• Journal of radiological science and technology
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• v.21 no.2
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• pp.11-18
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• 1998

Single phase, narrow beam X-ray attenuation data were obtained using various construction materials concrete, white block, red block, 3 hole block, gypsum board, artificial marble, cement, plate glass, wood, and lead. Tube voltages of 60, 80, 100, 120 kVp were employed and the resulting curves were compared to transmission data found in this report. The shielding methodology and the derivation of equations used for determination of barrier requirements were presented in NCRP 49. We could calculate the X-ray exposed dose after attenuation and thickness of protection barrier in the clinic facilities accordingly. For the purpose of maximizing the benefit/cost ratio to diagnostic shielding, various construction materials must be installed carefully and attnuation rate considered thoroughly.

• Advances in Traditional Medicine
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• v.8 no.4
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• pp.448-451
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• 2008

Picrorhiza kurrooa Royle. is a well known medicinal plant among the indigenous medical practitioners of India. Present study is the first time to report the activity on the central nervous system. Preliminary study of the hot water extract showed significant depressant activity on the hole board test as evidenced from the ambulation and head dipping scores. The extract showed better activity compared to diazepam on the duration of pentobarbital induced sleeping time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1195-1198
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• 2003

Micro former has been known as a useful tool for machining micro parts. It makes micro holes automatically with punches, a hole-shape die and material by rotation of crank shaft synchronously. Micro displacement in micro forming affects on the performance of machining because micro forming size is similar with its mechanical displacement. Therefore, the measurement of this micro displacement is essential to be guaranteed to obtain high forming precision in the whole machine as well as its devices. This paper addresses the development of a laser interferometer to measure micro displacement for a micro former. The laser interferometer is able to measure micro displacement during a few micro seconds with non-contact. For the experiment, a laser probe is installed on the optical table with optical devices and a micro displacement generating device. The velocity decoding board is also added to calculate doppler shift frequency directly. Finally simple experiments are conducted to confirm its functional operation.

• Advances in Traditional Medicine
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• v.10 no.2
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• pp.86-89
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• 2010

Two common Indian spices Carum copticum Karst (ajowan) and Cinnamomum tamala T.Nees. (bay leaves) has been investigated first time to report the activity on the central nervous system. Preliminary study of the hot water extract showed depressant activity on the hole board test as evidenced from the ambulation and head dipping scores. The extracts further quicken the onset and increased the duration of pentobarbital induced sleeping time.

• Journal of Welding and Joining
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• v.17 no.1
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• pp.77-81
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• 1999

Through-hole PCB(Printed Circuit Board) was soldered by flow soldering process using cleaning or noncleaning fluxes. Preheating temperature and conveyor speed were changed in the range of 323∼413K and 0.3∼2m/min respectively. The soldered joints were tensile tested in order to evaluated bonding strength. As experimental results, relatively high tensile fracture load, 120∼140N, were obtained in case of preheating temperature of 383K, and conveyor speed was 0.6∼1.0 m/min. Fractured surfaces of higher tensile strength show some dimple area, while those of lower tensile fracture load show brittle fracture.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.133-133
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• 2015

최근 인쇄회로기판의 실장용 표면처리 개발에서 전도성이 우수하며, 또한 실장성도 우수한 치환형 무전해 은도금의 개발이 진행되고 있다. KENNY 등은 인쇄회로기판에서 가장 우수한 실장용 표면처리의 치환형무전해 은도금기술을 발견하였다. 이 기술은 무전해 니켈도금/치환금도금과 비교하여 비교적 낮은 비용으로 양산이 가능하며, 우수한 솔더링 특성과 신뢰성이 높은 것이 특징이다. 개발한 치환형 무전해 은도금은 무전해 니켈도금/치환금도금에 비해서 저온에서 처리가 가능하며, 처리시간도 짧은 것이 특징이다. 특히 대량생산과 미세한 블라인드 비어홀(BVH, Blind Via Hole) 내부로의 균일 석출을 위한 수평컨베이어나 수직침적라인 등에 모두 적용이 가능하다.

• Journal of Biomedical Engineering Research
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• v.20 no.1
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• pp.107-113
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• 1999

The purpose of this study was to develop a miniature imaging gamma probe with high performance that can detect small or residual tumors after surgery. Gamma probe detector system consists of NaI(Tl) scintillator, position sensitive photomultiplier tube (PSPMT), and collimator. PSPMT was optically coupled with 6.5 mm thick, 7.62 cm diameter of NaI(Tl) crystal and supplied with -1000V for high voltage. Parallel hexagonal hole collimator was manufactured for characteristics of 40-mm hole length, 1.3-mm hole diameter, and 0.22 mm septal thickness. Electronics consist of position and trigger signal readout systems. Position signals were obtained with summing, subtracting, and dividing circuit using preamplifer and amplifier. Trigger signals were obtained using summing amplifier, constant fraction discriminator, and gate and delay generator module with preamplifer. Data acquisition and processing were performed by Gamma-PF interface board inserted into pentium PC and PIP software. For imaging studies, flood and slit mask images were acquired using a point source. Two hole phantom images were also acquired with collimator. Intrinsic and system spatial resolutions were measured as 3.97 mm and 5.97 mm, respectively. In conclusion, Miniature gamma probe images based on the PSPMT showed good image quality, we conclude that the miniature imaging gamma probe was successfully developed and good image data were obtained. However, further studies will be required to optimize imaging characteristics.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.47-56
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• 2015

In this paper, the Thermal behavior and reliability characteristics of carbon CCL (Copper Claded Layer), which can be used as the core of HDI (High Density Interconnection) PCB (Printed Circuit Board) are evaluated through experiments and numerical analysis using CAE (Computer Aided Engineering) software. For the characterization of the carbon CCL, it is compared with the conventional FR-4 core and Heavy Cu core. From research results, the deformation amount of the flexure strength of PCB is the highest with pitch grade carbon and thermal behavior of PCB is lowest as temperature increases. In addition, TC (Thermal Cycling), LLTS (Liquid-to-Liquid Thermal Shock) and Humidity tests have been applied in the PCB with carbon core and the reliability of PCB with carbon core is confirmed through reliability tests. Also, possibility of uneven surface of the via hole and wear of the drill bit due to the carbon fibers are analyzed. surface of the via hole is uniform, the surface of the drill bit is smooth. Therefore, it is proved that the carbon CCL has the drilling workability of the same level as conventional core material.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.4 s.334
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• pp.45-52
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• 2005

This paper presents the characterization of through hole vias on printed circuit board (PCB) through the time domain and frequency domain measurements. The time domain measurement was performed on a single via using the TDR, and the model parameters were extracted by the fitting simulation using HSPICE. The frequency domain measurement was also performed by using 2 port VNA, and the model parameters were extracted by fitting simulation with ADS. Using the ABCD matrices, the do-embedding equations were derived probing in the same plane in the VNA measurement. Based on the single via characterization, the differential via characterization was also performed by using TDR measurements. The time domain measurements were performed by using the odd mode and even mode sources in TDR module, and the Parameter values were extracted by fitting with HSPICE. Comparing measurements with simulations, the maximum calculated differences were $14\%$ for single vias and $17\%$ for differential vias.