• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.4 s.37
• /
• pp.331-338
• /
• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.11 no.2
• /
• pp.105-111
• /
• 2012

High speed machining is the core technology that influences the performance of machine tools, and the high speed motor spindle is widely used for the high speed machine tools. The important problem in high speed spindle is to minimize the thermal effect by motor and bearing and frequency effect. This paper presents the thermal characteristic analysis and frequency experiment for a high speed spindle considering the flow rate of cooling oil. A high speed spindle is composed of angular contact ceramic ball bearings, high speed built-in motor, oil cooling jacket and so on. The thermal analyses of high speed spindle need to minimize the thermal effect and maximize the cooling effect and they are carried out under the various cooling conditions. Heat generations of the bearing and the high speed motor are estimated from the theoretical and experimental data. To find out the characteristic of vibration, the high speed spindle is excited in operational range. This result can be applied to the design and manufacture of a high speed tapping spindle.

• Journal of Information Display
• /
• v.13 no.1
• /
• pp.1-6
• /
• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.1 s.178
• /
• pp.193-200
• /
• 2006

To perform the finish grinding process of ferrules which are widely used as fiber optic connectors, a high-precision centerless grinding machine is necessary. The high-precision centerless grinding machine is consisted of the hydrostatic GW and RW spindle systems, hydrostatic RW feeding mechanism, RW swivel mechanism, on-machine GW and RW dressers, and concrete-filled steel bed. In this study, the thermal characteristics of the high-precision centerless grinding machine such as the temperature distribution, temperature rise and thermal deformation, are estimated based on the virtual prototype of the grinding machine and the heat generation rates of heat sources related to the machine operation conditions. The reliability of the predicted results is demonstrated by the temperature characteristics measured from the physical prototype. Especially, the predicted and measured results show the fact that the high-precision centerless grinding machine has very stable thermal characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.11a
• /
• pp.195-198
• /
• 2000

It can be acquired the high effective productivity through of high speed, precision of machine tools, and then, machine tools will be got a competitive power. Industrially advanced countries already developed that the high speed feed is 60m/min using the high speed ball screw. Also, a lot of problems have happened the feed drive system. It is necessary to study about the characteristics of thermal deformation played a more critical role than static stiffness and dynamic rigidity in controlling the level of machining accuracy. In spite of the improving the thermal deformation characteristics of machine tools at the design stage, there are always some residual errors that have to be compensated for during machining. In this study, thermal deformation error automated compensation device with multiple linear regression is proposed that thermal deformation error can be eliminated at the machining stage. The developed device has been practically applied to the feed drive unit.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.14 no.6
• /
• pp.31-36
• /
• 2005

Use of the high frequency motor spindles are increasing for the high speed machine tools recently. The important problem in the high speed spindles is to reduce and minimize the thermal effect by the motor and ball hearings. Thermal characteristics according to the bearing preload and spindle cooling are studied for the spindle with the oil mist lubrication and high frequency motor. Temperature distribution and thermal displacement according to the spindle speed, preload and flow rate are measured. Temperature distribution and thermal displacement of the high speed spindle system can be estimated reasonably by using the three dimensional model through the finite element method. The results of analysis are compared with the measured data. This study supports thermal optimization and find out more effective cooling condition. This paper show that the suitable preload and spindle cooling are very effective to minimize the thermal effect by the motor and ball bearings.

• Journal of Space Technology and Applications
• /
• v.3 no.3
• /
• pp.257-279
• /
• 2023

Korea Aerospace Research Institute has developed 6U Nano-Satellite high resolution video and image (HiREV) for the purpose of developing core technology for deep space exploration. The 6U HiREV Nano-Satellite has a mission of high-resolution image and video for earth observation, and the thermal pointing error between the lens and the camera module can occur due to the high temperature in camera module on mission mode. The thermal pointing error has a large effect on the resolution, so thermal design should solve it because the HiREV optical camera is developed based on commercial products that are the industrial level. So, when it operates in space, the thermal design is needed, because it has the best performance at room temperature. In this paper, three passive thermal designs were performed for the camera mission payload, and the thermal design was proved to be effective by performing on-orbit thermal analysis.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2005.05a
• /
• pp.138-143
• /
• 2005

The important problem in the high speed spindles is to reduce and minimize the thermal effect by the motor and ball bearings. Thermal characteristics according to the bearing preload and hollow shaft cooling are studied for the spindle with the oil mist lubrication and high frequency motor. Temperature distribution and thermal deformation according to the spindle speed, preload and flow rate are measured by thermocouple and gap sensor. Temperature distribution and thermal deformation are analyzed by using the finite element method. The results of analysis are compared with the measured data. This paper show that the suitable preload and hollow shaft cooling are very effective to minimize the thermal effect by the motor and ball bearings. This study indicates that temperature distribution and thermal deformation of the high speed spindle system can be estimated reasonably by using the three dimensional model through the finite element method and supports thermal optimization and more effective cooling method.

• Journal of the Semiconductor & Display Technology
• /
• v.12 no.1
• /
• pp.29-33
• /
• 2013

We have fabricated transparent polymer composite films with high thermal emissivity, which can be used for heat dissipation of transparent electronics. PMMA (poly(methyl methacrylate)) solution with high transparency and thermal emissivity is mixed with various fillers (carbon nanotubes (CNTs), aluminum nitride (AlN), or silicon carbide (SiC)) with high thermal conductivity. We have achieved the thermal emissivity as high as 0.94 by the addition of CNTs. Compared with the PMMA film on glass, however, the addition of AlN or SiC is shown to rather decrease the thermal emissivity. It is also observed that the thickness of the PMMA film does not affect its thermal emissivity. To avoid any degradation of the thermal conductivity, therefore, the PMMA film thickness is desirable to be $1{\mu}m$. There also exists a tradeoff between the optical transmittance and thermal conductivity on the selection of the amount of fillers.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2003.04a
• /
• pp.93-98
• /
• 2003

High speed precision machines have been introduced to the CNC industry in order to improve productivity, shorten the appointed date of delivery and reduce the prime cost. High speed machines have more functions then general machines, and they were proved in performance. The production and sales of the high speed machines have been increased not only in domestic market but also all over the world. Accordingly, machines are faster, there are lots of problems to be solved. One of the most difficult problems is the thermal displacement on the main spindle due to generated heat while the spindle is rotated in high speed. Since the thermal displacement directly effects the quality of the machined parts, utmost efforts to minimize the thermal displacement have to be given from the beginning of designing machines. In practice, variety of methods are attempted and practiced to minimize the thermal displacement such as design of symmetrical frame, adoption of high speed bearings, application of compensation system using non-contact sensor and use of forced circulating lubrication system with oil cooler. Even if these variable methods have been practically used in the industrial field, generated heat has not been Perfectly Prevented lienee, in this paper, the characteristics of thermal displacement were investigated when several kinds of oil were tested for a high speed machine with forced circulating lubrication system within the same atmosphere and under the same conditions.