• 전기학회논문지P
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• 제53권2호
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• pp.94-99
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• 2004

In this paper, We design a RF control system capable of handling multiple POS thermal printers. The system has three parts including embedded master controller, RF controller and high-speed thermal printer. Specially the designed linux embedded controller has simple structure and high performance to connect the TCP/IP network. The effectiveness of the developed RF control system is shown by proposed food ordering system.

• 한국세라믹학회지
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• 제49권4호
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• pp.380-384
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• 2012

This paper deals with the recent developments of high thermal conductivity silicon nitride ceramics. First, the factors that reduce the thermal conductivity of silicon nitride are clarified and the potential approaches to realize high thermal conductivity are described. Then, the recent achievements on the silicon nitride fabricated through the reaction bonding and post sintering technique are presented. Because of a smaller amount of impurity oxygen, the obtained thermal conductivity is substantially higher, compared to that of the conventional gas-pressure sintered silicon nitride, while the microstructures and bending strengths are similar to each other between these two samples. Moreover, further improvement of the thermal conductivity is possible by increasing ${\beta}/{\alpha}$ phase ratio of the nitrided sample, resulting in a very high thermal conductivity of 177 W/($m{\cdot}K$) as well as a high fracture toughness of 11.2 $MPa{\cdot}m^{1/2}$.

• Journal of Electrical Engineering and Technology
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• 제12권4호
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• pp.1503-1510
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• 2017

In this paper, a thermal analysis of a high speed induction motor with a PWM voltage source was performed by considering harmonic loss components. The electromagnetic analysis of the high speed induction motor was conducted using the time-varying finite element method, and its thermal characteristics were carried out using the lump-circuit method. Harmonic losses from tests in the high frequency region were divided into core loss and conductor loss components using various ratios, in order to determine the loss distributions for the thermal analysis. The results from both the calculations and experiment were validated using a high speed induction motor prototype operating at 20,000rpm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.447-448
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• 2006

High speed machining is the core technology that influences the performance of machine tools, and the high speed motor spindle is widely used fur the high speed machine tools recently. The important problem in this spindle is to reduce and minimize the thermal effect by motor and bearing. In this study, the analysis of thermal characteristic of spindle is performed according to the cooling methods of housing by using finite element method. This result can be applied to the design and manufacture of the high speed spindle.

• 반도체디스플레이기술학회지
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• 제3권4호
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• Structural Engineering and Mechanics
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• 제53권4호
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• pp.645-659
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• 2015

This research investigates the thermoelastic transient behavior of a thermally loaded slab made of a thermal diode-like material which has two directional thermal conductivity values (low and high). Finite difference analysis is used to obtain the elastic response of the slab based on the temperature solutions. It is found that the rate of heat transfer through the thickness of the slab decreases with reducing the ratio between the low and high thermal conductivity values (R). In addition, reducing R makes the slab less responsive to the thermal load when heated from the direction associated with the low thermal conductivity value.

• 한국정밀공학회지
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• 제26권7호
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• pp.120-126
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• 2009

Thermal displacement of high speed spindle is very important problem to be solved. To solve heat generation and thermal displacement problems that influence on the product accuracy, it is very important to predict thermal characteristics of the spindle and it is positively necessary to select the conditions of cooling, flow rate and preload of bearings. In this paper, 30,000rpm($1.455{\times}10^6DmN$) spindle was designed and produced. The analysis of thermal deformation for heat generation of inner spindle was carried out using commercial program $ANSYS^{(R)}$ and the result was compared with measured data using $LabVIEW^{(R)}$ and SGXI-1600, 1125 and 1126 module. Temperature distribution and thermal displacement according to spindle speed are measured. Using this method, it is possible to predict and to improve thermal characteristic of high speed spindle by control spindle speed, bearing preload and cooling rate.

• 한국압력기기공학회 논문집
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• 제7권4호
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• pp.44-50
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• 2011

Turbulent mixing of hot and cold coolants is one of the possible causes of high cycle thermal fatigue in piping systems of nuclear power plants. A typical situation for such mixing appears in turbulent flow through a T-junction. Since the high cycle thermal fatigue caused by thermal striping was not considered in the piping fatigue design in several nuclear power plants, it is very important to evaluate the effect of thermal striping on the integrity of mixing tees. In the present work, before conducting detailed evaluation, three thermal striping evaluation methodology suggested by EPRI, JSME and NESC are analyzed. Then, a by-pass pipe connected to the shutdown cooling system heat exchanger is investigated by using these evaluation methodology. Consequently, the resulting thermal stresses and the fatigue life of the mixing tee are reviewed and compared to each other. Futhermore, the limitation of each methodology are also presented in this paper.

• 전기학회논문지
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• 제57권12호
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• pp.2276-2280
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• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2008년도 추계학술발표대회 논문집
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• pp.220-225
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• 2008

Cylindrical stainless-steel/sodium heat pipe for a high-temperature solar thermal application was manufactured and tested for transient and steady-state operations. Two layers of stainless-steel screen mesh wick was inserted as a capillary structure. The outer diameter of the heat pipe was 12.7 mm and the total length was 250 mm. The effective heat transport length, the thermal load, and the operating temperature were varied as thermal transport conditions of the heat pipe. The thermal load was supplied by an electric furnace up to 1kW and the cooling was performed by forced convection of air The effective thermal conductivity and the thermal resistance were investigated as a function of heat flux, heat transport length, and vapor temperature. Typical range of the total effective thermal conductivity was as low as 43,500 W/m K for heat flux of 176.4 kW/$m^2$ and of operating temperature of 1000 K.