• Title/Summary/Keyword: Image defect detection

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Fast Defect Detection of PCB using Ultrasound Thermography (초음파 서모그라피를 이용한 빠른 PCB 결함 검출)

  • Cho, Jai-Wan;Jung, Hyun-Kyu;Seo, Yong-Chil;Jung, Seung-Ho;Kim, Seung-Ho
    • Proceedings of the KIEE Conference
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    • 2005.10b
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    • pp.273-275
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    • 2005
  • Active thermography is being used since several years for remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements were performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB.

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TFT-LCD Defect Detection Using Double-Self Quotient Image (이중 SQI를 이용한 TFT-LCD 결함 검출)

  • Park, Woon-Ik;Lee, Kyu-Bong;Kim, Se-Yoon;Park, Kil-Houm
    • Journal of KIISE:Computing Practices and Letters
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    • v.14 no.6
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    • pp.604-608
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    • 2008
  • The TFT-LCD image allows non-uniform illumination variation and that is one of main difficulties of finding defect region. The SQI (self quotient image) has the HPF (high pass filter) shape and is used to reduce low frequency-lightness component. In this paper, we proposed the TFT-LCD defect-enhancement algorithm using characteristics of the SQI, that is the SQI has low-frequency flattening effect and maintains local variation. The proposed method has superior flattening effect and defect-enhancement effect compared with previous the TFT-LCD image preprocessing.

Wavelet Transform Based Defect Detection for PCB Inspection Machines (PCB 검사기를 위한 웨이블릿 변환 기반의 결함 검출 방법)

  • Youn, Seung-Geun;Kim, Young-Gyu;Park, Tae-Hyung
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.66 no.10
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    • pp.1508-1515
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    • 2017
  • This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

A Micro-defect Detection of Cold Rolled Steel (냉연 강판의 미세 결함 검출 기술)

  • Yun, Jong Pil
    • Journal of Institute of Control, Robotics and Systems
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    • v.22 no.4
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    • pp.247-252
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    • 2016
  • In this paper, we propose a new defect detection technology for micro-defect on the surface of steel products. Due to depth and size of microscopic defect, slop of surface and vibration of strip, the conventional optical method cannot guarantee the detection performance. To solve the above-mentioned problems and increase signal to noise ratio, a novel retro-schlieren method that consists of retro reflector and knife edge is proposed. Moreover dual switching lighting method is also applied to distinguish uneven micro defects and surface noise. In proposed method, defective regions are represented by a black and white pattern. This pattern is detected by a defect detection algorithm with Gabor filter. Experimental results by simulator for sample defects of cold rolled steel show that the proposed method is effective.

Image Processing and Deep Learning-based Defect Detection Theory for Sapphire Epi-Wafer in Green LED Manufacturing

  • Suk Ju Ko;Ji Woo Kim;Ji Su Woo;Sang Jeen Hong;Garam Kim
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.2
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    • pp.81-86
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    • 2023
  • Recently, there has been an increased demand for light-emitting diode (LED) due to the growing emphasis on environmental protection. However, the use of GaN-based sapphire in LED manufacturing leads to the generation of defects, such as dislocations caused by lattice mismatch, which ultimately reduces the luminous efficiency of LEDs. Moreover, most inspections for LED semiconductors focus on evaluating the luminous efficiency after packaging. To address these challenges, this paper aims to detect defects at the wafer stage, which could potentially improve the manufacturing process and reduce costs. To achieve this, image processing and deep learning-based defect detection techniques for Sapphire Epi-Wafer used in Green LED manufacturing were developed and compared. Through performance evaluation of each algorithm, it was found that the deep learning approach outperformed the image processing approach in terms of detection accuracy and efficiency.

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Geometrical Defect Detection of Secondary Battery Using 3-Dimensional CAD Model (3D CAD 모델을 이용한 이차 전지의 형상 결함 검출)

  • Yeong-Ho Jo;Keun-Ho Rew;Sang-Yul Lee
    • Journal of Information Technology Applications and Management
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    • v.29 no.6
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    • pp.135-144
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    • 2022
  • In this study, we transformed 4680 type lithium-ion batteries to 3-dimensional CAD models and present a methodology to detect defects using Radon inverse transformation. Transparency was applied to the model to make it look like a CT image when viewed from the front. One normal and three defect models were created and analyzed. The models were saved as image files while rotating at a certain angle. Then, we used the Radon inverse transformation to reconstruct the original 3D geometry from the image files. Finally, we successfully found defects in the defect models for three cases.

Development of Image Defect Detection Model Using Machine Learning (기계 학습을 활용한 이미지 결함 검출 모델 개발)

  • Lee, Nam-Yeong;Cho, Hyug-Hyun;Ceong, Hyi-Thaek
    • The Journal of the Korea institute of electronic communication sciences
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    • v.15 no.3
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    • pp.513-520
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    • 2020
  • Recently, the development of a vision inspection system using machine learning has become more active. This study seeks to develop a defect inspection model using machine learning. Defect detection problems for images correspond to classification problems, which are the method of supervised learning in machine learning. In this study, defect detection models are developed based on algorithms that automatically extract features and algorithms that do not extract features. One-dimensional CNN and two-dimensional CNN are used as algorithms for automatic extraction of features, and MLP and SVM are used as algorithms for non-extracting features. A defect detection model is developed based on four models and their accuracy and AUC compare based on AUC. Although image classification is common in the development of models using CNN, high accuracy and AUC is achieved when developing SVM models by converting pixels from images into RGB values in this study.

Classifying Scratch Defects on Billets Using Image Processing and SVM (영상처리와 SVM을 이용한 Billet의 스크래치 결함 분류)

  • Lee, Sang Jun;Kim, Sang Woo
    • Journal of Institute of Control, Robotics and Systems
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    • v.19 no.3
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    • pp.256-261
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    • 2013
  • In the steel manufacturing area, researches for defect inspection receive a big attention for quality control. This paper proposes an algorithm to detect a scratch defect on steel billets. This algorithm takes ROIs (Regions of Interest), and extracts 11 features which represent properties of defect on a ROI. SVM (Support Vector Machine) is used to classify defect and normal ROIs. The algorithm classifies a frame image of a Billet as a defect image if there is one or more defect ROIs. In the experiments, the proposed algorithm had reliable classifying accuracy.

Texture Analysis and Classification Using Wavelet Extension and Gray Level Co-occurrence Matrix for Defect Detection in Small Dimension Images

  • Agani, Nazori;Al-Attas, Syed Abd Rahman;Salleh, Sheikh Hussain Sheikh
    • 제어로봇시스템학회:학술대회논문집
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    • 2004.08a
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    • pp.2059-2064
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    • 2004
  • Texture analysis is an important role for automatic visual insfection. This paper presents an application of wavelet extension and Gray level co-occurrence matrix (GLCM) for detection of defect encountered in textured images. Texture characteristic in low quality images is not to easy task to perform caused by noise, low frequency and small dimension. In order to solve this problem, we have developed a procedure called wavelet image extension. Wavelet extension procedure is used to determine the frequency bands carrying the most information about the texture by decomposing images into multiple frequency bands and to form an image approximation with higher resolution. Thus, wavelet extension procedure offers the ability to robust feature extraction in images. Then the features are extracted from the co-occurrence matrices computed from the sub-bands which performed by partitioning the texture image into sub-window. In the detection part, Mahalanobis distance classifier is used to decide whether the test image is defective or non defective.

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The Development of Surface Inspection System Using the Real-time Image Processing (실시간 영상처리를 이용한 표면흠검사기 개발)

  • 이종학;박창현;정진양
    • 제어로봇시스템학회:학술대회논문집
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    • 2000.10a
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    • pp.171-171
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    • 2000
  • We have developed m innovative surface inspection system for automated quality control for steel products in POSCO. We had ever installed the various kinds of surface inspection systems, such as a linear CCD and a laser typed surface inspection systems at cold rolled strips production lines. But, these systems cannot fulfill the sufficient detection and classification rate, and real time processing performance. In order to increase detection and classification rate, we have used the Dark, Bright and Transition Field illumination and area type CCD camera, and fur the real time image processing, parallel computing has been used. In this paper, we introduced the automatic surface inspection system and real time image processing technique using the Object Detection, Defect Detection, Classification algorithms and its performance obtained at the production line.

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