• KSII Transactions on Internet and Information Systems (TIIS)
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• 제6권10호
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• pp.2679-2691
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• 2012

In this paper, a high accuracy stereo reconstruction method for surgery instruments positioning is proposed. Usually, the problem of surgical instruments reconstruction is considered as a basic task in computer vision to estimate the 3-D position of each marker on a surgery instrument from three pairs of image points. However, the existing methods considered the 3-D reconstruction of the points separately thus ignore the structure information. Meanwhile, the errors from light variation, imaging noise and quantization still affect the reconstruction accuracy. This paper proposes a method which takes the structure information of surgical instruments as constraints, and reconstructs the whole markers on one surgical instrument together. Firstly, we calibrate the instruments before navigation to get the structure parameters. The structure parameters consist of markers' number, distances between each markers and a linearity sign of each instrument. Then, the structure constraints are added to stereo reconstruction. Finally, weighted filter is used to reduce the jitter. Experiments conducted on surgery navigation system showed that our method not only improve accuracy effectively but also reduce the jitter of surgical instrument greatly.

• Journal of Welding and Joining
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• 제31권5호
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• pp.15-19
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• 2013

In order to reduce a grand compute time in prediction of welding distortion and residual stress by 3D thermal elastic plastic analysis, idealization of welding that is methods to heat input simultaneously in all weld metal on the same welding direction is carried out on two weld joints(butt welding and fillet welding). Then, the accuracy of acquired results is investigated through the comparison of the high accuracy prediction results. The thermal conduction analysis results by idealization of welding, the temperature is raised accompany with beginning of heat input because all of weld metal is heated input at the same time. On the other side, the temperature witch predicted with high accuracy is raised at the moment heating source passes the measuring points. So, there is difference of time between idealization of welding and considering of moving heat source faithfully. However, temperature history by idealization of welding is well simulated a high accuracy prediction results.

• 한국측량학회지
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• 제33권1호
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• pp.11-21
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• 2015

정사영상은 DSM(Digital Surface Model; 수치표면모델)을 이용하여 항공영상의 왜곡과 기복변위 등으로 발생하게 되는 기하학적 변위를 제거함으로써 제작된다. 따라서 원영상의 해상도와 DSM의 정확도는 정사영상의 정확도에 큰 영향을 미치게 된다. 최근 제공되고 있는 DMCII250 항공영상은 GSD 5cm급 고해상도의 영상을 제공함으로써 고밀도 점군자료의 생성과 함께 정사영상의 품질 향상을 기대할 수 있을 것으로 예상된다. 이에 본 연구에서는 DMCII250 항공영상으로부터 고밀도의 점군자료를 추출하여 DSM을 제작하고 이를 이용하여 정사영상을 생성함으로써 고밀도 DSM 제공에 따른 고품질 정사영상의 제작 가능성과 그 정확도를 검토하고자 하였다. 연구결과 기존 수치지형도 또는 DSM정보를 이용하여 제작한 정사영상에 비하여 높은 정도의 위치정확도와 고품질의 정사영상의 확보가 가능함을 확인할 수 있었다.

• 한국측량학회:학술대회논문집
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• 한국측량학회 2006년도 춘계학술발표회 논문집
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• pp.255-258
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• 2006

With the increasing availability of high-resolution satellite imagery, the demand for ortho-rectified products will also be growing. High-resolution of the imagery (up to 1m) the desired accuracy of the ortho-rectification is more sensitive to a number of factors. including satellite position, velocity, internal sensor error (specifically, misalignment. lens distortion, etc.). sensor modeling, relief displacement and matching error, etc. The main objective of this study is to analysis the accuracy of high resolution satellite data using simulation data.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 1998년도 춘계학술대회논문집; 용평리조트 타워콘도, 21-22 May 1998
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• pp.302-307
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• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.

• 대한원격탐사학회:학술대회논문집
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• 대한원격탐사학회 2006년도 Proceedings of ISRS 2006 PORSEC Volume II
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• pp.780-783
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• 2006

The KOrea Multi-Purpose Satellite-2 (KOMPSAT-2) was launched in July 2006 and the main mission of the KOMPSAT-2 is a high resolution imaging for the cartography of Korea peninsula by utilizing Multi Spectral Camera (MSC) images. The camera resolutions are 1 m in panchromatic scene and 4 m in multi-spectral imaging. This paper provides an initial geometric accuracy assessment of the KOMPSAT-2 high resolution image without ground control points and briefly introduces the sensor model of KOMPSAT-2. Also investigated and evaluated the obtained 3-dimensional terrain information using the MSC pass image and scene images acquired from the KOMPSAT-2 satellite.

• Design & Manufacturing
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• 제10권3호
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• pp.46-50
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• 2016

Laminate products for motor core are developed with a structure in which the importance of quality level and clamping force is influenced by the recent performance and safety of the product. It has been confirmed that the accuracy of the mold is emphasized, and that the accuracy of the tightening force produced by the stacked product for the motor core is greatly influenced by the change in the bottom dead center displacement of the aged high speed press. The reason why setting the mold, and test the effect of bottom dead center of high speed press is to improve product pull force in embossing process at mold. We have applied the system to minimize the effect on the damping displacement under the dynamical degree of the equipment by applying the emboss complement device which can test the influence and complement in the process.

• 한국정밀공학회지
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• 제22권11호
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• pp.91-98
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• 2005

This study has been focused on the development of a high speed feeding type three-dimensional bending machine. It is designed for manufacture of copper pipe for heat exchangers. For the purpose of design of the machine, analysis of bending process, structural analysis and reliability evaluation of the machine by a laser interferometer are carried out. The analysis is carried out by FEM simulation using commercial softwares, DEFORM, MARC and CATIA V5. In addition, the machine has attained high accuracy and repeatability. In order to improve the accuracy of this machine, the maximum speed, positioning accuracy and repeatability of feed are measured by the laser interferometer. The final results of analysis are applied to the design of a high speed feeding type three-dimensional bending machine and the machine is successfully developed.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.302-302
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• 2000

This paper presents the measurement and correction of PCB alignment errors for PCB-manufacturing machines. The conventional PCB-manufacturing machine doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because of alignment errors of PCB loaded to the PCB-manufacturing machine. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors whit high-accuracy. An automatic optical inspection part measures the PCB alignment error using two cameras, and the high-accuracy 3-axis stage makes correct of these error. The operating system is run in the environment of Window 98 (or NT). Finally we implemented this system to PCB screen printer and PCB exposure system.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 1997년도 춘계학술대회논문집; 경주코오롱호텔; 22-23 May 1997
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• pp.362-369
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• 1997

In the case of a precision equipment, it requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga class semiconductor wafers. This high technology equipments require very strict environmental vibration standard in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be expressed in the form of 'exactness' and 'accuracy', because this is made basic data in the use of building structure design. This paper made a study on the specification of high sensitive equipment and proposed a contents of the specification.