• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.4
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

• Proceedings of the Korean Magnestics Society Conference
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• 2003.06a
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• pp.130-131
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• 2003

The magnetic and thermal properties of NiFe/IrMn/CoFe with Mn additions have been studied. As grown CoFe pinned-layers with IrMn-Mn have dominantly larger exchange biasing field( $H_{ex}$) and blocking temperature( $T_{b}$) than when pure I $r_{22}$M $n_{78}$ is used. The magnetic properties improve, $H_{ex}$ and $T_{b}$ improve with 77-78 vol% Mn, but drop considerably with more Mn additions, losing magnetic properties of theb NiFe/IrMn/CoFe with addition 0.6 vol % Mn. The average x-ray diffraction peak ratios fcc (111)CoFe of (111)IrM $n_3$ textures for the Mn inserted total vol of 75, 77, and 79 vol% were about 1.4, 0.8, and 0.6, respectively. For the sample without Mn inserted layer, the $H_{ex}$ between I $r_{22}$M $n_{78}$ and CoFe layers is almost nothing. For two multilayer as-grown samples with ultra-thin Mn layers of 77 vol % and 79 vol %, the $H_{ex}$s are 250 Oe and 150 Oe, respectively. In case of IrMn with 77.5 vol% Mn, the $H_{ex}$ was 444 Oe up to 30$0^{\circ}C$ endured of 363 Oe at 40$0^{\circ}C$, respectively. Mn additions improve the magnetic properties and thermal stabilities of NiFe/IrMn/CoFe. Those increase the $H_{ex}$ and $T_{b}$. In applications where higher $H_{ex}$ and $T_{b}$ are accept, proper concentrations of Mn can be used.n can be used.be used.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.84-87
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• 2003

HgTe quantum dots(QDs) were synthesized in aqueous solution by colloidal method. The absorption and photoluminescence(PL) spectrum of the synthesized HgTe QDs revealed the strong exitonic peak in the IR region. And the photocurrent measurement of colloidal QDs are performed using IR light source. The lineshape of the wavelength dependent intensity of photocurrent was very similar to the absorption spectrum, indicating the charges generated by the absorption of photons give direct contribution to photocurrent. The channels of dark current are supposed $H_2O$ containing in thiol by the remarkable drop of current at the state of vacuum. It was thought that the proper passivation layer on the top of HgTe film reduce the dark current and the adequate choice of capping material improves the efficiency of the photocurrent in the HgTe QDs. This study suggests that HgTe QDs are very prospective materials for optoelectronics including photodetectors in the IR range.

• 한국가스학회:학술대회논문집
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• 2003.10a
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• pp.183-187
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• 2003

• Proceedings of the KIPE Conference
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• 2017.11a
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• pp.169-170
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• 2017

본 논문에서는 Matlab을 이용하여 배터리의 전기적 모델과 내부 파라미터 추출 통해 시뮬레이션을 하였다. IR-drop에 의해 변화한 전압 데이터를 이용하여 부하 전류 변화로 인한 시뮬레이션과 실험 데이터 간의 오차 개선함으로써 배터리 전기적 모델과 실험 전압 데이터를 이용함으로써 확장 칼만 필터(extended kalman filter; EKF) 같은 적응 알고리즘을 사용하지 않고도 오차가 감소된 시뮬레이션이 가능함을 확인하였다.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1242-1244
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• 1993

As increasing of internal resistance value at MCFC electrode, out voltage of battery is decreased currently. We measured overpotential and IR drop which consist of resistance factors in MCFC electrode, and calculated out voltage from open circuit voltage.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.10
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• pp.47-54
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• 2007

Since impulse-radio-based ultra wideband (IR-UWB) do not use carrier frequency but use very short pulse to transmit data it sends data not continuously but discretely and this feature gives the potential to reduce collision in multi-user environment. In this paper, we analyse characteristic of IR-UWB and propose a new collision paradigm, Collision Distribution which changes collision level from packet to pulse. In Collision Distribution mechanical each node sends data with its own pulse interval in random time, distributed manner. It prevents packet drop due to packet collision. We show that Collision Distribution can reduce packet error and can provide real time packet transmission with analysis.

• Journal of the Optical Society of Korea
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• v.15 no.2
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• pp.174-181
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• 2011

An airborne sensor is developed for remote sensing on an aerial vehicle (UV). The sensor is an optical payload for an eletro-optical/infrared (EO/IR) dual band camera that combines visible and IR imaging capabilities in a compact and lightweight package. It adopts a Ritchey-Chr$\'{e}$tien telescope for the common front end optics with several relay optics that divide and deliver EO and IR bands to a charge-coupled-device (CCD) and an IR detector, respectively. The EO/IR camera for dual bands is mounted on a two-axis gimbal that provides stabilized imaging and precision pointing in both the along and cross-track directions. We first investigate the mechanical deformations, displacements and stress of the EO/IR camera through finite element analysis (FEA) for five cases: three gravitational effects and two thermal conditions. For investigating gravitational effects, one gravitational acceleration (1 g) is given along each of the +x, +y and +z directions. The two thermal conditions are the overall temperature change to $30^{\circ}C$ from $20^{\circ}C$ and the temperature gradient across the primary mirror pupil from $-5^{\circ}C$ to $+5^{\circ}C$. Optical performance, represented by the modulation transfer function (MTF), is then predicted by integrating the FEA results into optics design/analysis software. This analysis shows the IR channel can sustain imaging performance as good as designed, i.e., MTF 38% at 13 line-pairs-per-mm (lpm), with refocus capability. Similarly, the EO channel can keep the designed performance (MTF 73% at 27.3 lpm) except in the case of the overall temperature change, in which the EO channel experiences slight performance degradation (MTF 16% drop) for $20^{\circ}C$ overall temperate change.

• Journal of the Korean Electrochemical Society
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• v.4 no.3
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• pp.98-103
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• 2001

The electrochemical characteristics and specific capacitance were investigated by preparation processes (dip coating method, doctor blade coating method and paste rolling method) of activated carbon electrode for an EDLC(electric double layer capacitor). The EDLC using $LiPF_6$ salts and PC-DEC solvents showed good specific capacitance, 130F/g and small IR-drop at linear time-voltage curve. 0.11V, Cyclic voltammetry analysis using the activated carbon electrode prepared by dip coating method was shown closer to ideal EDLC characterization.

• Journal of IKEEE
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• v.16 no.2
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• pp.102-108
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• 2012

3-dimensional integrated circuits (3D-ICs) have some problems for power delivery network design due to larger supply currents and larger power delivery paths compared to 2D-IC. The power delivery network consists of power bumps & through-silicon-vias (TSVs), and IR-drop at each node varies with the number and location of power bumps & TSVs. It is important to optimize the power bumps & TSVs while IR-drop constraint is satisfied in order to operate chip ordinarily. In this paper, the power bumps & TSVs optimization with optimized power mesh structure for power delivery network in 3D-ICs is proposed.