• 한국전기전자재료학회논문지
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• 제30권10호
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• pp.615-624
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• 2017

This study investigated the various physical and electrical effects of silicon direct bonding. Direct bonding means the joining of two wafers together without an intermediate layer. If the surfaces are flat, and made clean and smooth using HF treatment to remove the native oxide layer, they can stick together when brought into contact and form a weak bond depending on the physical forces at room temperature. An IR camera and acoustic systems were used to analyze the voids and bonding conditions in an interface layer during bonding experiments. The I-V and C-V characteristics are also reported herein. The capacitance values for a range of frequencies were measured using a LCR meter. Direct wafer bonding of silicon is a simple method to fuse two wafers together; however, it is difficult to achieve perfect bonding of the two wafers. The direct bonding technology can be used for MEMS and other applications in three-dimensional integrated circuits and special devices.

• 한국기계가공학회지
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• 제2권3호
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• pp.26-33
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• 2003

The term 'High Speed Machining' has been used for many years to describe end milling with small diameter tools at high rotational speeds, typically 10,000-100,000rpm. The process was applied in the aerospace industry for the machining of light alloys, notably aluminum. In recent year, however, the mold and die industry has begun to use the technology for the production of components, including those manufactured from hardened tool steels. With increasing cutting speed used in modern machining operation, the thermal aspects of cutting become more and mole Important. It not only directly influences in rate of tool weal, but also affects machining precision recognized as thermal expansion and the roughness of the surface finish. Hence, one needs to accurately evaluate the rate of cutting heat generation and temperature distributions on the machining surface. To overcome the heat generation, we used to cutting fluid. Cutting fluid plays a roles in metal cutting process. Mechanically coupled effectiveness of cutting fluids affect to friction coefficient at tool-workpiece interface and cutting temperature and chip control, surface finish, tool wear and form accuracy. Through this study, we examined the behavior of heat generation in high-speed machining and the cooling performance of various cooling methods.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.422-428
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• 2001

The term High Speed Machining has been used for many years to describe end milling with small diameter tools at high rotational speeds, typically 10,000 - 100,000 rpm. The process was applied in the aerospace industry for the machining of light alloys, notably aluminium. In recent year, however, the mold and die industry has begun to use the technology for the production of components, including those manufactured from hardened tool steels. With increasing cutting speed used in modern machining operation, the thermal aspects of cutting become more and more important. It not only directly influences in rate of tool wear, but also will affect machining precision recognized as thermal expansion and the roughness of the surface finish. Hence, one needs to accurately evaluate the rate of cutting heat generation and temperature distributions on the machining surface. To overcome the heat generation, we used to cutting fluid. Cutting fluid play a roles in metal cutting process. Mechanically coupled effectiveness of cutting fluids affect to friction coefficient at tool-work-piece interface and cutting temperature and chip control, surface finish, tool wear and form accuracy. Through this study, we examined the behavior of heat generation in high-speed machining and the cooling performance of various cooling methods.

• 한국정밀공학회지
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• 제30권7호
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• pp.687-693
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• 2013

The service conditions of railway cars have become more difficult in recent years due to increased speed. Faulty components in the railcars may result in service interruption, or in extreme cases, derailment. Thus, it is important to diagnose and monitor the main components of railcars. Temperature monitoring is one of the basic methods used to diagnose abnormal conditions in the main components of railway cars, such as in bearings, reduction gears, and traction motors. In this study, we developed a monitoring system for the main components, using an infrared thermography technique. This technique has the advantage of infrared thermal camera imaging of temperature contours in the components. Various hardware and software components of the monitoring system are used to acquire the sensor data, to identify potential problems in railcar operation.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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• pp.203-207
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• 2003

Due to the inherent nature of the low flying UAV, obstacle detection is a fundamental requirement in the flight path to avoid the collision from obstacles as well as manned aircraft. In this paper, a preliminary sensor requirements of an obstacle detection system for UAV in low-altitude flight are analyzed, and the automated obstacle detection sensor system is proposed assessing both passive and active sensors such as EO camera, IR, Laser radar, microwave and millimeter radar. In addition, TCAS (Traffic Alert and Collision Avoidance System) are reviewed for the collision avoidance of the manned aircraft system. It is suggested that small-sized radar sensor is the best candidate for the smart UAV because an active radar can provide the real-time informations on range and range rate in the all-weather environment. However, an important constraints on small UAV should be resolved in terms of accommodation of the mass, volume, and power allocated in the payload of the UAV system design requirements.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2015년도 제46회 하계학술대회
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• pp.1537-1538
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• 2015

전력사용량이 산업발전과 더불어 기하급수적으로 증가하고 있으며, 한정된 공간내에서 대용량의 전력설비를 설치하기 위해 폐쇄형 배전반이 운영되고 있다. 한국전기안전공사에서 발표한 통계자료에 의하면, 고압이상 전기설비 검사결과 절연내력이 불합격인 경우가 다수 발생하고 있으며, 이는 아크 플래시 사고의 원인이다. 특히 수배전반의 경우 부하설비 또는 외부의 영향을 확인할 수 있는 장치 및 보호설비가 설치되어 있으나 자체 안전장치가 마련되어 있지 않아 자체사고를 신속히 검출하고 판단할 수 있는 기술이 필요하다. 본 논문에서는 해상도가 낮은 저가의 열화상 센서에 고속 DSP를 사용하여 영상처리 기법인 이차원 보간 법으로 해상도를 올려서 사용하는 기술을 이용하여 아크에 의해 발생되는 열특성을 검출하고 검출된 데이터를 전송하여 전기화재사고를 미연에 방지할 수 있는 장치 개발을 위한 기초 특성조사를 실시하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1957-1962
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• 2008

As a field of MEMS, micro-heater fabricated by Au is being introduced and developed in recent years. Previous studies about thermal properties of various forms of micro-heater were not sufficient. In this work, numerical and experimental analysis of the heat generation and the temperature distribution of micro-heater packages for 8 different geometric cases were studied. We fabricated a micro-heater package with silicon wafer, on which Cr/Au layer was laminated before 8 geometric forms of micro-heater were patterned. In each cases, temperature distribution was measured with IR thermal camera. According to the experimental results, which show a good agreement with the results analyzed by CFD, it was found that at 0.5W, the temperature of micro-heater chip which contained $20000{\mu}m$-long, serpentine shaped micro-heater was elevated to a relatively high temperature of $78^{\circ}C$ Consequently, we proposed a geometry of micro-heater which has effective thermal characteristics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.116-116
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• 2010

진공 chamber에서 방전된 plasma 내부를 외부 view port를 통하여 확인하는 것은 극히 제한적이며 leak의 확률을 높이고 plasma의 균일한 방전을 방해한다. 이를 개선하기 위하여 내장형 무선 카메라를 chamber 내부에 위치한 후 고진공 영역에서 촬영을 시도하였으나 일반적인 CCD 카메라로는 촬영할 수 없다. 고진공 영역에서 카메라 내부온도의 급격한 상승이 원인으로 밝혀졌고 적정온도인 $45^{\circ}C$를 초과하여 최대 $96^{\circ}C$까지 4 min 이내에 상승함을 IR camera로 확인할 수 있었으며 이 때 카메라가 작동하지 않았다. 또한 카메라를 고진공 영역에서 촬영 및 녹화하기 위해서는 $46^{\circ}C$의 온도를 낮추어야 함을 진공해제 이후 내부온도가 $50^{\circ}C$로 감소하면서 내장형 무선 카메라가 다시 작동함으로 인해 알 수 있었다. 본 연구에서는 이를 해결하기 위하여 내장형 무선 카메라에 AM 변조 방식의 311 MHz RF remote controller를 장착하여 외부에서 선택적으로 ON/OFF 할 수 있도록 개조하였고 10 L chamber에서 150 L/sec TMP를 이용하여 10-6 Torr의 압력에서 성공적으로 녹화 및 촬영하였다. 또한 내장형 무선 카메라 내부의 반도체 회로 규격 및 발열량과 heat sink의 규격 (열전도도, 복사율)을 추가로 조사하였다. 분자유동 영역에서 열전달은 복사에 의한 영향이 대부분이므로 내장형 무선 카메라 내부 온도를 감소시켜 카메라의 작동 시간을 연장하기 위하여 내부 회로에 emissivity가 높고 전기전도도가 낮아 회로에 영향이 없는 박막을 회로에 증착시키는 추후의 연구가 필요하다.

• 천문학회보
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• 제36권2호
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• pp.116.1-116.1
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• 2011

L1448-MM, known as a class 0 YSO with a prominent outflow, was observed with the Photodetector Array Camera and Spectrometer (PACS) aboard Herschel Space Observatory by the key program, DIGIT (Dust, Ice, Gas in Time, PI: Neal Evans). The PACS covers various molecular and atomic line transitions such as CO, OH, $H_2O$, [OI], and [CII] at wavelengths from 55 to 210 ${\mu}m$. The line emission of $H_2O$, [OI], mid-J CO, and the OH fundamental transition distributes along the outflow direction although high-J CO and other OH emission peaks at the central spatial pixel. According to our excitation analysis, the CO gas has two temperature components: 300 K and 750 K, which are attributed to PDR and shock, respectively. However, the $H_2O$ gas with the rotation temperature ($T_{rot}$) of 200 K seems only affected by shock. Interestingly, the relative strength of OH transitions suggests the IR pumping process in L1448-MM. We also mapped L1448-MM in CO J=2-1 with the SRAO 6m telescope to compare with the FIR line transition maps.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.1273-1274
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• 2006

In recent, it became necessary to develop the technology about electrodeless fluorescent lamp according to demand of the electrodeless fluorescent lamp system that used higher efficiency and advantage of long lifetime. Inductively coupled plasma is commonly used for electrodeless lamp due to its ease of plasma generation. An electric power efficiency of electrodeless fluorescent lamp has big relative property of gas in lamp, gas pressure, lamp formation, ingredients of magnetic substance and shape and action frequency etc. We used magnetic substance that open self-examination material of electrodeless fluorescent lamp antenna. Ferrite that is used in this experiment was Mn-Zn type. We have examined temperature and flux characteristic by frequency. Considering using frequency 2.65[MHz], Frequency was changed from 2.05[MHz] to 3.05[MHz] to recognize flux and temperature change of lamp. I used LMS(Lighting Measurement System) to measure flux and IR Camera to measure temperature of lamp.