• Journal of Institute of Control, Robotics and Systems
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• v.9 no.12
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• pp.994-1000
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• 2003

A new relative motion control methodology for a following system to an independent leading system is proposed for controlling relative position, velocity, and tension etc. It is based on maintaining minimum relative error between two independent systems. The control command of the following system to a leading system is generated by adding the current command and the output of the relative error compensation. The proposed control method is implemented on the experimental equipment which is a wire winding-unwinding system to control the tension of the line. The results show the unwinding system(follower) following the independent motion of the winding system(leader) to control the constant tension of the line in order to keep the roller dancer in reference position. The relative motion control method proposed in this paper can be applied to high precision equipment for unwinding and winding fine wire, fine fiber, and tape etc.

• Journal of Electrical Engineering and Technology
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• v.5 no.4
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• pp.597-605
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• 2010

This paper presents a contribution to parameter identification of a non-linear system using a new strategy to improve the genetic algorithm (GA) method. Since cost function plays an important role in GA-based parameter identification, we propose to improve the simple version of GA, where weights of the cost function are not taken as constant values, but varying along the procedure of parameter identification. This modified version of GA is applied to the induction motor (IM) as an example of nonlinear system. The GA cost function is the weighted sum of stator current and rotor speed errors between the plant and the model of induction motor. Simulation results show that the identification method based on improved GA is feasible and gives high precision.

• Proceedings of the KIEE Conference
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• summer
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• pp.1049-1051
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• 2004

This paper presents the analysis and the design of IPMSM for high speed limit with constant torque. The characteristics of IPMSM are calculated by using d-q equivalent circuit having the parameters, such as current phase angle, d-q axis inductances, effective turns. These parameters affect the output characteristics. In this paper, the improved IPMSM to widen the operating speed limit are designed by the results.

• Proceedings of the Korea Information Processing Society Conference
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• 2022.11a
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• pp.188-190
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• 2022

본 연구에서는 정전류(Constant Current) 방식에 전압강하법을 이용하여 접촉저항 측정 시스템을 구현하고 측정값을 블루투스 통신을 통해 안드로이드 운영체제에서 확인할 수 있도록 앱을 개발한다. 측정가능한 범위로 0 Ω에서 10.24 Ω 사이의 접촉 저항을 MCP3424 18 bit 분해능 ADC를 사용하여 측정할 수 있도록 설계하였다. 기존에는 반고정 저항과 별도의 전류계를 이용하여 정전류를 설정하였으나, 본 연구에서는 측정의 정밀도 및 편리성 개선을 위해 0.1% 고정밀 고정저항을 병렬로 4개 연결하여 구현하였으며, 또한 1:1 Unity Gain Buffer를 구성하고 Ultra High Precision Z-Foil 방식으로 오차 0.01%, 온도 계수 0.05 ppm/℃ 저항을 사용하여 실제로 측정한 샘플 저항 값의 결과를 확인하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• Current Optics and Photonics
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• v.8 no.2
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• pp.162-169
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• 2024

This study investigates the temperature sensitivities of fiber Bragg grating (FBG) across a broad temperature spectrum ranging from -196 ℃ to 900 ℃. We developed the FBG temperature measurement system using a high-temperature tubular furnace and liquid nitrogen to supply consistent high and low temperatures, respectively. Our research showed that the FBG temperature sensitivity changed from 1.55 to 10.61 pm/℃ in the range from -196 ℃ to 25 ℃ when the FBG was packaged with a quartz capillary. In the 25-900 ℃ range, the sensitivity varied from 11.26 to 16.62 pm/℃. Contrary to traditional knowledge, the FBG temperature sensitivity was not constant. This inconsistency primarily stems from the nonlinear shifts in the thermo-optic coefficient and thermal expansion coefficient across this temperature spectrum. The theoretically predicted and experimentally determined temperature sensitivities of FBGs encased in quartz capillary were remarkably consistent. The greatest discrepancy, observed at 25 ℃, was approximately 1.3 pm/℃. Furthermore, it was observed that at 900 ℃, the FBG was rapidly thermally erased, exhibiting variable reflected intensity over time. This study focuses on the advancement of precise temperature measurement techniques in environments that experience wide temperature fluctuations, and has considerable potential application value.