Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-free Solder Bump (리플로우 횟수와 표면처리에 따른 Sn-Ag-Cu계 무연 솔더 범프의 고속전단 특성평가)
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- Journal of the Microelectronics and Packaging Society
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- v.16 no.3
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- pp.11-17
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- 2009