• Title/Summary/Keyword: Hydrogen deposition

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Low temperature plasma deposition of microcrystalline silicon thin films for active matrix displays: opportunities and challenges

  • Cabarrocas, Pere Roca I;Abramov, Alexey;Pham, Nans;Djeridane, Yassine;Moustapha, Oumkelthoum;Bonnassieux, Yvan;Girotra, Kunal;Chen, Hong;Park, Seung-Kyu;Park, Kyong-Tae;Huh, Jong-Moo;Choi, Joon-Hoo;Kim, Chi-Woo;Lee, Jin-Seok;Souk, Jun-H.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.107-108
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    • 2008
  • The spectacular development of AMLCDs, been made possible by a-Si:H technology, still faces two major drawbacks due to the intrinsic structure of a-Si:H, namely a low mobility and most important a shift of the transfer characteristics of the TFTs when submitted to bias stress. This has lead to strong research in the crystallization of a-Si:H films by laser and furnace annealing to produce polycrystalline silicon TFTs. While these devices show improved mobility and stability, they suffer from uniformity over large areas and increased cost. In the last decade we have focused on microcrystalline silicon (${\mu}c$-Si:H) for bottom gate TFTs, which can hopefully meet all the requirements for mass production of large area AMOLED displays [1,2]. In this presentation we will focus on the transfer of a deposition process based on the use of $SiF_4$-Ar-$H_2$ mixtures from a small area research laboratory reactor into an industrial gen 1 AKT reactor. We will first discuss on the optimization of the process conditions leading to fully crystallized films without any amorphous incubation layer, suitable for bottom gate TFTS, as well as on the use of plasma diagnostics to increase the deposition rate up to 0.5 nm/s [3]. The use of silicon nanocrystals appears as an elegant way to circumvent the opposite requirements of a high deposition rate and a fully crystallized interface [4]. The optimized process conditions are transferred to large area substrates in an industrial environment, on which some process adjustment was required to reproduce the material properties achieved in the laboratory scale reactor. For optimized process conditions, the homogeneity of the optical and electronic properties of the ${\mu}c$-Si:H films deposited on $300{\times}400\;mm$ substrates was checked by a set of complementary techniques. Spectroscopic ellipsometry, Raman spectroscopy, dark conductivity, time resolved microwave conductivity and hydrogen evolution measurements allowed demonstrating an excellent homogeneity in the structure and transport properties of the films. On the basis of these results, optimized process conditions were applied to TFTs, for which both bottom gate and top gate structures were studied aiming to achieve characteristics suitable for driving AMOLED displays. Results on the homogeneity of the TFT characteristics over the large area substrates and stability will be presented, as well as their application as a backplane for an AMOLED display.

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Effect of Oxygen and Diborane Gas Ratio on P-type Amorphous Silicon Oxide films and Its Application to Amorphous Silicon Solar Cells

  • Park, Jin-Joo;Kim, Young-Kuk;Lee, Sun-Wha;Lee, Youn-Jung;Yi, Jun-Sin;Hussain, Shahzada Qamar;Balaji, Nagarajan
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.4
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    • pp.192-195
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    • 2012
  • We reported diborane ($B_2H_6$) doped wide bandgap hydrogenated amorphous silicon oxide (p-type a-SiOx:H) films prepared by using silane ($SiH_4$) hydrogen ($H_2$) and nitrous oxide ($N_2O$) in a radio frequency (RF) plasma enhanced chemical vapor deposition (PECVD) system. We improved the $E_{opt}$ and conductivity of p-type a-SiOx:H films with various $N_2O$ and $B_2H_6$ ratios and applied those films in regards to the a-Si thin film solar cells. For the single layer p-type a-SiOx:H films, we achieved an optical band gap energy ($E_{opt}$) of 1.91 and 1.99 eV, electrical conductivity of approximately $10^{-7}$ S/cm and activation energy ($E_a$) of 0.57 to 0.52 eV with various $N_2O$ and $B_2H_6$ ratios. We applied those films for the a-Si thin film solar cell and the current-voltage characteristics are as given as: $V_{oc}$ = 853 and 842 mV, $J_{sc}$ = 13.87 and 15.13 $mA/cm^2$. FF = 0.645 and 0.656 and ${\eta}$ = 7.54 and 8.36% with $B_2H_6$ ratios of 0.5 and 1% respectively.

Influence of PVP on the Thickness of Ferroelectric (Na,K)NbO3 Film by Sol-Gel (솔-젤 법을 통해 제조된 강유전체 (Na,K)NbO3 막의 두께에 미치는 PVP의 영향)

  • Kim, Dae-Gun;Yoo, In-Sang;Kim, Sae-Hoon;Kim, Jin-Ho
    • Korean Journal of Materials Research
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    • v.22 no.12
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    • pp.696-700
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    • 2012
  • (Na, K) $NbO_3$ thick film was successfully achieved using a sol-gel coating process with the addition of polyvinylpyrrolidone (PVP) to a metal alkoxide solution. The transparent coating solution, mixed with Nb:PVP = 1:1 in a molar ration, was synthesized by evaporating the solvent to over 62.5 wt%. Additive PVP increased the viscosity of the solution so that the coating thickness could be enhanced. The thickness of the (Na, K) $NbO_3$ film assisted by PVP was ca. 320 nm at the time of deposition; this value is four times thicker than that of the sample fabricated without PVP. Also, due to PVP binding with the OH groups of the metal alkoxide, the condensation reaction in the film was suppressed. The crystalline size of the (Na, K) $NbO_3$ films assisted by PVP was ca. 15 nm smaller than that of the film fabricated without PVP. After the sintering process at $700^{\circ}C$, the (Na, K) $NbO_3$ films were mainly composed of randomly oriented (Na, K) $NbO_3$ phase of perovskite crystal structure, including a somewhat secondary phase of $K_2Nb_4O_{11}$. However, by adding PVP, the content of the secondary phase became quite smaller than that of the sample without PVP. It was thought that the addition of PVP might have the effect of restraining the loss of potassium and that PVP could hold metalloxane by strong hydrogen bonding before complete decomposition. Therefore, the film thickness of the (Na, K) $NbO_3$ films could be considerably advanced and made more crack-free by the addition of PVP.

Study on manufacturing mechanism of functional carbon membrane (기능성 카본막의 제조 Mechanism에 관한 연구)

  • Bae, Sang-Dae
    • The Journal of the Convergence on Culture Technology
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    • v.4 no.2
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    • pp.211-216
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    • 2018
  • Separation technology combining adsorption and membrane is expected to be applied in many fields such as water treatment. In this fusion technique, a functional carbon membrane having a carbon whisker grown on the surface of the membrane was developed to inhibit membrane fouling, which is a problem in the membrane separation process. In this study, to elucidate the mechanism of manufacturing the functional carbon membrane, the membrane was pretreated with the polymer latex of each mixing ratio and the membrane was formed by the CVD (Chemical Vapor Deposition) method. The membrane was analyzed by scanning electron microscope (SEM), CHN analyzer (Elemental Analyzer), and X-ray diffraction (XRD). As a result, the diameter and density of carbon whiskers were higher in case of polyvinyl di-chloride (PVdC): polyvinyl chloride (PVC) = 4.5: 55. It seems possible to control the diameter and density of the carbon whiskers according to the hydrogen content of the polymer latex.

Formation of Hydrophobic Self-assembled Monolayers on Paper Surface with Silanes (실란화 반응에 의한 종이 표면의 소수성 자기조립 단분자막 형성)

  • Oh, Min-Jeong;Lee, Hyoung;Paik, Ki-Hyon
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.42 no.1
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    • pp.64-73
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    • 2010
  • This study was conducted to modify the surface properties of papers by formation of hydrophobic self-assembled monolayer(SAM) on paper surface with silanes. A base paper I(0.5% AKD) and base paper II(1.0-1.5% AKD) were reacted with silanes(PFDTES, DMDCS, MODDCS) by immersion method and vapor deposition method. Hydrophobic SAMs(contact angle value>$120^{\circ}C$) were obtained on all papers after treatment with $10^{\mu}l$ PFDTES for 15min, with $50^{\mu}l$ DMDCS for 30min, with $50^{\mu}l$ MODDCS for 300min. When applying PFDTES to paper surface, lower silane concentration and shorter reaction time were required, whereas MODDCS with long alkyl chain required the longest reaction time of 300min. The st$\ddot{o}$ckight sizing degree of silane treated papers were increased between 105sec(base paper I) and 130sec(base paper II). The wet tensile strength of PFDTES-treated base papers(I, II) increased by 10-34% after SAM formation. However, the wet tensile strength of the DMDCS-treated base paper(I) was found to decrease from 0.067kN/m to 0.038kN/m; this may due to the cellulose degrading as a result of generated hydrogen chloride when hydroxyl group of cellulose were reacted with DMDCS. No apparent changes of PPS roughness on silane-treated papers are observed. The ATR-IR spectrum showed absorption peak located at 465 and 1200cm-1 which can be assigned to the Si-O-C asymmetric stretching and Si-O-C bonds, respectively.

Electrodeposition of Silicon in Ionic Liquid of [bmpy]$Tf_2N$

  • Park, Je-Sik;Lee, Cheol-Gyeong
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.30.1-30.1
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    • 2011
  • Silicon is one of useful materials in various industry such as semiconductor, solar cell, and secondary battery. The metallic silicon produces generally melting process for ingot type or chemical vapor deposition (CVD) for thin film type. However, these methods have disadvantages of high cost, complicated process, and consumption of much energy. Electrodeposition has been known as a powerful synthesis method for obtaining metallic species by relatively simple operation with current and voltage control. Unfortunately, the electrodeposition of the silicon is impossible in aqueous electrolyte solution due to its low oxidation-reduction equilibrium potential. Ionic liquids are simply defined as ionic melts with a melting point below $100^{\circ}C$. Characteristics of the ionic liquids are high ionic conductivities, low vapour pressures, chemical stability, and wide electrochemical windows. The ionic liquids enable the electrochemically active elements, such as silicon, titanium, and aluminum, to be reduced to their metallic states without vigorous hydrogen gas evolution. In this study, the electrodeposion of silicon has been investigated in ionic liquid of 1-butyl-3-methylpyrolidinium bis (trifluoromethylsulfonyl) imide ([bmpy]$Tf_2N$) saturated with $SiCl_4$ at room temperature. Also, the effect of electrode materials on the electrodeposition and morphological characteristics of the silicon electrodeposited were analyzed The silicon electrodeposited on gold substrate was composed of the metallic Si with single crystalline size between 100~200nm. The silicon content by XPS analysis was detected in 31.3 wt% and the others were oxygen, gold, and carbon. The oxygen was detected much in edge area of th electrode due to $SiO_2$ from a partial oxidation of the metallic Si.

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Analysis of Characteristic of Graphene Thin Film Transistor and Properties of Graphene using Copper Substrate (구리기판을 이용한 그래핀 박막 특성 및 그래핀을 이용한 트랜지스터의 특성 분석)

  • Oh, Teresa
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.9
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    • pp.2127-2132
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    • 2013
  • Graphene thin film was prepared on the copper foils by chemical deposition, and the characteristic of graphene depending on $H_2$ and CH4 gas flow rates was analyzed by the Raman spectra. The graphene formation was improved with increment of methan gas flow rates. The increment of hydrogen gas flow rate made high intensity of D($1350cm^{-1}$) and G($1580cm^{-1}$). The peak of D($1350cm^{-1}$) is related with the defects, and the 2D($2700cm^{-1}$) increased depending on the increment of amount of methan gas flow rate. The rate of G/2D indicates the quality of garphene to like a monolayer, and the small value of G/2D means better grapheme. The G/2D of graphene after annealed at $200^{\circ}C$ was 0.55 and improved the characteristic of graphene than the deposited-grapnene. Thin film transistor with graphene as an active channel was p-type semiconductor.

Suppression of surface $SiO_2$ layer and Solid Phase Epitaxy of Si films Using heating-up under $Si_2H_6$ environment (승온시 $Si_2H_6$ 가스 주입을 이용한 표면 $SiO_2$의 억제 및 비정질 Si의 고상 에피텍시에 관한 연구)

  • 최태희;남승의;김형준
    • Journal of the Korean Vacuum Society
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    • v.5 no.3
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    • pp.239-244
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    • 1996
  • We firstly report that formation of $SiO_2$ layer on Si surface can be effectively prevented by flowing the $Si_2H_6$ gas during the heating-up procedure for amorphous Si depositions. In this way, amorphously deposited Si layer onto crystalline Si substrates can be grown epitaxially during the post-deposition heat treatments. The suppression of surface $SiO_2$ can be explained in terms of adsorption of SiHx adspecies, instead of oxygen from residual gases in the reactors, to Si surfaces after desorption of hydrogen from H-passivated Si surfaces. Employing $Si_2H_6$ flowing and soild phase epitaxial growth, high-quality epitaxial Si layer can be obtained at low temperatures below $600^{\circ}C$ without conventional high temperature cleaning procedures.

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Nucleation and growth mechanism of nitride films deposited on glass by unbalanced magnetron sputtering

  • Jung, Min J.;Nam, Kyung H.;Han, Jeon G.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2001.06a
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    • pp.14-14
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    • 2001
  • Nitride films such as TiN, CrN etc. deposited on glass by PVD processes have been developed for many industrial applications. These nitride films deposited on glass were widely used for not only decorative and optical coatings but also wear and corrosion resistance coatings employed as dies and molds made of glass for the example of lens forming molds. However, the major problem of nitride coatings on glass by PVD process is non-uniform film owing to pin-hole and micro crack. It is estimated that nonuniform coating is influenced by a different surface energy between metal nitrides and glass due to binding states. In this work, therefore, for the evaluation of nucleation and growth mechanism of nitride films on glass TiN and CrN film were synthesized on glass with various nitrogen partial pressure by unbalanced magnetron sputtering. Prior to deposition, for the examination of relationship between surface energy and film microstructure plasma pre-treatment process was carried out with various argon to hydrogen flow rate and substrate bias voltage, duty cycle and frequency by using pulsed DC power supply. Surface energy owing to the different plasma pre-treatment was calculated by the measurement of wetting angle and surface conditions of glass were investigated by X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscope(AFM). The microstructure change of nitride films on glass with increase of film thickness were analyzed by X-Ray Diffraction(XRD) and Scanning Electron Microscopy(SEM).

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Phelligridin D maintains the function of periodontal ligament cells through autophagy in glucose-induced oxidative stress

  • Kim, Ji-Eun;Kim, Tae-Gun;Lee, Young-Hee;Yi, Ho-Keun
    • Journal of Periodontal and Implant Science
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    • v.50 no.5
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    • pp.291-302
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    • 2020
  • Purpose: The objective of this study was to investigate whether phelligridin D could reduce glucose-induced oxidative stress, attenuate the resulting inflammatory response, and restore the function of human periodontal ligament cells (HPDLCs). Methods: Primary HPDLCs were isolated from healthy human teeth and cultured. To investigate the effect of phelligridin D on glucose-induced oxidative stress, HPDLCs were treated with phelligridin D, various concentrations of glucose, and glucose oxidase. Glucose-induced oxidative stress, inflammatory molecules, osteoblast differentiation, and mineralization of the HPDLCs were measured by hydrogen peroxide (H2O2) generation, cellular viability, alkaline phosphatase (ALP) activity, alizarin red staining, and western blot analyses. Results: Glucose-induced oxidative stress led to increased production of H2O2, with negative impacts on cellular viability, ALP activity, and calcium deposition in HPDLCs. Furthermore, HPDLCs under glucose-induced oxidative stress showed induction of inflammatory molecules (intercellular adhesion molecule-1, vascular cell adhesion protein-1, tumor necrosis factor-alpha, interleukin-1-beta) and disturbances of osteogenic differentiation (bone morphogenetic protein-2, and -7, runt-related transcription factor-2), cementogenesis (cementum protein-1), and autophagy-related molecules (autophagy related 5, light chain 3 I/II, beclin-1). Phelligridin D restored all these molecules and maintained the function of HPDLCs even under glucose-induced oxidative stress. Conclusions: This study suggests that phelligridin D reduces the inflammation that results from glucose-induced oxidative stress and restores the function of HPDLCs (e.g., osteoblast differentiation) by upregulating autophagy.