• Journal of electromagnetic engineering and science
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• 제18권2호
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• pp.101-107
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• 2018

The impedance bandwidth and radiation characteristics of an aperture-coupled microstrip line-fed patch antenna (ACMPA) with a high permittivity (${\varepsilon}_r=10$) feed substrate suitable for integration with a monolithic microwave integrated circuit (MMIC) are investigated for various feed substrate thicknesses through an experiment and computer simulation. The impedance bandwidth of an ACMPA with a high permittivity feed substrate increases as the feed substrate thickness decreases. Furthermore, the front-to-back ratio of an ACMPA with a high permittivity feed substrate increases and the cross-polarization level decreases as the feed substrate thickness decreases. As the impedance bandwidth of an ACMPA with a high permittivity feed substrate increases and its radiation characteristics improve as the feed substrate thickness decreases, the ACMPA configuration becomes suitable for integration with an MMIC.

• Journal of Electrical Engineering and Technology
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• 제10권4호
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• pp.1738-1745
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• 2015

Radiation characteristics of a probe-fed rectangular microstrip patch antenna printed on a finite grounded high permittivity substrate are investigated systematically for various square grounded dielectric substrate sizes with several thicknesses and dielectric constants by experiment and full wave simulation. The effect of the substrate size on the radiation characteristics of a rectangular patch antenna is mainly determined by the effective dielectric constant of surface waves on a grounded dielectric substrate. As the effective dielectric constant of surface waves increases, the substrate sizes for the maximum broadside gain and the required onset for a large magnitude of squint angle decrease, while the variations of the broadside gain, the front-to-back ratio, and the magnitude of squint angle versus the substrate size increase due to the increase of the power of the surface wave.

• 전자공학회논문지A
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• 제33A권2호
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• pp.69-77
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• 1996

We analyzed wideband propagation characteristics of a microstrip transmission line based on FR-4 composite substrate using the wideband complex dielectric constant model and the phenomenological loss equivalence method. The loss calculated by constant relative permittivity and loss tangent is greatly overestimatd compared to that calculated by the frequency-dependent complex relative permittivity. This wideband analysis can be helpful to characterize high-speed and high-density transmission lines associated with the wideband dielectric characteristics and shows that the FR-4 composite substrate has high potential of high frequency circuit applications in terms o fthe propagation loss.

• 한국전기전자재료학회논문지
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• 제20권12호
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• pp.1049-1055
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• 2007

Lots of integration work has been done in order to miniaturize the devices for communication. To do this work, one of key work is to get miniaturized inductor with high Q factor for RF circuitry. However, it is not easy to get high Q inductor with silicon based substrate in the range of GHz. Although silicon is well known for its good electrical and mechanical characteristics, silicon has many losses due to small resistivity and high permittivity in the range of high frequency. MEMS technology is a key technology to fabricate miniaturized devices and LTCC is one of good substrate materials in the range of high frequency due to its characteristics of high resistivity and low permittivity. Therefore, we proposed and studied to fabricate and analyze the inductor on the LTCC substrate with MEMS fabrication technology as the one of solutions to overcome this problem. We succeeded in fabricating and characterizing the high Q inductor on the LTCC substrate and then compared and analyzed the results of this inductor with that on a silicon and a glass substrate. The inductor on the LTCC substrate has larger Q factor value and inductance value than that on a silicon and a glass substrate. The values of Q factor with the LTCC substrate are 12 at 3 GHz, 33 at 6 GHz, 51 at 7 GHz and the values of inductance is 1.8, 1.5, 0.6 nH in the range of 5 GHz on the silicon, glass, and LTCC substrate, respectively.

• 전자공학회논문지A
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• 제33A권3호
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• pp.65-81
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• 1996

In this study forty-five X-bnd rectangular microstrip patch antennas fed by microstrip line using ${\lambda}$/4 transformer were fabricated on teflon substrates with low high permittivities and varous thickness (substrate thickness : 0.6 ~ 2.4 mm, permittivities : 2.15 ~ 10.0), and effects of permittivity and electrical thickness on antenna characteristics were studied with measured return loss (1/S$_{11}$) and resonant frequencies. When substrate electrical thickness was greater than 0.060 ${\lambda}_{0}$return loss was very good and genrally more than 20 dB, but resonance characteristics was somewhat unstable. The more than 0.088 ${\lambda}_{0}$ the thickness was, the more unstable it was. As a result, in the rest range except 12, 13 GHz we had very good mesured return loss iwth greater than 20 dB, and in the range 7 to 9 GHz resonant frequencies were within $\pm$2 % error, on ${\epsilon}_{r}$=5.0, height = 2.4 mm substrate.

• Journal of electromagnetic engineering and science
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• 제7권1호
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• pp.47-52
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• 2007

We investigated the effects of substrate, metal-line, and surface material on the performance of radio frequency identification(RFID) tag antenna using a tag antenna with a meander line radiator and T-matching network. The results showed that readability of the tag antenna with a thin high-loss substrate could be increased so that it was similar to that of a low-loss substrate if the substrate was very thin. The readability of the tag antenna decreased significantly when the metal line was thinner than the skin depth. The readability of the tag also decreased drastically when the tag was attached to high-permittivity high-loss target objects.

• 한국항행학회논문지
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• 제23권5호
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• pp.415-423
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• 2019

본 논문에서는 유전율 측정을 위한 구부러진 슬롯이 추가된 고감도 마이크로스트립 패치 센서 안테나의 설계 방법에 대하여 연구하였다. 유전율에 대한 감도를 향상시키기 위해 단일 링 CSRR 구조와 유사한 구부러진 슬롯이 패치의 한쪽 방사면에 추가되었다. 제안된 마이크로스트립 패치 센서 안테나의 감도를 기존의 직사각형 마이크로스트립 패치 센서 안테나와 얇은 직사각형 슬롯이 추가된 마이크로스트립 패치 센서 안테나와 비교하였다. 세 마이크로스트립 패치 센서 안테나는 피 시험 상판이 없는 상태에서 전송 계수가 2.5 GHz에서 공진하도록 0.76 mm 두께의 RF-35 기판 상에 설계하고 제작하였다. 피 시험 상판으로 비유전율이 2.17에서 10.2 범위에 있는 타코닉 기판 5종을 사용하여 실험한 결과, 입력 반사계수의 공진 주파수의 이동으로 측정된 제안된 마이크로스트립 센서 안테나의 감도는 기존의 직사각형 마이크로스트립 패치 센서 안테나와 비교할 때 4.1배에서 6.1배 증가하는 것을 확인하였다.

• 한국전자파학회논문지
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• 제14권4호
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• pp.343-350
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• 2003

본 논문은 부분적인 유전체 삽입을 이용하여서 원형편파를 구현한 안테나로 GPS(Global Positioning System) 및 위성라디오 겸용 수신안테나에 대해 연구하였다. 유전체(FR4, $\varepsilon_{{\gamma}}$/=4.7)를 부분적으로 삽입하여 패치의 전기적 길이를 변화시키면서 원형편파를 구현하고 패치의 크기도 줄일 수 있다. 또한 프루브 급전의 좁은 대역폭도 두꺼운 유전체를 부분적으로 사용함으로써 극복할 수 있고 안테나의 높이가 높아지면서 생기는 표면파에 의한 손실을 최소화할 수 있다 이동하는 선박이나 차량에 적용하기 위하여 5개의 안테나를 입체적인 구조로 스위칭 할 수 있는 형태로 안테나 구조를 제안하였다.칭 할 수 있는 형태로 안테나 구조를 제안하였다.

• Journal of electromagnetic engineering and science
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• 제17권4호
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• pp.202-207
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• 2017

This paper presents the performance of a planar, low-profile, and wide-gain-bandwidth leaky-wave slit antenna in different thickness values of high-permittivity gallium arsenide substrates at terahertz frequencies. The proposed antenna designs consisted of a periodic array of $5{\times}5$ metallic square patches and a planar feeding structure. The patch array was printed on the top side of the substrate, and the feeding structure, which is an open-ended leaky-wave slot line, was etched on the bottom side of the substrate. The antenna performed as a Fabry-Perot cavity antenna at high thickness levels ($H=160{\mu}m$ and $H=80{\mu}m$), thus exhibiting high gain but a narrow gain bandwidth. At low thickness levels ($H=40{\mu}m$ and $H=20{\mu}m$), it performed as a metasurface antenna and showed wide-gain-bandwidth characteristics with a low gain value. Aside from the advantage of achieving useful characteristics for different antennas by just changing the substrate thickness, the proposed antenna design exhibited a low profile, easy integration into circuit boards, and excellent low-cost mass production suitability.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.296-296
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• 2016

ITO films doped with a small amount of high-permittivity materials not only retain the basic properties of ITO films but also improve some of their properties. We report the highly conductive and transparent (ITO:Zr) films with various substrate (RT to 300oC) temperatures on glass substrate for the HIT solar cell applications. We observed a decrease in sheet resistance from 36 to $11.8{\Omega}/{\Box}$ with the increasing substrate temperature from RT to 300oC, respectively. The ITO:Zr films showed also lowest resistivity of $1.38{\times}10-4{\Omega}.cm$ and high mobility of 42.37cm-3, respectively. The surface and grain boundaries are improved with the increase of substrate temperature as shown by SEM and AFM surface morphologies. The highly conductive and transparent ITO:Zr films were employed as front electrode in HIT solar cell and the best performance of device was found to be Voc = 710 mV, Jsc = 33.70 mA/cm2, FF = 0.742, ${\eta}=17.76%$ at the substrate temperature of $200^{\circ}C$.