• Journal of Digital Convergence
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• v.17 no.2
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• pp.171-176
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• 2019

In modern times, many IoT products are being used as all things and devices are connected to the Internet and IoT products become easily accessible through the network. For the convenience of users, IoT products can be remotely operated automatically without manual operation. Various research and development are underway to improve the convenience of users by using IoT products. However, since only the convenience of the users is pursued, in terms of security, there is a serious problem that exposes the user's personal information. This paper has proposed a method to apply $moir{\acute{e}}$ technology to IoT products in order to improve the performance of security, and a method to increase the safety of IoT products using user face authentication based on shadow $moir{\acute{e}}$ as a $moir{\acute{e}}$ phenomenon method, and the projection $moir{\acute{e}}$. When comparing the existing IoT products and IoT products applied with $moir{\acute{e}}$ technology, IoT products applied with $moir{\acute{e}}$ technology are safer in terms of security.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.854-856
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• 2014

Has been released of make it possible to control the using for smart devices of a wide variety home appliances and electronics in smart appliances in accordance with the one person multi devices. In addition, is increasing rapidly for the number of the product on cleaning robot and refrigerator, air conditioning, TV, etc. these devices are using the implement up DLNA system. And at home and abroad for development and has provided with Iot and Alljoyn such systems. But currently using home appliances or electronic devices of there are a lot of the operating system non installed than the installed products. In addition, smart appliances do not use for user than buying existing electronic products a lot more. In addition, more occur for smart appliances of that do not use for the user on smart appliances rather than buying existing electronics. In this paper, Suggested and implemented for system of control such as smart devices to existed home appliance on not have an operating system, Using mobile device for want users to quantify the data to transfer from arduino board.

• Convergence Security Journal
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• v.15 no.4
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• pp.27-33
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• 2015

In this paper, the development level of information security technology for internet of things(Iot), big data and clo ud services is analyzed, and the detail policy is proposed to be leader in area of patents and ICT standard. The conc ept of ICT convergence is defined frist, market and current state of technology for three convergence services is the n analyzed, and finally main function and security target for each technology are presented. The evaluation criteria a nd IPR are analyzed to diagnose the level of patent and standard for the technology. From the results, even though the domestic competence is inferior compared to other advanced country, the efficient policy should be presented by using our capability for the big data and cloud. Furthermore, the technology development for the IoT and cloud is ne eded in advance considering the market-technology influence effects. In addition to, M2M security framework in IoT, data security in big data and reliable networking in cloud should be developed in advance.

• KIPS Transactions on Computer and Communication Systems
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• v.8 no.12
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• pp.277-286
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• 2019

The Unmanned Aerial Vehicle (UAV) is one of the most precious inventions of Internet of things (IOT). UAV faces the necessity to charge battery or replace battery from the charging stations during or between services. We propose scheduling algorithms for drone power charging (SADPC). The basic idea of algorithm is considering both a deadline (for increasing deadline miss ratio) and a charging time (for decreasing waiting time) to decide priority on charging station among drones. Our simulation results show that our power charging algorithm for drones are efficient in terms of the deadline miss ratio as well as the waiting time in general in compare to other conventional algorithms (EDF or SJF). Also, we can choose proper algorithms for battery charge scheduling and charge ready battery allocation according to system parameters and user requirements based on our simulation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• The Journal of the Korea Contents Association
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• v.15 no.10
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• pp.626-635
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• 2015

Along with the social interests and needs for health, the U-Healthcare Service as a new model to control individual dietary life and to prevent chronic diseases is now drawing the public attention. In this study, the characteristics of the requirement of U-Healthcare Service were investigated from subjects aged over 50 years old. As parts of the expectation to the U-Healthcare service, the customized clinical care & control (37.7%) and the systematic understanding of individual health state (21.4%) appeared significantly. And for the application of the U-Healthcare Service to the field of healthcare, the control of dietotherapy (43.9%) appeared higher than anything else and thus the customized service for individual dietotherapy seemed to be needed. Regarding the field of searching for health information, the disease control (35.6%), food materials (28.6%), and recipe for health foods (22.7%) appeared in sequence and revealed that the majority over 50% of subjects were interested in foods. The requirements for the information of dietary formula were also investigated through 5 points scaled questionnaires on respective topics of nutritive components, menus customized for corresponding health states (diseases), and the results obtained from surveys on respective topics all showed the needs for all information by representing each point value exceeded 3.9. Through the results obtained from this study, the provision of customized information enabling the nutritional control in accordance with individual states of health or disease was estimated to be needed for the popularization of U-Healthcare Service providing contents for dietary life of clients especially those of aged over 50 years.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.5
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• pp.563-569
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• 2018

This paper is on the implementation of a system for automatically monitoring window farm hydroponics based on Arduino (utilizing Arduino's open source code) emerging as the icon of the Fourth Industrial Revolution. A window farm, which means window-type hydroponics, is offered as an alternative to fulfill the desires of people who want to grow plants aside from the busy daily life in the city. The system proposed in this paper was developed to automatically monitor a window farm hydroponics cultivation environment using the Arduino UNO board, a four-charmel motor shield, temperature and humidity sensors, illumination sensors, and a real-time clock module. Modules for hydroponics have been developed in various forms, but power consumption is high because most of them use general power and motors. Since it is not a system that is monitored automatically, there is a disadvantage in that an administrator always has to manage its operational state. The system is equipped with a water supply that is most suitable for a plant growth environment by utilizing temperature, humidity, and light sensors, which function as Internet of Things sensors. In addition, the real-time clock module can be used to provide a more appropriate water supply. The system was implemented with sketch code in a Linux environment using Raspberry Pi 3 and Arduino UNO.