• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1168-1170
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• 2005

Nanoimprint Lithography(NIL) has increasingly been recognized as a key manufacturing technology for nanosized feature. One of the most important task for nanoimprint lithography is to provide the imprinting stamp with low price. The Stamp fabricated with Si based material by e-beam lithography, RIE is extremely expensive and its throughput is very limited and PDMS replica is too soft to hold high imprinting pressure.(>5atm) In this study, we present the imprinting stamp which can be easily replicated from original mold and is based on PVC film. Replication of original Si mold to PVC film was done by Hot embossing technique, ($120^{\circ}C$ of Temperature, 20 atm applied) As small as 100nm patterns were successfully transferred into PVC film. The size of stamp was up to 100mm in diameter.

• Macromolecular Research
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• 제12권5호
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• pp.474-477
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• 2004

We present simple, low-cost methods for the fabrication of polymeric waveguides that have large core sizes for use as optical interconnects. We have used both hot embossing and micro-contact printing techniques for the fabrication of multimode waveguides using the same materials. Rectangular and large-core (60${\times}$60 $\mu\textrm{m}$$^2$) channels were readily prepared when using these methods. The dimensions of the embossed and printed channels were the same as those of the pattern on the original master. The polymeric waveguides that we fabricated with large core sizes exhibited a low propagation loss of 0.1 dB/cm at 850 nm, which indicates that hot embossing and micro-contact printing are suitable techniques for the fabrication of optical waveguides having large-core.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1036-1042
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• 2003

The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process , simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

• 한국기계가공학회지
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• 제14권4호
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• pp.1-7
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• 2015

In the present study, copper micromolds with a microhole array were precisely manufactured by a synchrotron LIGA process. Like in the traditional LIGA process, a deep X-ray lithography based on a synchrotron radiation was employed as the first manufacturing step. Due to the excellent optical performance of the synchrotron X-ray used, cylindrical micropillar arrays with high aspect ratio could be efficiently obtained. The fabricated microfeatures were then used as a master of the subsequent copper electroforming process, thereby resulting in copper micromolds with a microhole array. Thermoplastic hot embossing experiments with the copper micromolds were carried out for imprinting cylindrical microfeatures onto a polystyrene sheet. Through the hot embossing, the effect of embossing temperature and usefulness of the present manufacturing method could be verified.

• ETRI Journal
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• 제27권1호
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• pp.122-125
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• 2005

A polymer-based planar-lightwave-circuit-type variable optical attenuator (VOA) was fabricated using a hot embossing process. With an optimized one-step embossing process, forty micro-channels for the guidance of light were defined on a polymer thin film with an accuracy of ${\pm}0.5{\mu}m$. The fabricated polymeric thermo-optic VOA shows 30 dB attenuation with 110 mW electrical input power at $1.55{\mu}m$. The rise and fall times are less than 5 ms.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.669-670
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.309-310
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.95-96
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.321-322
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.117-118
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• 2008