• Laser Solutions
• /
• v.18 no.3
• /
• pp.9-13
• /
• 2015

The development of a reliable, high-power source of mind-IR laser light gives process develop important tool with unique characteristics that will significantly impact a diverse range of applications.

• Journal of the Semiconductor & Display Technology
• /
• v.16 no.3
• /
• pp.36-40
• /
• 2017

In this paper, a new method of laser trimming of thick film heater is studied. Various laser waves (IR, Green, UV) are used to ablation the heater and the process parameters are also presented. For given initial printed resisters, the cutting length should be prepared to obtain the target resister value in advance. Therefore, the cutting model is very important. The well-known model was tested and proven that it is valid only within a certain range of cutting length. A new model is proposed for a wide range of resister laser trimming. The cutting lengths and resister variation was obtained and formulated. To verify the presented method, the cutting lengths of each resister are calculated for various target resister value and laser trimming using UV is conducted.

• Journal of Welding and Joining
• /
• v.35 no.2
• /
• pp.1-5
• /
• 2017

Many microelectronic devices are miniaturizing the capacitance density and the size of the capacitor. Along with this miniaturization of electronic circuits, tantalum (Ta) capacitors have been on the market due to its large demands worldwide and advantages such as high volumetric efficiency, low temperature coefficient of capacitance, high stability and reliability. During a tantalum capacitor manufacturing process, arc welding has been used to weld base frame and sub frame. This arc welding may have limitations since the downsizing of the weldment depends on the size of welding electrode and the contact time may prevent from improving productivity. Therefore, to solve these problems, this study applies laser spot welding to weld nickel (Ni) and Au-Sn-Ni alloy using CW IR fiber laser with lap joint geometry. All laser parameters are fixed and the only control variable is laser irradiance time. Four different shapes, such as no melting upper workpiece, asymmetric spherical-shaped weldment, symmetric weldment, and, excessive weldment, are observed. This shape may be due to different temperature distribution and flow pattern during the laser spot cutting.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.37 no.6
• /
• pp.637-643
• /
• 2024

One method to increase the output of solar modules is the application of the Half-cut technique, which requires a scribing process involving direct irradiation of infrared lasers on the solar cells. During this process, the laser melts the surface of the solar cells at high temperatures, enabling mechanical division, but this can lead to output loss due to thermal degradation caused by the laser. To minimize such losses, a low-temperature and low-loss division method has been devised. In this study, we compared the electrical characteristics and leakage currents affecting output degradation between the newly devised low-temperature and low-loss cell division method and the conventional laser division method. Additionally, we conducted a 3-point flexural test to evaluate the mechanical properties of both methods.

• Current Photovoltaic Research
• /
• v.12 no.2
• /
• pp.37-40
• /
• 2024

One of the current innovation trends in the solar industry is the increase in the size of silicon wafers. As the wafer size increases, the series resistance of the module rises, highlighting the need for research on methods for cutting and bonding solar cells. Among these, the Infrared (IR) laser scribing technique has been extensively researched. However, there is still insufficient optimization research regarding the thermal damage caused by lasers on the Transparent Conductive Oxide (TCO) layer of Heterojunction (HJT) solar cells. Therefore, in this study, we systematically varied conditions such as IR laser scribing speed, frequency, power, and the number of scribes to investigate their impact on the performance of cut cells under each condition. Additionally, we conducted a comparative analysis of thermal damage effects on the TCO layer based on varying scribing depths.