• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.8
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• pp.1376-1382
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• 2016

The discharge characteristics of inductively coupled $Ar/CH_4$ plasma were investigated by fluid simulation. The inductively coupled plasma source driven by 13.56 Mhz was prepared. Properties of $Ar/CH_4$ plasma source are investigated by fluid simulation including Navier-Stokes equations. The schematics diagram of inductively coupled plasma was designed as the two dimensional axial symmetry structure. Sixty six kinds of chemical reactions were used in plasma simulation. And the Lennard Jones parameter and the ion mobility for each ion were used in the calculations. Velocity magnitude, dynamic viscosity and kinetic viscosity were investigated by using the fluid equations. $Ar/CH_4$ plasma simulation results showed that the number of hydrocarbon radical is lowest at the vicinity of gas feeding line due to high flow velocity. When the input power density was supplied as $0.07W/cm^3$, CH radical density qualitatively follows the electron density distribution. On the other hand, central region of the chamber become deficient in CH3 radical due to high dissociation rate accompanied with high electron density.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3279-3281
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• 1999

This paper describes a method of direct wafer bonding using surfaces activated by a radio-frequency hydrogen plasma. The hydrogen plasma cleaning of silicon in the RIE mode was investigated as a pretreatment for silicon direct bonding. The cleaned silicon surface was successfully terminated by hydrogen, The hydrogen-terminated surfaces were rendered hydrophilic, which could be wetted by Dl water rinse. Two wafers of silicon and silicon dioxide were contacted to each other at room temperature and postannealed at $300{\sim}1100^{\circ}C$ in an $N_2$ atmosphere for 2 h. From the AFM results, it was revealed that the surface became rougher with the increased plasma exposure time and power. The effect of the plasma treatment on the surface chemistry was investigated by the AES analysis. It was shown that the carbon contamination at the surface could be reduced below 5 at %. The interfacial energy measured by the crack propagation method was 122 $mJ/m^2$ and 384 $mJ/m^2$ for RCA cleaning and hydrogen plasm, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.227.2-227.2
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• 2015

세포를 부착하는 기술은 세포를 배양하기 위한 가장 기초적이며 중요한 기술이다. 세포 부착기술은 대상물과 세포 간의 다양한 생물학적, 물리화학적 연관 관계가 있으나 세포와 부착 대상물 간의 복잡한 상호작용 때문에 완벽히 예측하기는 어렵다. 우리는 이 연구에서 siloxane 성분을 포함하고 있는 전구체인 tetrakis(trimethylsilyloxy)silane과 hydro-carbon을 포함하고 있는 전구체인 cyclohexane을 혼합하여 플라즈마 중합 박막을 만들고 그 박막에서의 mouse embryonic fibroblast cells과 bovine aortic endothelial cell 부착의 정도를 확인하였다. 플라즈마 중합 박막을 제작하기 위해 capacitively coupled plasma chemical vapor deposition system을 사용하였고 carrier gas로는 Ar을 사용하였다. Plasma RF power는 13.56MHz 70W를 사용하였다. Bubbler에서 기화된 전구체를 포함하고 있는 Ar carrier gas가 process chamber에서 혼합되고 두 전구체의 비율을 조절하기 위해 carrier gas를 0 에서 150sccm으로 변화시켜 플라즈마 중합 박막을 제작하였다. 플라즈마 중합 박막의 화학적 조성은 Fourier transform infrared absorption spectroscopy와 X-ray photoelectron spectroscopy를 이용하여 측정하였고, 생물학적 세포 부착 정도는 현미경을 통해 관찰하였다. 또한, 물과 박막의 접촉각(Water contact angle)을 측정함으로써 본 박막과 세포 부착에서의 친, 소수성의 연관성을 확인하였다. Tetrakis(trimethylsilyloxy)silane를 전구체를 사용한 박막에서 세포 부착 억제 표면특성이 관찰되었고, 주입되는 cyclohexane 비율이 늘어날수록 세포부착 가능한 표면 특성을 보였다. 결과적으로, 전구체인 tetrakis(trimethylsilyloxy)silane와 cyclohexane의 비율을 조절함으로써 세포의 부착정도를 제어할 수 있음을 확인하였다.