• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.6
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• pp.285-289
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• 2015

With the miniaturization with both high functionality and high integrity of the probe cards, the highly precise laser punching on the zero-shrinkage high strength substrate has attracted more attention recently. Taper occurrence during laser-punching on green sheets appears as a problem in process. The size (diameter) difference between the entrance hole and the exit hole in tapered holes appeared to be inversely proportional to the hole size itself. To suppress taper occurrence, two-stage punching was adopted as the size of second hole was varied from $70{\mu}m$ to $79{\mu}m$ when punching $80{\mu}m$ via holes on the substrate with thickness of $380{\mu}m$. The minimal taper ratio of 11.9 % appeared with second hole size between 70 to $79{\mu}m$ before sintering. Taper ratio reduced to 7 % after zero-shrinkage sintering. The size difference between first hole and second hole appeared minimal when the size of second hole was 95~97 % to that of first hole.

• Transactions of Materials Processing
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• v.12 no.4
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• pp.314-319
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• 2003

In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, strain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu$m, 25 $\mu$m micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with those of macro holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover. burnish zone, fracture zone and burr, and it shows similar fracture behavior in shear band. But by high strain rate (10$^2$∼10$^3$s$^{-1}$ ) condition unlike that of macro hole fabrication and by the increment of relative grain size in the direction of the workpiece thickness, fracture zone is not observed.

• Journal of KIISE:Information Networking
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• v.35 no.5
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• pp.367-373
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• 2008

Recently, the NAT middlebox widely deployed in the home network environment prohibits DM operations from reaching user devices behind NAT. In this article, we focus on NAT issues to manage home network devices. Particularly, we discuss standardization efforts, and present our proposal to deploy DM services for VoIP and IPTV devices under NAT. By slightly changing behaviors of Simple Network Management Protocol (SNMP) Manager and Agent, and defining additional Management Objects (MOs) to gather NAT binding information, we could solve the NAT traversal problem under symmetric NAT. Moreover, we propose an enhanced method to search the UDP hole binding time of the NAT box. We applied our method to randomly selected 22 VoIP devices out of 194 NATed hosts in the real broadband network and have achieved 99% of the success ratio for exchanging SNMP request messages and 26% of enhancement for searching the UDP hole binding time.

• Transactions of Materials Processing
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• v.30 no.2
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• pp.74-82
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• 2021

Stretch-flangeability, which is the ability of sheet steels to be deformed into complex shapes, is a critical formability property in automobile body parts. In this study, the center-hole for hole expansion test, which is normally used to evaluate the stretch-flangeability of sheet steels, was prepared by both punching and electrical discharge machining (EDM) methods. Hole expansion ratio (HER) of punched hole was far lower than the HER of EDM drilled hole because of damage/crack in hole-edge due to punching process. The effect of hole-edge condition on HER was quantified by mechanical, fractographic and geometric factors. Based on these factors, the empirical equation used to determine HER for various sheet steels was derived using non-linear regression.

• Journal of KIISE:Information Networking
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• v.35 no.4
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• pp.268-281
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• 2008

It is difficult to construct streaming services based on the overlay networks without any loss of scalability. DONet is one of the most representative streaming overlay network protocols without managing any specific structure. Since DONet does not support the nodes on private networks, it can be considered that the performance of the overlay is not the best. Hole Punching is one of the famous techniques participating the nodes on private networks to streaming overlay networks by using a rendezvous server. However, using only a single rendezvous server cannot be suggested in P2P environment, because it can cause problems in terms of scalability and so on. In this paper, we propose DONet-p, an extension of DONet with Distributed Hole Punching techniques. It supports the nodes on private networks without toss of scalability. The experimental results show the better performance and scalability than DONet with a minimum overhead for additional control messages.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.230-235
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• 2003

In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, stain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu\textrm{m}$, 25 $\mu\textrm{m}$ micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with man holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover, burnish zone, fracture zone and it shows similar fracture behavior in shear band, but？ by high strain rate (10$^2$∼ 10$^3$s$\^$-1/) unlike macro hole fabrication and increment of relative grain size several different results are shown.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.3
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• pp.61-67
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• 2004

In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. In this study, magnetic field-assisted polishing technique is applied to remove the burr which exists in nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals was investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.329-333
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• 2003

In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. In this study, magnetic field assisted polishing technique is applied to remove the burr which exists in nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals was investigated changing with polishing time. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.