• Journal of the Korean Society for Nondestructive Testing
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• v.13 no.2
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• pp.20-30
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• 1993

Electric Speckle Pattern Interferometry (ESPI) using a CW-laser, a video system and an image processor was applied to the thermal coefficient measurements on free thermal expansions at high temperatures : ESPI provides the distribution of in-plane displacement resolved in a preselected direction. ESPI retains the merits of little or no surface preparation, no contact with the surface and the real-time presentation of interference fringes. Appling ESPI at high temperatures, several problem which caused the reduction of fringe visibility were encountered. The problem on the turbulence in the hot air surrounding high temperature objects will be solved by using a vacuum chamber. The background radiations from the objects were suppressed considerably by an interference filter. The problem on the oxidation of the object surface could't be solved. The interference fringe, whose spacings were calculated by FFT to avoid human error, were observable up to $800^{\circ}C$. The results measured by ESPI were nearly equal to the data which have already been published, up to about $800^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.267-272
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• 1993

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interferometry (ESPI) method, in measuring two-dimensional in-plane displacement. The anyalysis result of measurement by ESPI is quite comparable to that of measurement by strain gauge method. This implieds that the method of ESPI is a very effective tool in non-contact two-dimensional in-planc strain analysis. But there is a controversal point,measurment error. This error is discussed to be affected not by ESPI method itseif, but by its analysis scheme of the interference fringe,where the first-order interpolation has been applied to the points of strain measured. In this case, it is turned out that the more errors would be occured in the large interval of fringe. so, this paper describes a computer method for drawing when the height is available only for some arbitary collection of points, the method is based on a distance-weighted, least-squares approximation technique, with the weight varying with the distance of the data points.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.34-41
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• 2001

More accurate and fast inspection method for mechanical parts and structure is required to guarantee the safety. Conventional methods using compliance method, eddy current method, ultrasonic wave, acoustic emission for non-destructive testing in mechanical parts and structure have been performed as the method of contact with objects to be inspected. With this reason these methods have been taken relatively much time, money, and manpower. In this study, in order to overcome these shortcomings, we used In-plane Electronic Speckle pattern Interferometry(In-plane ESPI) that was full-field measurement and noncontact method. We detected the cracks of the specimen at a real time and measured the length of the crack by using In-place ESPI system. Finally, we compared this results with conventional microscope method.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.6
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• pp.643-648
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• 2002

In this study, shearography and ESPI have been used for quantitative analysis of an inside crack of pipeline and both of them appeared suitable to qualitatively detect inside crack. However, shearography needs several effective factors including the amount of shearing, shearing direction and induced load for the quantitative evaluation of the inside crack. In this study, the factors were optimized for the quantitative analysis and the site of cracks has been determined. Although the effective factors in shearography has been optimized, it is difficult to determine the factors exactly because they are related to the details of tracks. On the other hand, ESPI is independent on the details of a crack and only the induced load plays an important role. The out-of-plane displacement was measured under the optimized load and the measured were numerically differentiated, which resulted in an equivalent to the shearogram. The size of cracks can be determined quantitatively without any detail of a crack.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.1
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• pp.23-26
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• 2000

In spot welded joint. Electronic Speckle Pattern Interferometry(ESPI) method using the Model 95 Ar laser a video system and an image processor was applied to measure the stress Unlike traditional strain gauges or Moire method, ESPI method has no special surface preparation or attachments and can be measured in-plane displacement with non-contact and real time. In this experiment, specimens are loaded in parallel with a load cell. The specimens are made of the cold rolled steel sheet with 1mm thickness, are attached strain. gauges. This study Provides an example of how ESPI has been used to measure stress and strain inspecimen. The results measured by ESPI are compared with the data which was measured by strain gauge method under tensile testing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.377-383
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• 1996

Recently, a new technique called Electronic Speckle Pattern Inteferometry(ESPI) has been developed to overcome the drawbacks of existing holography. This technique enable real-time interference fringes to be displayed directly on TV monitor without recourse to any form of photographic processing. This research was carried out for the purpose of applying the vibration analysis method employing Electronic Speckle Pattern Interference technique to the vibration analysis of uniform rectangular cantilever plate, The natural vibration frequencies found by ESPI were in fair agreement with theoretical eigen frequencies acquired using theoretical formula G. B. Warburton proposed.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.516-521
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• 2000

Most of studies, using ESPI method, have handled tension, thermal and vibration analysis, and is limited to isotropic materials. However, tension and vibration simultaneously are loaded in real structure. Also, almost study using ESPI method is locally limited to the analysis on the isotropic materials and a few studies on the anisotropic materials have reported. Existing methods, such as the accelerometer method and FEA method, to analyze vibration have some disadvantages. Using the accelerometer method that is generally used to analyze vibration phenomena, it is impossible to analyze vibration on the oscillating body and one can observe no vibration mode shape during experiment. In case of the FEA method, it is difficult to define boundary conditions correctly if the shape of a body tested is complex, and one can just obtain vibration mode shapes on the peak amplitude in each modes. In this study, plane plate of stainless steel(STS304), isotropic material, that is used as structural steel is analyzed about vibration characteristics under tension. Also, in the study of stainless steel, the characteristics of composite material(AS4/PEEK) used as high strength structural material in aircraft is evaluated about vibration under tension, and studies the effect of tension on vibration.

• Journal of Korean Ophthalmic Optics Society
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• v.12 no.4
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• pp.77-81
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• 2007

The spherical lens is typically classified by the refractive power into two groups such as (+) diopter lens and (-) diopter lens. The deformation occurred by the external force that is applied to a lens is caused by the increase or the decrease in the diopter of a lens. In this paper, the deformation of the lens was quantitatively measured by using ESPI (Electronic Speckle Pattern Interferometry) which have been used in the optical measurement field for past few years. ESPI has an advantage that the deformation of an object can be measured precisely by using coherence of the light. The experiment was carried out to the totally 16 types of plastic lens. It was confirmed that the deformation was decreased by increasing the diopter of the lens when same displacement was applied to the lens in case of (+) diopter lens and was increased by decreasing the diopter of the lens in case of (-) diopter lens. Also, it was found that the deformation of (+) diopter lens is less than that of (-) diopter lens. Therefore, with these results, it is expected that the possibility of the quantitative measurement for variation of the optical defect caused by the deformation of a lens when the deformation is occurred to the various types of the lens can be presented and that the application in the lens industrial field can be performed.

• Proceedings of the Korean Reliability Society Conference
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• 2002.06a
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• pp.245-251
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• 2002

Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.