• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• Journal of Power Electronics
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• 제16권6호
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• pp.2119-2128
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• 2016

Due to detection and control errors, some high-frequency harmonics with voltage-source characteristics cause circulating currents in modular inverters. Moreover, the circulating currents are usually affected by the output filters (OF) of each module due to their filter and resonance properties. The interaction among the circulating currents in the modules increase the power loss and reduce system stability and control precision. Therefore, this paper reports the results of a study on the SPWM high-frequency harmonics circulating currents for a double-module VSI. In the paper, an analysis of the circulating-current circuits is briefly described. Next, a mathematic model of the single-module output voltage based on the carrier frequency of SPWM is built. On this basis, through mathematic modeling of high-frequency harmonic circulating currents, the formation mechanism and distribution characteristics of circular currents and their influences are studied in detail. Finally, the influences of the OF on the circulating currents are studied by mainly taking an LC-type filter as an example. A theoretical analysis and experimental results demonstrate some important characteristics. First, the carrier phase shifting of the SPWM for each module is the major cause of the SPWM harmonic circulating currents, and the circulating currents are in an odd distribution around n-times the carrier frequency $n{\omega}_s$, where n = 1, 2, 3, ${\ldots}$. Second, the harmonic circular currents do not flow into the parallel system. Third, the OF can effectively suppress the non-circulating part of the high-frequency harmonic currents but is ineffective for the circulation part, and actually reduces system stability.

• 한국위성정보통신학회논문지
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• 제5권2호
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• pp.82-86
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• 2010

본 논문에서는 포락선추적 기능을 갖는 WCDMA 기지국에 사용될 수 있는 GaN FET를 이용한 전력증폭기 모듈을 설계하고, 제작 및 측정결과를 제시하였다. 개발된 전력증폭기 모듈은 소신호 RF 신호를 입력받아 고이득 MMIC 증폭기, 구동 증폭기 및 전력 증폭기 등을 거쳐 10W 이상의 출력을 생성할 수 있다. 또한, Envelope Tracking 응용을 위해서 최종 전력증폭기의 Drain 전압이 가변되어도 전체 모듈이 안정적으로 동작할 수 있도록 발진방지회로, Isolator, 음전압 우선인가 바이어스 회로가 설계되었다. 모든 바이어스 회로와 RF회로를 $17.8{\times}9.8{\times}2.0\;cm3$ 크기의 하우징 안에 집적화하여 소형화시켰다. 측정결과 바이어스 전압이 4V에서 28V까지 가변할 경우 30dBm에서 40dBm까지 출력이 가변되면서도 35%이상의 일정한 효율 특성을 나타내어 포락선 추적 기능을 수행할 수 있음을 확인하였다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2008년도 추계학술발표대회 논문집
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• pp.36-41
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• 2008

In this paper, we study The Effects of PV Cell's Electrical Characteristics for PV Module Application. Photovoltaic module consists of serially connected solar cell which has low open circuit voltage and high short circuit current characteristics. The whole current flow of PV module is restricted by lowest current of one solar cell. For the experiment, we make PV module composing the solar cells that have short circuit current difference of 0%, 1%, 3% and Random. The PV module exposed about 35days, its the maximum power drop ratio was 4.282% minimum and 6.657% maximum. And PV module of low current characteristics has electrical stress from other modules. The solar cell temperature of PV module was higher compared to PV cell. To prevent early degradation, it is need to have attention to PV cell selection.

• 전기전자학회논문지
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• 제17권4호
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• pp.393-397
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• 2013

This paper introduces the T/RX combined compact active channel module which is a key unit of the active phased array antenna(APAA) system. This module is mainly compoased of two parts for TX and RX fabricated on both sides of the active module for size reduction. The TX-part is primarily composed of a 3-stage amplifier, a microstrip phase shifter, a thermal compensation and a power detection circuit. The RX-part is composed of LNAs a microstrip phase shifter and BPFs for TX power rejection. Using the proposed design structure we can realized a compact active channel module having high performance.

• Journal of electromagnetic engineering and science
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• 제16권4호
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• pp.225-228
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• 2016

KRISS-V, a V-band millimeter-wave source module for a primary RF power standard and calibration system developed by the Korea Research Institute of Standards and Science is here presented. The output power of KRISS-V is several times higher than that of commercial amplifier/multiplier chains and is highly stable (the standard deviations of output power are less than 0.01% in the worst case). The spectral purity of KRISS-V is high enough to consider it a single-tone signal generator. We also added programmable attenuation capability to KRISS-V for remote power control. Moreover, the in-house source module is cost-effective and adaptable to various measurement schemes. The structure of the model as well as detailed component information are introduced so that it can be reproduced.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 전력전자학술대회 논문집
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• pp.158-162
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• 2002

This paper presents a novel 3-phase IGBT module called the SPM (Smart Power Module). This is a new design developed to provide a very compact, low cost, high performance and reliable motor drive system. Several distinct design concepts were used to achieve the highly integrated functionality in a new cost-effective small package. An overall description to the SPM is given and actual application issues such as electrical characteristics, circuit configurations, thermal performance and power ratings are discussed

• 전력전자학회논문지
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• 제24권5호
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• pp.356-364
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• 2019

In this study, major problems, such as licensing problems due to civil complaints, deterioration of facility period, and damage of modules, are exposed to many problems in domestic businesses. Particularly, the photovoltaic (PV) modules applied to early PV systems have been repaired and replaced over the past two decades, and a new module-based aging detection method is needed to expand the maintenance market and stabilize and repair power supplies. PV modules in a PV system use a string that is configured in series to generate high voltage. However, even if only one module of the solar modules connected in series ages, the power generation efficiency of the aged string is reduced. Therefore, we propose a topology that can measure the instantaneous PV characteristic curve to determine the aging module in the solar string and the aging judgment algorithm using the measured PV characteristic curve.

• 한국전기전자재료학회논문지
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• 제16권12호
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• pp.1142-1149
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• 2003

The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.

• 전력전자학회:학술대회논문집
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• 전력전자학회 1998년도 전력전자학술대회 논문집
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• pp.323-327
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• 1998

Under high power IGBTs Switching, a large overvoltage is induced across the IGBT module due to the stray inductance in the circuit. This paper proposes a new gate drive circuit for high power IGBTs which can actively suppress the overvoltage across the driven IGBT at turn-off while preserving the most simple and reliable power circuit. The turn-off driving scheme has adaptive feature to the amplitude of collector current, so that the overvoltage can be limited much effectively at the fault collector current. Experimental results under various normal and fault conditions prove the effectiveness of the proposed.