duces tunneling to form one-dimensional defect band at Al, which determines the dark current. The PC peak associated with the transition from Al to $E_ C$ is also observed at large bias voltages owing to the extended recombination lifetime of holes by the tunneling. In the near infrared region, a strong PC peak at 1.20 eV appears due to the hole transition from deep donor/acceptor level to the valence band.

• 전자통신동향분석
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• 제37권5호
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• pp.11-21
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• 2022

GaN (Gallium-Nitride) is a promising candidate material in various radio frequency applications due to its inherent properties including wide bandgap, high carrier concentration, and high electron mobility/saturation velocity. Notably, AlGaN/GaN heterostructure field effect transistor exhibits high operating voltage and high power-density/power at high frequency. In next-generation radar systems, GaN power transistors and monolithic microwave integrated circuits (MMICs) are significant components of transmitting and receiving modules. In this paper, we introduce technological trends for C-/X-/Ku-band GaN MMICs including power amplifiers, low noise amplifiers and switch MMICs, focusing on the status of GaN MMIC fabrication technology and GaN foundry service. Additionally, we review the research for the localization of C-/X-/Ku-band GaN MMICs using in-house GaN transistor and MMIC fabrication technology. We also discuss the results of C-/X-/Ku-band GaN MMICs developed at Defense Materials and Components Convergence Research Department in ETRI.

• 전기전자학회논문지
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• 제11권4호
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• pp.272-278
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• 2007

본 논문에서는 최근 고출력 및 고온 분야의 반도체 분야에 널리 이용되고 있는 AlGaN/GaN 고 전자 이동도 트랜지스터 (High Electron Mobility Transistor, HEMT) 에 대해 DC (direct current) 특성과 열 특성을 기판을 달리하며 시뮬레이션을 수행하였다. 일반적으로 HEMT 소자의 전자 이동도 및 열전도 특성은 기판의 영향이 그 특성을 크게 좌우한다. 이러한 문제점으로 인해 GaN 기반의 HEMT 소자의 기판에 대한 연구가 활발히 진행되고 있다. 따라서, 일반적인 Drift-Diffusion 모델과 열 모델을 이용하여 Si, sapphire, SiC (silicon carbide)으로 각각 기판을 변화시키며 시뮬레이션을 하였다. 열 모델 시뮬레이션은 온도를 각각 300, 400, 500K로 변화시키며 그 결과를 비교, 해석 하였다. 전류-전압 (I-V) 특성을 T= 300 K, $V_{GS}$=1 V의 조건에서 시뮬레이션 한 결과, 드레인 포화전류 ($I_{D,max}$)의 값과 sapphire 기판은 189 mA/mm, SiC 기판은 293 mA/mm, Si 기판은 258 mA/mm 를 나타내었다. 또한 T= 500 K에서 최대 전달컨덕턴스($G_{m,max}$)는 각각 38, 50, 31 mS/mm 를 나타내었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.183-184
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• 2013

Two main MBE growth techniques have been used: plasma-assisted MBE (PA-MBE), which utilizes a rf plasma to supply active nitrogen, and ammonia MBE, in which nitrogen is supplied by pyrolysis of NH3 on the sample surface during growth. PA-MBE is typically performed under metal-rich growth conditions, which results in the formation of gallium droplets on the sample surface and a narrow range of conditions for optimal growth. In contrast, high-quality GaN films can be grown by ammonia MBE under an excess nitrogen flux, which in principle should result in improved device uniformity due to the elimination of droplets and wider range of stable growth conditions. A drawback of ammonia MBE, on the other hand, is a serious memory effect of NH3 condensed on the cryo-panels and the vicinity of heaters, which ruins the control of critical growth stages, i.e. the native oxide desorption and the surface reconstruction, and the accurate control of V/III ratio, especially in the initial stage of seed layer growth. In this paper, we demonstrate that the reliable and reproducible growth of GaN on Si (110) substrates is successfully achieved by combining two MBE growth technologies using rf plasma and ammonia and setting a proper growth protocol. Samples were grown in a MBE system equipped with both a nitrogen rf plasma source (SVT) and an ammonia source. The ammonia gas purity was ＞99.9999% and further purified by using a getter filter. The custom-made injector designed to focus the ammonia flux onto the substrate was used for the gas delivery, while aluminum and gallium were provided via conventional effusion cells. The growth sequence to minimize the residual ammonia and subsequent memory effects is the following: (1) Native oxides are desorbed at $750^{\circ}C$ (Fig. (a) for [$1^-10$] and [001] azimuth) (2) 40 nm thick AlN is first grown using nitrogen rf plasma source at $900^{\circ}C$ nder the optimized condition to maintain the layer by layer growth of AlN buffer layer and slightly Al-rich condition. (Fig. (b)) (3) After switching to ammonia source, GaN growth is initiated with different V/III ratio and temperature conditions. A streaky RHEED pattern with an appearance of a weak ($2{\times}2$) reconstruction characteristic of Ga-polarity is observed all along the growth of subsequent GaN layer under optimized conditions. (Fig. (c)) The structural properties as well as dislocation densities as a function of growth conditions have been investigated using symmetrical and asymmetrical x-ray rocking curves. The electrical characteristics as a function of buffer and GaN layer growth conditions as well as the growth sequence will be also discussed. Figure: (a) RHEED pattern after oxide desorption (b) after 40 nm thick AlN growth using nitrogen rf plasma source and (c) after 600 nm thick GaN growth using ammonia source for (upper) [110] and (lower) [001] azimuth.

• 한국정보통신학회논문지
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• 제24권10호
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• pp.1306-1311
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• 2020

본 연구에서는 Ni cluster를 이용하여 제작된 나노 구조체를 반사방지막으로 활용하여 비가시광 UV 광통신용 신호 수신단에 적용 가능한 AlGaN 광다이오드의 성능을 개선하는 구조를 제안하였다. 반사방지막의 제작은 SiO2 위에 Ni cluster를 형성한 후 SiO2를 부분적으로 식각하는 방식으로 제조하였다. 반사방지막이 적용된 샘플은 반사방지막이 없는 구조의 샘플에 비해 상대적으로 작아진 반사도를 보였으며 나노구조체가 없는 SiO2 가 증착된 구조에 비해서 입사 광파장의 변화에 대해 균일한 반사도를 보였다. 최종적으로 2 nm 두께의 Ni 층을 열처리하여 제작된 Ni cluster를 이용한 반사방지막을 적용하여 UV 광다이오드를 제작하였고, 그 결과 SiO2 단일막을 가진 센서에 비해 240 nm에서 270 nm 파장영역에서 개선된 광반응도를 보였다.