• Progress in Medical Physics
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• v.21 no.1
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• pp.93-98
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• 2010

The aim of this work was to establish the methodology for event positioning by measuring depth of interaction (DOI) information and to evaluate the system sensitivity and spatial resolution of the new detector for I-125 and Tc-99m imaging. For this purpose, a Monte Carlo simulation tool, DETECT2000 and GATE were used to model the energy deposition and light distribution in the detector and to validate this approach. Our proposed detector module consists of a monolithic CsI(Tl) crystal with dimensions of $50.0{\times}50.0{\times}3.0\;mm^3$. The results of simulation demonstrated that the resolution is less than 1.5 mm for both I-125 and Tc-99m. The main advantage of the proposed detector module is that by using 3 mm thick CsI(Tl) with maximum-likelihood position-estimation (MLPE) method, high resolution I-125 imaging and high sensitivity Tc-99m imaging are possible. In this paper, we proved that our new detector to be a reliable design as a detector for a multi-energy SPECT.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2017.04a
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• pp.146-146
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• 2017

현대의 스마트폰 및 태블릿pc등을 가능하게 만든 집적 기술 중의 하나는 3차원 집적 회로(3D-IC)와 같은 패키징 기술이다. 이러한 첨단 3차원 집적 기술은 메모리집적을 통한 대용량 메모리 모듈 개발뿐만 아니라, 메모리와 프로세서의 집적, high-end FPGA, Back side imaging (BSI) 센서 모듈, MEMS 센서와 ASIC 집적, High Bright (HB) LED 모듈 등에 적용되고 있다. 3D-IC의 3차원 모듈 제작 시에는 기존에 발생하지 않았던 여러 가지 파괴 모드들이 발생하고 있는데 Thermal/Photonic Emission 장비 등 기존의 2차원 결함분리 (Fault Isolation) 기술로는 첨단의 3차원 적층 제품들에서 발생하는 불량을 비파괴적으로 혹은 3차원적으로 분리하는 것이 불가능하므로, 비파괴 3차원 결함 분리 기술은 향후 선행 제품 적기 개발에 매우 필수적인 기술이다. 본 연구는 3D-IC 반도체의 비파괴적 내부결함 검사를 위하여 가시광선-근적외선 대역(351nm~1770nm)의 InGaAs (Indium Galium Arsenide) 계열 영상검출기 (imaging detector)를 사용하여 분광 시스템 광학 설계를 통한 초분광 영상 기반 검출 모듈을 제작하였다. 제작된 초분광 영상 기반 검출 모듈을 이용하여 구리 회로 위에 실리콘 웨이퍼가 3단 적층 된 반도체 더미 샘플의 초분광 영상을 촬영하였으며, 촬영된 초분광 영상에 대하여 Chemometrics model 기반의 분석기술을 적용하여 실리콘 웨이퍼 내부의 집적 구조에 대한 검사가 가능함을 확인하였다.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.5
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• pp.382-388
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• 2016

When Flat Panel Display (FPD) is made with backlight module, such as LED TV, it inherently suffers from the non-uniform backlight luminance problem that results in un-even brightness distribution throughout the TV screen. If the luminance of each pixel location of a TV screen as a function of the driving voltage can be measured, it can be used to compensate the non-uniformity of the backlight module. We use a carefully calibrated imaging system to take pictures of a TV screen at different levels of brightness and generate the compensation functions for the driving circuitry to correct the luminance level at each pixel location. Making use of the fact that the luminance of the screen is normally brightest at around the center of the screen and gradually decreases toward the border of the screen, the luminance of the whole TV screen is approximated by a mathematical function of the pixel locations. The parameters of the function are computed in the least square sense by the values of both the pixel luminance sent from the driving circuit and the grayscale value measured from the image taken by the imaging system. To justify the correction system, a simple second order polynomial function is used to approximate the luminance across the screen. When the driving circuit voltage is corrected according to the measured function, the variance of the screen luminance is reduced to one tenth of the one measured from the un-corrected TV screen.

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2000.11b
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• pp.318-324
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• 2000

Ultrasonic and magnetic resonance imaging systems are used to visualize the interior states of biological objects. These nondestructive methods have many advantages but too much expensive. And they do not give exact color information and may miss some details. If it is allowed to destruct some biological objects to get the interior and exterior information, constructing 3D image from the series of the sliced sectional images gives more useful information with relatively low cost. In this paper, PC based automatic 3D model generator was developed. The system was composed of three modules. One is the object handling and image acquisition module, which feeds and slices objects sequentially and maintains the paraffin cool to be in solid state and captures the sectional image consecutively. The second is the system control and interface module, which controls actuators for feeding, slicing, and image capturing. And the last is the image processing and visualization module, which processes a series of acquired sectional images and generates 3D graphic model. The handling module was composed of the gripper, which grasps and feeds the object and the cutting device, which cuts the object by moving cutting edge forward and backward. Sliced sectional images were acquired and saved in the form of bitmap file. The 3D model was generated to obtain the volumetric information using these 2D sectional image files after being segmented from the background paraffin. Once 3-D model was constructed on the computer, user could manipulate it with various transformation methods such as translation, rotation, scaling including arbitrary sectional view.

• Journal of the Korean Society of Radiology
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• v.8 no.7
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• pp.371-376
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• 2014

The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

• Investigative Magnetic Resonance Imaging
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• v.24 no.1
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• pp.1-20
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• 2020

This document is the third part of the guidelines for the interpretation and post-processing of cardiac magnetic resonance (CMR) studies. These consensus recommendations have been developed by a Consensus Committee of the Korean Society of Cardiovascular Imaging (KOSCI) to standardize the requirements for image interpretation and post-processing of CMR. This third part of the recommendations describes tissue characterization modules, including perfusion, late gadolinium enhancement, and T1- and T2 mapping. Additionally, this document provides guidance for visual and quantitative assessment, consisting of "What-to-See," "How-To," and common pitfalls for the analysis of each module. The Consensus Committee hopes that this document will contribute to the standardization of image interpretation and post-processing of CMR studies.

• Korean Journal of Optics and Photonics
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• v.16 no.1
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• pp.50-55
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• 2005

A method for measuring the wavefront error and the modulation transfer function(MTF) of large aperture optics using an unequal path interferometer is presented. A bidirectional shearing interferometer is used for collimation testing of the measurement system. A large aperture Fizeau interferometer with long optical path difference measures the wavefront error of the optics under test by using a $\Phi$ 400 mm off-axis parabolic mirror. The MTF is also measured at the wavelength of the interferometer by changing the laser light into partially incoherent light. Test results of a $\Phi$ 300 mm Cassegrain type satellite telescope made in Korea are presented.

• Korean Journal of Optics and Photonics
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• v.16 no.1
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• pp.56-62
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• 2005

Because of the wide plane and the curved field of CRT rear projection high definition television, its MTF(modulation transfer function) can't be easily measured by the usual forward testing method. Then we propose a backward testing method for the MTF so that the object plane and the image analyzer of forward testing are located at positions opposite each other. We prefer to use the backward testing method because the forward testing method has poor accuracy caused by very small numerical aperture, low spatial resolutions, and long depth of focus. We found that the backward testing method was very easy to align and had high repeatability. We confirmed the confidence of results obtained by the backward testing method in comparison with designed results.

• Korean Journal of Optics and Photonics
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• v.16 no.1
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• pp.63-70
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• 2005

We propose a method for evaluating the image quality of color liquid crystal display(LCD) monitors by using the polychromatic modulation transfer function(PMTF), which is calculated from the modulation transfer function(MTF) weighted by the overall color response of the system including the test LCD monitor. We confirm that experimental results using the PMTF agree well with simulated results of the PMTF of a color LCD monitor by using three bar targets with different amplitudes and three elementary colors such as red(R), green(G), and blue(B). As a results, we should choose the PMTF instead of the white color MTF or monochromatic MTF in order to evaluate correctly the image quality of color LCD monitors.