• Corrosion Science and Technology
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• 제7권6호
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• pp.324-327
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• 2008

Stainless steels have been widely used as a building exterior materials in Asian countries for the last decade. It is required for the materials in this field to have an aesthetic appearance, a relatively high strength, and an excellent corrosion resistance. Other metallic materials such as copper, aluminum, and carbon steels have been also used as the exterior materials. Considering the cost of maintenance, stainless steel, having the outstanding corrosion resistance, is replacing other materials in the several parts in the building exteriors. Ferritic stainless steel has been applied as the roofing materials because its thermal expansion is much smaller than that of austenitic stainless steel. Therefore, it is suitable for the large-scale construction such as airport terminal, convention center, and football stadium. To improve the corrosion resistance of the ferritic stainless steels, the modification of alloy composition has been studied to develop new grade materials and the progress in the surface technology has been introduced. Corrosion properties of these materials were evaluated in the laboratory and in the field for longer than two years. High-Cr ferritic stainless steel showed excellent corrosion resistance to the atmospheric environments. In the region close to the sea, the corrosion resistance of high-Cr ferritic stainless steel was much superior to that of other materials, which may prove this steel to be the appropriate materials for the construction around seashore. In some of the large constructions around seashore in South Korea, high-Cr ferritic stainless steels have been used as the building exterior materials for six years.

• 한국재료학회지
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• 제15권4호
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• pp.281-284
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• 2005

Room and high temperature deformation behaviors of Cu-Zr-Ti-Pd bulk metallic glasses produced by copper mold casting were investigated. The addition of Pd was shown to enhance the glass forming ability and thermal stability of Cu-Zr-Ti base bulk metallic glass. The compressive strength of $Cu_{55}Zr_{30}Ti_{10}Pd_5$ bulk metallic glass was 2230 MPa with 1.8 plastic strain. The stress overshoot and yield drop phenomenon were observed below $487^{\circ}C$ and a drastic decrease in the flow stress was observed at $487^{\circ}C$. The stress overshoot is thought to be associated with stress-induced structural relaxation.

• 디자인학연구
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• 제17권4호
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• pp.241-250
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• 2004

이 논문은 현재에 통용되고 있는 동합금판 C2200, C5210, C7701, C8113 등의 특징 및 용도와 소재의 재질적 특성을 data화하였고, 그 표현의 가능성을 조사하여 수치화하였고, 그 기법실험의 1단계로서 일반접합과 TIG 접합에 대하여, 2단계 실험으로서 망상조직기법과 전해주조기법에 대하여 농하였으며, 이 기법을 응용한, 연구작품의 3가지 사례를 다루었다. 이 때 사용한 동합금은 (주)풍산금속 소재기술연구소 이동우 박사가 지원한 4가지 동합금, 즉 단동, 스프링용 인청동, 스프링용 양백, 백동을 사용하여, 적층기법, 망상조직기법, 융합기법, 전해주조기법을 작품에 따라서 통합 또는 부분적으로 적용시켰다. C2200 의 경우, 황동은 2mm이하의 박판(薄板)에서는 교류 TIG 용접법이 좋으며 그 이상에서는 직류 정극성 TIG 용접법으로, 용접에 의한 잔류 응력부식을 열처리를 250~300도에서 행한다. C5210 의 경우는 고온의 환원성기(還元性氣)중에서도 수소(水素) 취성이 없고 고온에서 O를 흡수하지 않으며, 경화(輕化) 온도도 약간 높아, 용접용으로 매우 적합하다. 일반적으로 Sn을 2-9% P를 0.03-0.4%정도 포함하고 있는데, Sn의 함유량이 증가함에 따라 응고 온도 범위가 광범위해졌으며 용접후의 냉각 시, 열분열 방지에는 TIG용접의 용접속도를 빠르게, 용융지(溶融池)를 작게, 예열 온도는 200도로 하는 것이 좋다. C7701의 경우는 조성범위가 10-20% Ni, 15-30% Zn의 것이 많이 사용된다. 약 30% Zn 이상이 되면(${\alpha}+{\beta}$) 조직이 되어 점성이 낮아지고 냉간 가공성은 저하하나 열간 가공성은 좋다. 양백은 또한 전기저항이 높고 내열, 내식성이 좋다. C8113의 경우는 내해수성, 내마모성이 우수하며 고온 강도가 높고 백동은 10-30% 니켈을 포함하며 완전히 고용(固溶)해서 단상(單相)이 된다. 이 때문에 결정입(結晶粒)도 크게 되기 쉬우며, 구속이 강한 경우 미량의 Pb, P, S라는 분열 감수성이 높아진다.

• Journal of Electrochemical Science and Technology
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• 제11권2호
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• pp.172-179
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• 2020

The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of gold with the cartage of 18K and other standard karats that should be observed in the manufacturing of the gold and jewelry artifacts, comparing the rate of gold-copper deposition by direct and pulsed current was done. The rate of deposition with pulse current was significantly higher than direct current. In this process, the duty cycle parameter was effectively optimized by the "one factor at a time" method to achieve maximum deposition rate. Particular parameters in this work were direct and pulse current densities, bath temperature, concentration of gold and cyanide ions in electrolyte, pH, agitation and wetting agent additive. Scanning electron microscopy (SEM) and surface chemical analysis system (EDS) were used to study the effect of deposition on the cross-sections of the formed layers. The results revealed that the Au-Cu alloy layer formed with concentrations of 6gr·L^-1 Au, 55gr·L^-1 Cu, 24 gr·L^-1 KCN and 1 ml·L^-1 Lauryl dimethyl amine oxide (LDAO) in the 0.6 mA·cm^-2 average current density and 30% duty cycle, had 0.841 ㎛·min^-1 Which was the highest deposition rate. The use of electrodeposition of pure and alloy gold thick layers as a production method can reduce the use of gold metal in the production of hallow gold artifacts, create sophisticated and unique models, and diversify production by maintaining standard karats, hardness, thickness and mechanical strength. This will not only make the process economical, it will also provide significant added value to the gold artifacts. By pulsating of currents and increasing the duty cycle means reducing the pulse off-time, and if the pulse off-time becomes too short, the electric double layer would not have sufficient growth time, and its thickness decreases. These results show the effect of pulsed current on increasing the electrodeposition rate of Au-Cu alloy confirming the previous studies on the effect of pulsed current on increasing the deposition rate of Au-Cu alloy.

• 한국가스학회지
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• 제18권6호
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• pp.27-31
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• 2014

본 연구에서는 LP가스 용기용 밸브에서 취약할 것으로 예상되는 Part 1, Part 2, Part 3 지역에 대한 강도안전성을 FEM으로 해석하였다. 밸브의 두께가 1.5mm이고, LPG 압력이 3.5MPa일 때 밸브의 Part 1 모서리 부분에서 27.5MPa의 Von Mises 최대응력이 걸리는 것으로 나타났다. 또한, 밸브의 두께가 1.5mm이고, LPG 압력 3.5MPa이 밸브에 작용할 때 Von Mises 최대응력은 Part 2에서 41.5MPa, 그리고 Part 3에서 46.5MPa으로 나타났다. 이러한 FEM 해석결과는 밸브의 Part 1, Part 2, Part 3에 작용하는 Von Mises 최대응력 모두가 황동소재 C3604의 항복강도 대비 9.2~15.5% 수준으로 대단히 낮은 값을 나타내고 있다. 이것은 기존의 LP가스 용기용 밸브의 두께가 지나치게 과도한 설계를 하였다는 것을 의미한다. 따라서, 밸브의 Part 1과 Part 2 지역의 두께는 황동밸브의 경량화 차원에서 얇게 설계하는 것이 바람직하다. 반면에 Part 3 지역의 두께는 기존의 밸브 두께처럼 두껍게 설계하여 높은 체결토크에도 안전한 강도를 유지하는 것이 좋다.

• 한국전기전자재료학회논문지
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• 제29권8호
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• pp.516-521
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• 2016

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile, and many other applications due to their excellent physical and electric properties. Especially, Mo-Cu composites with 5 ~ 20 wt.% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength, and prominent electrical and thermal conductivity. In most of the applications, highly-dense Mo-Cu materials with homogeneous microstructure are required for better performance. In this study, Mo-Cu alloys were prepared by PBM (planetary ball milling) and SPS (spark plasma sintering). The effect of Cu with contents of 5~20 wt.% on the microstructure and thermal properties of Mo-Cu alloys was investigated.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2001년도 추계학술강연 및 발표대회
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• pp.7-7
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• 2001

The increasing interest in light weight materials coupled to the need for cost -effective processing have combined to create a significant opportunity for aluminum P/M. particularly in the automotive industry in order to reduce fuel emissions and improve fuel economy at affordable prices. Additional potential markets for Al PIM parts include hand tools. Where moving parts against gravity represents a challenge; and office machinery, where reciprocating forces are important. Aluminum PIM adds light weight, high compressibility. low sintering temperatures. easy machinability and good corrosion resistance to all advantages of conventional iron bm;ed P/rv1. Current commercial alloys are pre-mixed of either the AI-Si-Mg or AL-Cu-Mg-Si type and contain 1.5% ethylene bis-stearamide as an internal lubricant. The powder is compacted in closed dies at pressure of 200-500Mpa and sintered in nitrogen at temperatures between $580~630^{\circ}C$ in continuous muffle furnace. For some applications no further processing is required. although most applications require one or more secondary operations such as sizing and finishing. These sccondary operations improve the dimension. properties or appearance of the finished part. Aluminum is often considered difficult to sinter because of the presence of a stable surface oxide film. Removal of the oxide in iron and copper based is usually achieved through the use of reducing atmospheres. such as hydrogen or dissociated ammonia. In aluminum. this occurs in the solid st,lte through the partial reduction of the aluminum by magncsium to form spinel. This exposcs the underlying metal and facilitates sintering. It has recently been shown that < 0.2% Mg is all that is required. It is noteworthy that most aluminum pre-mixes contain at least 0.5% Mg. The sintering of aluminum alloys can be further enhanced by selective microalloying. Just 100ppm pf tin chnnges the liquid phase sintering kinetics of the 2xxx alloys to produce a tensile strength of 375Mpa. an increilse of nearly 20% over the unmodified alloy. The ductility is unnffected. A similar but different effect occurs by the addition of 100 ppm of Pb to 7xxx alloys. The lend changes the wetting characteristics of the sintering liquid which serves to increase the tensile strength to 440 Mpa. a 40% increase over unmodified aIloys. Current research is predominantly aimed at the development of metal matrix composites. which have a high specific modulus. good wear resistance and a tailorable coefficient of thermal expnnsion. By controlling particle clustering and by engineering the ceramic/matrix interface in order to enhance sintering. very attractive properties can be achicved in the ns-sintered state. I\t an ils-sintered density ilpproaching 99%. these new experimental alloys hnve a modulus of 130 Gpa and an ultimate tensile strength of 212 Mpa in the T4 temper. In contest. unreinforcecl aluminum has a modulus of just 70 Gpa.

• Progress in Superconductivity
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• 제10권1호
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• pp.45-49
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• 2008

For the development of superconducting fault current limiters (SFCLs), fault current limiting elements were fabricated out of Bi-2212 bulk tubes and tested. The SFCL elements consisted of tube shaped Bi-2212 bulks and metal shunts for the stabilizers. Firstly, the Bi-2212 bulk tubes were processed based on a design of monofilar coils in order to acquire large resistance and high voltage rating. 300 mm-long Bi-2212 tubes were designed to have the current path of 410 cm in length with 24 turns and 41 mm in diameter. The processed monofilar coil, as designed, had 300 A $I_c$ at 77 K. The fabricated superconducting monofilar coils were affixed to Cu-Ni alloy as that of stabilizers. The Cu-Ni alloys were processed to have the same shape of the superconducting monofilar coils. The Cu-Ni coil had resistivity of 32 ${\mu}{\Omega}$-cm at 77 K and 37 ${\mu}{\Omega}$-cm at 300 K. The metal shunts were attached to the outside of the Bi-2212 monofilar coil by a soldering technique. After the terminals made of copper were attached to both ends of the superconductor-metal shunt composite, the gap between the turns and the surface of the elements was filled with an epoxy and a dense mesh made of FRP in order to enhance the mechanical strength. The completed SFCL elements went through fault tests, and we confirmed that the voltage rating of 143 $V_{rms}$ (E =0.35 $V_{rms}$/cm) could be accomplished.

• 헤리티지:역사와 과학
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• 제52권1호
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• pp.4-21
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• 2019

영남지역에서 출토된 6~7세기 신라 금제 귀걸이 23점에 대한 성분 분석을 실시하고, 금판에 포함된 은(Ag) 함량을 기준으로 세 가지 유형으로 분류하였다. I 유형(20~50wt%), II 유형(10~20wt%), III 유형(10wt% 이하)으로 구분하였는데, I II 유형의 귀걸이 금판은 금(Au) 함량이 상대적으로 높은 부분에서 미세한 기공이 집중적으로 분포되는 현상이 관찰되었다. 금판 표면의 성분 차이 발생 원인을 네 가지로 구분하여 1) 표면 처리, 2) 제작 과정에서 열 확산, 3) 사금의 성분 차이, 4) 금의 정련 방법 측면에서 검토하였다. 금판 표면의 금 함량이 상대적으로 높은 부분에서는 미세한 기공이 집중적으로 관찰되며, 이와 관련하여 금 합금 표면에 의도적으로 금을 제외한 금속 성분을 제거하면서 금 함량을 높이는 고갈 도금(depletion gilding) 가능성을 제시하였다. 의도적인 표면 처리와 더불어 제작 과정에서 금판과 금속 봉 사이에 열 확산이 일어나 금판의 구리 함량이 높아진 사례를 세환이식의 분석 결과로 확인되었다. 금판의 재료적인 측면에서 살펴보면 금판에 포함된 은(Ag)이 자연금에 포함된 것인지, 합금에 의해 추가된 것인지를 국내에서 채취된 사금 분석을 통해 살펴보았다. 분석 결과 평균적으로 13wt% 정도의 은이 포함된 것으로 미루어 보아 II 유형은 자연금의 범주에 포함되고, III 유형은 정련 과정을 거친 금, I 유형은 자연금에 은이 합금된 것으로 보인다. 여기에서 III 유형의 경우 정련 과정을 거쳐 순수한 금을 만든 뒤 은을 합금했을 가능성에 대해 국내외 고대 문헌에 소개된 금 정련 방법을 조사하였다. 고대 정련 방법은 자연금에 포함된 은이 염화물 또는 황화물과 반응하여 결합됨으로써 제거되는 방법이었는데, 이러한 방법을 통해 순수한 금을 얻기 위해서는 장시간의 노력과 기술이 요구된다는 것이 밝혀졌다. 따라서 정련 과정을 통해 순금을 만든 후에 강도를 높이기 위해 소량의 은을 첨가했을 가능성은 낮아 보인다.