• Title/Summary/Keyword: In plane of ESPI

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The analysis of dependence of sensitivity vector of ESPI on the illumination geometry (ESPI 입사광의 기하구조에 따른 sensitivity vector 분석)

  • 홍석경;백성훈;조재완;김철중
    • Korean Journal of Optics and Photonics
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    • v.5 no.3
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    • pp.379-385
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    • 1994
  • The sensitivity vector which depends on geometry of object illumination angles and distances of ESPI was analyzed. And the sensitivities of in-plane and out-of-plane displacements have been investigated. From these results, we have the conclusion that it is useful to use the diverging beam for object illumination. With diverging object illumination, only little errors are occurred when we approximate the sensitivity vector to constant all over the object surface.urface.

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Quantitative Measurement of Out-of-plane Deformation Using Shearography (전단간섭계를 이용한 면외변형의 정량적 계측)

  • Chang, Ho-Seob;Jung, Sung-Wook;Kim, Kyoung-Suk;Jung, Hyun-Chul
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.4 s.193
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    • pp.131-137
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    • 2007
  • Electronic Speckle Pattern Interferometry(ESPI) is a common method for measuring out-of-plane deformation and in-plane deformation and applied for vibration analysis and strain/stress analysis. However, ESPI is sensitive to environmental disturbance, which provide the limitation of industrial application. On the other hand, Shearography based on shearing interferometer which is insensitive to vibration disturbance can directly measure the first derivative of out-of-plane deformation. In this paper a technique that extract out-of-plane deformation from results of shearography by numerical processing is proposed and measurement results of ESPI and Shearoraphy are compared quantitatively.

Improvement of Sensitivity to In-plane Strain/Deformation Measurement by Micro-ESPI Technique (마이크로 ESPI 기법에 의한 면내 변형 측정 민감도 향상)

  • Kim D.I.;Huh Y.H.;Kee C.D.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1442-1445
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    • 2005
  • Several test methods, including micro strain/deformation measurement techniques, have been studied to more reliably measure the micro properties in micro/nano materials. Therefore, in this study, the continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and $0.47\;\mu{m}$ thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens using the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile test. The micro-tensile stress-strain for these materials was determined using the algorithm for continuous strain measurement. Furthermore, algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. According to the algorithm for enhancement of sensitivity, micro-tensile strain data between interfringe were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.

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Evaluation on the Influence and Measurement of Strain in Spot Welded Joint (점 용접부의 변형률 측정 및 영향 평가)

  • 차용훈
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.6 no.3
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    • pp.52-57
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    • 1997
  • Electronic Speckle Pattern Interferometry(ESPI) using the Model 95 Ar. laser, a video system and an image processor was applied to the in-plane displacement measurements. Unlike traditional strain gauges or Moire method, ESPI method requires no special surface preparation or attachments and can be measured in-plane displacement with no special surface preparation or attachments and can be measured in-plane displacement with no contact and real time. In this experiment specimen was loaded in parallel with a loadcell. The specimen was the cold rolled steel sheet of 2mm thickness, which was attached strain gauges. The study provides an example of how ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI compare with the data which was measured by strain gauge method in tensile testing.

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Quantitative Comparison of Out-of-Plane Deformation Measured by Dual-Function Interferometer System (이중기능 간섭계에 의해 측정된 면외변형의 정략적 비교)

  • Kim, Kyoung-Suk;Chang, Ho-Seob;Lee, Seung-Seok;Jung, Hyun-Chul;Kwag, Jae-Ho
    • Journal of the Korean Society for Nondestructive Testing
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    • v.28 no.1
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    • pp.33-39
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    • 2008
  • Dual-function interferometer is an interferometer that has all features of ESPI (electronic speckle pattern interferometry) and shearography in one interferometer setup. The deformatiou of an object is directly obtained by ESPI while the slope of the deformation of an object is obtained by shearography. If the result of shearography is divided by shearing amount and integrated by numerical analyzing, then finally the reconstructed deformation of an object that is the same as the results directly obtained by ESPI can be measured by shearography. In this study, rubber and alruminum plates are used as specimen and its out-of-plane deformation is measured by ESPI and shearography setup of the dual-function interferometer. Each of the results obtained by ESPI and shearography is compared by using numerical integration to the result of shearography. From this study, it is confirmed that the reconstructed deformation results obtained by numerical integration good agree with the results obtained by ESPI.

The Study on Measurement of In-Plane Displacement in Mechanical Structure applied to Washing Machine using ESPI (ESPI를 이용한 세탁기 적용 기계 구조물의 면내변위 측정에 관한 연구)

  • Lee, Hac-Ju;Kim, Sang-Tea;Choi, Eun-Oh;Chang, Seog-Weon
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.108-113
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    • 2001
  • Recently, the mechanical structures applied to many industrial products, especially in electronic products, appear to be miniaturized and complicated. This trend makes it difficult to analyze the stress distribution of those mechanical structures and generates new challenges for precise measurement of strain. Therefore, generally most of those cases largely depend on the finite element analysis. But the development of optical metrology which has the capability of non-contact, full-field and precise measurement makes it possible to solve these measuring problems. Among the optical measurement techniques, the electronic speckle pattern interferometry (ESPI) has been developed and considered as one of the most useful tools for measuring displacement and deformation. But the shortage of recognition and difficulties of measurement have limited its industrial applications in spite of its excellent capabilities. Therefore in this study, in order to enhance the industrial application of ESPI, the measurement of in-plane displacement of mechanical structure with ESPI, which is applied to washing machine and cannot be measured by strain gauges, was performed. And the verification of validity of FEA results was also done.

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A Study on Measurement of In-Plane Displacement using ESPI in Mechanical Structure under torsional load (비틀림하중을 받는 기계구조물의 ESPI를 이용한 면내변위 측정에 관한 연구)

  • Jang, Seok-Won;Lee, Hak-Ju;Choe, Eun-O;Jeong, Chan-Hui
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.4
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    • pp.693-700
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    • 2002
  • Recently, the mechanical structures applied to many industrial products, especially in electronic products, appear to be miniaturized and complicated. This trend makes it difficult to analyze the stress distribution of those mechanical structures and generates new challenges for precise measurement of strain. In order to solve this measurement problem many optical measurement techniques have been suggested. Among those, the ESPI(Electronic Speckle Pattern Interferometry) has been considered as one of the most useful tools. But the shortage of recognition and difficulties of measurement have limited its industrial applications in spite of its excellent capabilities. Therefore in this study, not only the verification of the FEA result but the enhancement of industrial application of ESPI was tried by measuring the in-plane displacement of mechanical structure with ESPI, which is difficult to be measured with strain gauge.

A Study on Evaluation of Defects of Pressure Vessel by Using ESPI and FEM (ESPI와 FEM을 이용한 압력용기 결함 측정에 관한 연구)

  • Kang, Young-June;Lee, Jung-Sik;Baik, Sung-Hoon;Park, Seung-Kyu;Lee, Dong-Hwan
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.12
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    • pp.104-110
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    • 2007
  • Internal defects are mainly caused by a corrosive action and degradation in the pipe used in a nuclear power plant or factory. The ESPI method have the many advantages when compared with conventional method. The advantage are the area measurement ability at one time and non-contact measurement ability in the real-time. In this paper, we studied on the measurement of a internal defect by using out of plane ESPI technique. Here, we compared the experimental results using out of plane ESPI with the FEM results.

A Study on the Measurement of In-plane Deformations by using Electronic Speckle Pattern Interferometry and Finite Element Method (전자 스페클 간섭법과 유한요소법을 이용한 면내변형의 측정에 관한 연구)

  • Kang, Hyung-Soo;Cho, Ki-Hyon;Kim, Hong-suk;chung, Hyung-kil
    • Journal of the Korean Society of Industry Convergence
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    • v.5 no.3
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    • pp.187-192
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    • 2002
  • In-plane ESPI(Electronic Speckle Patten Interferometry)was devised to measure in~plane defamation and rotation of a specimen with laser in this study. The conventional measuring methods of surface deformations such as the strain gauge have many demerits because they are contact and point-to-point measuring ones. But that ESPI is noncontact, nondestructive and whole field measuring method can overcome previous disadvantages. We used ESPI which is sensitive to in-plane displacement for measuring in-plane deformations of a disk. First of all, the system calibration was done due to an in-plane rotation before getting deformations of a disk. Finally we showed good agreement between theexperiment results and those of the FEA(Finit Element Analysis).

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A Study On Vibration Characteristics Of Plate with Crack by ESPI Method (ESPI를 이용한 결함이 있는 평판의 진동특성에 관한 연구)

  • 박찬주;김경석;홍진후;장호섭
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.239-242
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    • 2001
  • Electronic Speckle Pattern Interferometry(ESPI) was proposed in the 1970's as a method of producing the interferogram without using traditional holographic technique. ESPI is more faster than Holography method, because the interferometric image is recorded and updated by the video camera every 1/30 second and whold-field inspection possibly. In this study using a non-contact optical technique that is suited for in-plane and out-of-plane deformation measurement. Thin plate with crack was analyzed by ESPI to determine the characteristics of vibration mode shape and natural frequency. Also, results of the experiment were compared with Finite Element Method(FEM).

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