• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.115-115
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• 1998

• Bulletin of the Korean Chemical Society
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• v.14 no.5
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• pp.610-614
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• 1993

Laser induced impedance changes in hollow cathode lamps containing sputtered metal atoms have been employed to measure the spectroscopic properties of metal. This technique, known as optogalvanic spectroscopy, has been shown to be a powerful and inexpensive technique for the investigation of atomic and molecular species. Characteristic optogalvanic signals from hollow cathode lamps (HCL) made of different metal species and induced with a pulsed dye laser were observed, and the dependence of the optogalvanic signal on the discharge current and wavelength of laser was measured. Based on the results obtained, the mechanisms involved in evoking the optogalvanic signals were consisted of single-photon absorption, multi-photon absorption, and photoionization. Moreover the current dependence of the optogalvanic signal indicates that the optogalvanic technique could be one of the most sensitive optical methods of detecting atomic species.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.3
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• pp.383-388
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• 2011

The cold hollow cathode gas ion source is under development for multi aperture focused ion beam (FIB) system. In this paper, we describe the cold hollow cathode ion source design and the general ion source performance using Ar gas. The glow discharge characteristics and the ion beam current density at various operation conditions are investigated. This ion source can generate maximum ion beam current density of approximately 120 mA/$cm^2$ at ion beam potential of 10 kV. In order to effectively transport the energetic ions generated from the ion source to the multi-aperture focused ion beam(FIB) system, the einzel lens system for ion beam focusing is designed and evaluated. The ions ejected from the ion source can be forced to move near parallel to the beam axis by adjusting the potentials of the einzel lenses.

• Analytical Science and Technology
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• v.15 no.6
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• pp.514-520
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• 2002

The electrothermal vaporization (ETV) hollow cathode glow discharge atomic emission spectrometer for analysis of liquid sample has been developed and characterized. This system has improved the sample introduction method of electrothermal vaporization and the hollow cathode glow discharge. The sample introduction method was possible to provide high analyte transport efficiency to the plasma by helix coil made of tungsten material. In addition, small volume samples (<$30{\mu}{\ell}$) could be used. The system has glow discharge cell with special design for improvement of precision. The effect of discharge parameters such as discharge power, gas flow rate has been studied to find optimum condition. The emitted light was effectively carried into detector by fiber optic cable in UV region. The calibration curve of Pb, Cd were obtained with 3 samples.

• Proceedings of the KIEE Conference
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• 1991.11a
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• pp.261-264
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• 1991

Titanium carbide(TiC) films were deposited on stainless-steel sheets using HCD(Hollow Cathode Discharge) reactive ion plating. Acetylene gas was used as the reactant gas. The characteristics of TiC films were examined by X-Ray diffraction, $\alpha$-step, ESCA(Electron Spectroscopy for Chemical Analysis), and, AES(Auger Electron Spectroscopy). The results were discussed with regard to various deposition conditions(bias voltage, acetylene flow rate, temperature).

• Korean Journal of Optics and Photonics
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• v.8 no.4
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• pp.291-296
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• 1997

The slotted type of hollow copper cathode was constructed and tested for its geometric stability and usability for laser operation at 780nm. The peak output power of copper ion laser emission was measured for different operating conditions. The IR-laser power was dependent on the parameters of the geometry of the hollow cathodes, discharge current and gas fillings. The peak power decreased with increasing neon pressure over 60%. One reason for this decrease in output power may be conjectured as hier due to the decreasing population of the upper laser level. The copper ion laser transition at 780 nm populated at the 5p level. The hollow cathode copper ion laser is operated in He and Ne mixture by electric discharge excitation and could be operated for more than 100 hours with only a 35% drop in the output power(2.8mW cw for 9.6cm active length).

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.443-448
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• 1996

In order to plasma-sulfnitride by combining ion-nitriding of a steel and sputtering of MoS$_2$, chromium-molybdenum steel was plasma-sulfritrided using hollow cathode discharge with parallel electrodes which are a main of the steel and a subsidiary cathode of $MoS_2$. The treatment was carried out at 823K for 10.8ks under 665Pa in a 30% $N_2$-70% $H_2$ gas atmosphere. Plasma-sulfnitriding layers formed of the steel were characterized with EDX, XRD, micrographic structure observation and hardness measurement. A compound layer of 8-15$\mu\textrm{m}$ and nitrogen diffusion layer of about 400$\mu\textrm{m}$ were formed on the surface of plasma-sulfnitrided steel. The compound layer consisted of FeS containing Mo and iron nitrides. The nitrides of $\varepsilon$-$Fe_2_3N$ and $\gamma$'-$Fe_4N$ formed under the FeS. The thickness of compound layer and surface hardness were different with the gaps between main and subsidiary cathodes even in the same sulfnitriding temperature. The surface hardnesses after plasma-sulfnitriding were distributed from 640 to 830Hv. The surface hardness was higher in the plasma-sulfnitriding than the usual sulfnitriding in molten salt. This may be due to Mo in sulfnitriding layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.437-437
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• 2010

DC Hollow cathode 방전은 약 100여 년 전, Paschen에 의해 실험된 이후로 광원, 스퍼터링 공정, 이온빔 소스 등 다양한 분야에 이용되어 왔다. 최근 태양전지용 마이크로 결정질 실리콘 증착 시, RF CCP의 전극에 복수의 홀 혹은 트렌치 구조를 두어 Hollow cathode 방전 효과를 이용하여 향상된 공정 속도로 공정을 진행한다. 그러나 RF-MHCD (Multi hole cathode discharge) 공정을 위한 최적 규격의 홀 기에 관한 연구는 그 중요성과 응용성에도 불구하고 깊게 이루어지지 못한 바 있다. 그러므로 저자는 Capacitively Coupled Plasma (전극 간격 : 4cm, 전극 직경 : 14cm) 장비에서 평면 전극과 10mm 깊이와 각각 3.5mm, 5mm, 7mm, 10mm 직경의 홀이 있는 4개의 전극을 이용하여 Argon RF-MHCD 방전을 관찰하여 조건 별 최적의 홀 전극 디자인을 도출하였다. 실험 조건은 64.5mTorr ~ 645mTorr압력 범위/ 1A~9A이며, 플라즈마는 전극 사이 중앙에 설치한 RF-compensated Langmuir Probe와, 전극과 전기적으로 접촉하는 1000:1 Probe 와 Voltage-Current Probe를 이용하여 측정되었다. 실험 결과 압력 조건 별로, 최적의 전자 밀도를 유도하는 전극 상 홀의 직경이 달라짐을 확인하였다.

• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.331-340
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• 2010

3D fluid based numerical modelling is done for a VHF multi hollow cathode array plasma enhanced chemical vapor deposition system. In order to understand the fundamental characteristics of it, Ar plasma is analyzed with a condition of 40 MHz, 100 Vrf and 1 Torr. For hole array of 6 mm diameter and 20 mm inter-hole distance, plasma is well confined within the hole at an electrode gap of 10 mm. The peak plasma density was $5{\times}10^{11}#/cm^3$ at the center of the hole. When the substrate was assumed at ground potential, electron temperature showed a peak at the vicinity of the grounded walls including the substrate and chamber walls. The reaction rate of metastable based two step ionization was 10 times higher than the direct electron impact ionization at this condition. For $H_2$, the spatial localization of discharge is harder to get than Ar due to various pathways of electron impact reactions other than ionization.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1038-1041
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• 2003

In the paper, we investigated silicon surface microstructures formed by reactive ion etching in hollow cathode system. Wet anisotropic chemical etching technique use to form random pyramidal structure on <100> silicon wafers usually is not effective in texturing of low-cost multicrystalline silicon wafers because of random orientation nature, but High density hollow cathode plasma system illustrates high deposition rate, better film crystal structure, improved etching characteristics. The etched silicon surface is covered by columnar microstructures with diameters form 50 to 100nm and depth of about 500nm. We used $SF_{6}$ and $O_{2}$ gases in HCP dry etch process. This paper demonstrates very high plasma density of $2{\times}10^{12}$ $cm^{-3}$ at a discharge current of 20 mA. Silicon etch rate of 1.3 ${\mu}s/min$. was achieved with $SF_{6}/O_{2}$ plasma conditions of total gas pressure=50 mTorr, gas flow rate=40 sccm, and rf power=200 W. Our experimental results can be used in various display systems such as thin film growth and etching for TFT-LCDs, emitter tip formations for FEDs, and bright plasma discharge for PDP applications. In this paper we directed our study to the silicon etching properties such as high etching rate, large area uniformity, low power with the high density plasma.