• Proceedings of the KWS Conference
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• 2002.10a
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• pp.555-560
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• 2002

Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.975-978
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• 2008

Novel sulfur-containing aromatic compounds were developed as stable, high-performance organic semiconductors for OTFT applications. Of them, dinaphtho[2,3-b:2',3'-f]thieno[3,2-b]thiophene (DNTT) consisting of six aromatic rings gave high quality thin films by vapor deposition, which acted as a superior FET channel showing FET mobility as high as $3.0\;cm^2V^{-1}s^{-1}$. On the other hand, highly soluble 2,7-dialkyl[1]benzothieno[3,2-b][1]benzothiophenes ($C_n$-BTBTs) gave solution-processible OTFTs with FET mobility higher than $1.0\;cm^2V^{-1}s^{-1}$.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.28-30
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• 2009

PDP panels with MgO protective layer are manufactured by using the "all-in-vacuum" process we have established [1]. This is the process aiming to keep the MgO surface as clean as possible after the evaporation. The panels are evaluated in term of discharge voltage, aging time, luminance, luminous efficacy, discharge time-lag. It is confirmed that the "all-in-vacuum" process particularly improves the aging time, discharge voltage and the discharge time-lag.

• Proceedings of the Membrane Society of Korea Conference
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• 2004.05a
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• pp.39-42
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• 2004

Ceramic membranes have attracted a great attention because they have excellent resistance to most organic solvents and can be used over a wide temperature range. Especially, titania (titanium oxide, TiO$_2$) shows excellent chemical resistance and can be used both acidic and alkali solutions, and therefore, titania is one of the most promising materials for the preparation of porous membranes; titania membranes having pore sizes in the range of nanofiltration (NF) to ultrafiltration (UF) membrane have been prepared by the sol-gel process (Tsuru 2001).(omitted)

• Journal of Ocean Engineering and Technology
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• v.15 no.1
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• pp.45-51
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• 2001

In order to clarify the seasonal variation of the residual current and the material transportation process in Hiroshima Bay, JAPAN, the real-time simulation of residual current and particle tracking by using the Euler-Lagrange model were carried out. The calculated tidal current, water temperature, and salinity showed good agreement with the observed ones. The residual currents showed a southward flow pattern at the upper layer, and a northward flow pattern at the lower layer. The flow structure of the residual current in Hiroshima Bay is an estuarine circulation affected by density flow and wind driven current. The residual current plays an important role of material transportation in the bay.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.28-29
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• 2006

High-Speed Centrifugal Compaction Process (HCP) is a wet compacting method, in which powders are compacted under a huge centrifugal force. The HCP was well applied to small alumina specimens, but the compact easily cracked when we applied the HCP to other materials. We clarified how the cracks introduced and found that the formation of such a flow pattern was related to the Colioli's force in the centrifugal field.

• Proceedings of the Korea Water Resources Association Conference
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• 2005.09b
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• pp.1187-1188
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• 2005

• Proceedings of the Korea Water Resources Association Conference
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• 2005.09b
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• pp.1203-1204
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• 2005

• Proceedings of the Korean Aquaculture Society Conference
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• 2004.05a
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• pp.201-202
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• 2004

• Proceedings of the KSEEG Conference
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• 2001.04a
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• pp.240-242
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• 2001