• 제목/요약/키워드: Hole Shrinkage

검색결과 28건 처리시간 0.023초

무수축 기판 상에 UV 레이저 가공에 의한 Taper 현상 (Taper phenomenon of UV-laser punching process on zero-shrinkage substrate)

  • 안익준;여동훈;신효순;심광보
    • 한국결정성장학회지
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    • 제25권6호
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    • pp.285-289
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    • 2015
  • 프로브카드의 소형화, 고기능화. 고집화에 따라 고강도 무수축 기판에 레이저 가공 공정을 이용한 미세 홀 천공에 대한 관심이 높아지고 있다. 그린 상태에서 레이저 펀처로 미세 홀을 천공 시 테이퍼 현상이 중요한 공정 문제가 되고 있다. Entrance hole과 exit hole의 크기 차이는 홀 크기가 작을수록 커지고, 홀 크기가 커질수록 작아지는 경향을 나타내었다. 테이퍼 현상을 개선하기 위해 second hole 가공 공정을 적용하였다. 기판의 두께가 $380{\mu}m$인 기판 상에 $80{\mu}m$ 홀 천공시 최적의 second hole 크기를 찾기 위해 $70{\sim}79{\mu}m$ 홀을 천공하였을 경우 $76{\mu}m$$77{\mu}m$에서 테이퍼는 11.9 %로 가장 낮게 나타났다. 천공된 무수축 기판을 소결한 후에는 테이퍼가 7 %로 개선되었다. First hole 크기와 비교하였을 때 second hole 크기는 first hole 크기의 약 95~97 % 일 때 테이퍼가 가장 적었다.

원사의 수축에 따른 다공성 편성물의 형태변화와 열·수분 전달특성 (The appearance change and heat·moisture transfer properties of knitted fabric by yarn shrinkage)

  • 상정선;박주현;이미식;오경화
    • 복식문화연구
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    • 제25권6호
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    • pp.880-892
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    • 2017
  • In this study, the appearance change and the heat moisture transfer properties of knitted fabric by yarn shrinkage were examined to obtain useful data on the development of thermo-sensitive functional materials. Eleven types of knitted fabric were knitted using highly bulky acrylic-blended yarn. After shrinking the specimens using dry heat treatment, the appearance change and thickness were measured. An HEC simulator was adopted for measuring the heat moisture transfer properties of specimens by yarn shrinkage. When holes were arranged vertically in the mesh structure, the specimens with 2,500 and 5,000 holes showed high percent change of hole area, appearance, and thickness. When holes were diagonally arranged in the mesh structure, the percent change of hole area in the specimen with 1,250 holes was larger than the one with 2,500 holes. However, the dimensional stability of the specimen with 2,500 holes was better because of its smaller appearance and thickness change. In the tuck structure, the percent change of hole area in the specimen with 625 and 416 holes was relatively large compared with the appearance and thickness change. Furthermore, the hole size in the tuck structure was smaller than that in the mesh structure but the percent change of hole area was larger. Therefore, it was proved that the tuck structure is more suitable than the mesh structure for developing thermo-sensitive functional materials. Heat moisture transfer property test verified that the change of hole area by yarn shrinkage enabled obtaining the thermal effect due to the distinct temperature difference in the inner layer.

알루미나/텅스텐 동시소성에 의한 다층 팩키지 제조시 적층조건에 따른 camber의 변화 (Changes of Camber on Lamination Conditions in alumina/Tungsten Cofiring Multilayer Package)

  • 성재석;구기덕;윤종광;이상진;박정현
    • 한국세라믹학회지
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    • 제34권6호
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    • pp.601-610
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    • 1997
  • In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

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리튬이온전지의 전해액 주입구 볼에 대한 Nd:YAG 레이저 용접성 (The Weldability of Aluminum Ball in Electrolyte Injection Hole by Nd:YAG Laser)

  • 김종도;유승조;김장수
    • 한국마린엔지니어링학회:학술대회논문집
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    • 한국마린엔지니어링학회 2005년도 후기학술대회논문집
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    • pp.25-26
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    • 2005
  • This study suggested the occurrence source of weld-defects and its solution methods in a welding of Electrolyte injection hole by pulsed Nd:YAG laser. In experiment, the ramp down was used in order that solidification crack was removed. Furthermore, shrinkage stress and heat input were reduced by changing of weld trajectory and defocused distance. As a results of a experiment, a sound weld bead shape and crack-free weld bead can be obtained.

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리튬이온전지의 전해액 주입구 볼에 대한 Nd:YAG 레이저 용접성 (The Weldability of Aluminum Ball in Electrolyte Injection Hole by Nd:YAG Laser)

  • 김종도;유승조;김장수
    • Journal of Advanced Marine Engineering and Technology
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    • 제30권6호
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    • pp.740-745
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    • 2006
  • This study suggested the occurrence source of weld-defects and its solution methods in a welding of Electrolyte injection hole by pulsed Nd:YAG laser. In experiment, the ramp down was used in order that solidification crack was removed. Furthermore. shrinkage stress and heat input were reduced by changing of weld trajectory and defocused distance. As a results of a experiment, a sound weld bead shape and crack-free weld bead can be obtained. In conclusion this show that the welding stability is greatly affected by modulation of laser pulse shape for the same laser energy and welding parameters.

알루미늄 사형주조에서 기공 결함 감소를 위한 연구 (A study on the reduction of blow hole defects in aluminum sand casting)

  • 이동연;이춘규
    • Design & Manufacturing
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    • 제14권4호
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    • pp.52-57
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    • 2020
  • In this study attempted to prevent defects due to blow holes among defects of sand casting products. It was intended to reduce the defect rate by reducing the blow hole of the inner surface. Currently, expectations and requirements for the quality level of non-ferrous aluminum casting in the casting industry are increasing. In addition, the shape is complex and the shrinkage precision is required. Among them, the test prototype is expensive to manufacture the mold, and the production time is also long, and the product is manufactured by sand casting. At this time, the highest defect rates are defects caused by shrinkage defects, surface defects, and blow holes.. At this study, the manufacturing time was shortened by using the shape of the fluid movement path in advance. Also, it is possible to reduce defects due to blow holes.

Multi-hole RF CCP 방전에서 방전 주파수가 미치는 영향

  • 이헌수;이윤성;서상훈;장홍영
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.145-145
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    • 2011
  • Recently, multi-hole electrode RF capacitively coupled plasma discharge is being used in the deposition of microcrystalline silicon for thin film solar cell to increase the speed of deposition. To make efficient multi-hole electrode RF capacitively coupled plasma discharge, the hole diameter is to be designed concerning the plasma parameters. In past studies, the relationship between plasma parameters such as pressures and gas species, and hole diameter for efficient plasma density enhancement is experimentally shown. In the presentation, the relationship between plasma deriving frequency and hole diameter for efficient multi-hole electrode RF capacitively coupled plasma discharge is shown. In usual capacitively coupled plasma discharge, plasma parameter, such as plasma density, plasma impedence and plasma temperature, change as frequency increases. Because of the change, the optimum hole diameter of the multi-hole electrode RF capacitively coupled plasma for high density plasma is thought to be modified when the plasma deriving frequency changes. To see the frequency effect on the multi-hole RF capacitively coupled plasma is discharged and one of its electrode is changed from a plane electrode to a variety of multi-hole electrodes with different hole diameters. The discharge is derived by RF power source with various frequency and the plasma parameter is measured with RF compensated single Langmuir probe. The shrinkage of the hole diameter for efficient discharge is observed as the plasma deriving frequency increases.

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무수축 LTCC 공정 중 Via Paste의 조성에 따른 Via 주변의 기공감소에 관한 연구 (Study on Reduction of Via hole Pore by Composition variation of Via paste during LTCC Constrained Sintering Process)

  • 조현민;김종규
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.233-234
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    • 2006
  • In this paper, Via hole pore were investigated during PLAS (PessureLess Assisted Constrained Sintering) process of LTCC. Ag and Ag-Pd paste mixture were tested for via paste. Ag paste with 10~25% Ag-Pd paste showed no via hole pore, but further increase of Ag-Pd contents in via paste increased via pore. From shrinkage curve, 10~25% Ag-Pd paste showed expansion behaviors before shrink and this phenomena result in the reduction of via hole pore during PLAS process.

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쾌속조형 듀라폼 성형체에서의 배치각 변화에 따른 주얼리주조모형의 형상요소변화 (Jewelry Model Cast Elements Evolution with Alignment Angle in DuraForm Rapid Prototyping)

  • 주영철;송오성
    • 한국주조공학회지
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    • 제21권5호
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    • pp.290-295
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    • 2001
  • We fabricated test samples containing various shape elements and surface roughness checking points for the jewelry cast master patterns by employing the 3D computer aided design (CAD), selective laser sintering (SLS) rapid prototype (RP) with the DuraForm powders. We varied the alignment angle from $0^{\circ}$ to $10^{\circ}$ at a given layer thickness of 0.08 and 0.1mm, respectively, in RP operation. Dimensions of the shape elements as well as values of surface roughness are characterized by an optical microscope and a contact-scanning profilometer. Surface roughness values of the top and vertical face increased as the alignment angle increased, while the other roughness values and shape elements variation were not depending on the alignment angle. The resolution of the shape realization was enhanced as the layer thickness became smaller. The minimum diameter of the hole, common in jewelry design, was 1.2 mm, and the shrinkage became 12% at the 1.6 mm-diameter hole, Our results implied that we face down the proposed design elements with $0^{\circ}$ alignment angle, and consider the shrinkage effect of each shape element in DuraForm RP jewelry modeling.

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금형보정을 이용한 PCB 품질향상에 관한 실험 (A Test on Quality Improvement of Printed Circuit Board Using Mold Compensation)

  • 전영호;권이장
    • 품질경영학회지
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    • 제25권1호
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    • pp.135-141
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    • 1997
  • The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-$150^{\circ}C$) than the normal. Then, this test condition of high temperature may cause such quality problems as hole eccentricity and reduction of distance between part holes. After measuring the CCL shrinkage affected by temperature, the correction factor of a press mold was a, pp.ied to solve these problems. The results showed that the tolerance of hole pitch(${\pm}$$100{\mu}m$) was satisfactory and the internal and external failure costs were reduced by 55%.

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