• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.04a
• /
• pp.1020-1024
• /
• 1997

Recently the use of ceramic materals has been greatly increased in the industries. But machining of the ceramics is quite unproductive because of their high stength,high hardness,and brittleness. The efficiency of the grinding operation of ceramics depends on the preparation of diamond grinding wheel, i.e.,truning and dressing. This paper describes some experimental results on the dressing conditions of diamond grinding wheel. The dressing performance is evaluated by the magnitude of normal grinding force. The better dressed wheels result in the lower normal grinding forces. The dressing performances of copper plate and aluminum oxide dressing stick are compared. The optimum dressing conditions including the grit size of dressing sticks, the depth of the dressing operation, and the dressing speed qre determined.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1994.10a
• /
• pp.125-130
• /
• 1994

Recently,manufacturing work been transformed to small acale production from with various items to act up to user's expectation from mass production with a little items required in the past. The FMS using NC type mother machinaries has been applied actively also in domestic manufacturing line to meet thus tendancy, but there are many machining troubles occured in work process not be settled yet. Nowdays high efficiency has been required no less than high precision in grinding work for the improvement of productivity. In this study, to represent more advanced FMS can be adapted to thus situation In-process type monitoring method using AE and Current sensors is suggested to investigatethe machining condition in grinding process. As results from this experimental study, is is recoqnized well that grinding conditions and dressing point of in time can be estimated effectively using monitoring method suggested. Furthermore, surface shape of grinding wheel on voluntary point of in time can be predicted indirectly through the observation and comparison of AE signal waveform obtained as performance of continuous dressing work.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.1 s.178
• /
• pp.97-104
• /
• 2006

ELID(Electrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study is describing an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould. It also presents some techniques for achieving the nanometer roughness of the hard metals, such as WC-Co, which are extensively used in precision tooling material.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1911-1915
• /
• 2003

Today optical communication industry is developed; demand of optical communication part is increased. ZrO$_2$ ceramic ferrule is very significant part which determines transmission efficiency and quality of information in the optical communication part by connector of optical fibers. Being different from metal grinding, material removal through brittle fracture plays an important role in ZrO$_2$ ceramic grinding. Most of ZrO$_2$ ceramic ferrule processes are grinding which request high processing precision. Particularly, concentricity and cylindricity of inner and outer diameter are very important. The co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. Surface integrity of ZrO$_2$ ceramic ferrule is affected by grinding conditions, and equipment. In this study, surface integrity of workpiece according to such as a change of grinding wheel speed, feed rate, regulating wheel speed and grinding force is investigate to improve the concentricity and roundness of ZrO$_2$ ceramic ferrule from many experiments. Thus, if possible be finding highly efficient and quality grinding conditions.

• Proceedings of the KSME Conference
• /
• 2003.04a
• /
• pp.980-986
• /
• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.10
• /
• pp.26-33
• /
• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.98-101
• /
• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.701-702
• /
• 2011

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1999.10a
• /
• pp.326-331
• /
• 1999

Grinding technology in morden industry society is focusing on research & development for grinding stone and machining parts for the purpose of high accuracy and high efficiency of products. But, in order to equip the high technology and high accuracy of micro stone which is one of grinding stone, hardly and continuous effort on R&D is required.In this study, honing processing work of 2-cycle engine cylinder for motorcycle which has open hole is practiced so as to clear how borning that is prior step of honing and hone stone make an influence on accuracy of honing. As the result of analyzing the results of experiments, we came to conclusion that we can secure good conditions of honing by controlling and keeping appropriate cycle-time in the stage of boring of prior step of honing.

• Proceedings of the KSME Conference
• /
• 2004.04a
• /
• pp.1092-1098
• /
• 2004

Today the demand of the optical communication components has been increased. Zirconia Ferrule has become the one of the most important elements because it determines transmission efficiency and quality of information in the optical communication system. Grinding is the major process in the ferrule manufacturing process which require high processing precision. In this reseach, specially designed spindle, chucking system, loading & unloading system and cooling system, as a supporting experimental equipment for development of an Intelligent Coaxial Grinding System (ICGS) for Zirconia Ferrule processing, is developed. We are also analized the adaptability of ICGS in practical use, through the way of evaluation for the performance of the each systems above.