• 한국전기전자재료학회논문지
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• 제18권2호
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• pp.180-186
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• 2005

As a driving method of AC-PDP, Address-Display Separated(ADS) driving has been widely adopted for its simple architecture and low discharge failure rate. However, a high definition like a HDTV has defect of long addressing time by reason of a number of pixels. Priming effect isn't fully sustained because of long addressing time during the address period. Therefore, it has different wall charge and luminance of each addressing time in the sustain period. In this study, we suggest a new driving waveform on the address period to improve these defects. We applied a ramp waveform, instead of a square waveform, to an address period in ADS, for operating on the AC-PDP, which used the conventional gas [He-Ne-Xe]. When the ramp waveform is applied to the address period, we experimented for uniform wall charge and the improved luminance by sustained Priming effect at each addressing time in the sustain period.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.169-170
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• 2000

The conventional AC PDP has a relatively low efficiency which is close to 1.5 lm/W. If the AC sustain period is replaced by the RF sustain period, due to oscillating and low electric field, almost 60% of the supplied energy is spent by Xe excitation [1]. The efficiency of RF PDP can be $4{\sim}5$ times higher than that of AC PDP. In this paper, we will present the RF PDP that is a new type of PDP. A new display method in PDP using RF pulses is suggested and applied on a 4-inch-diagonal Panel (hereinafter 4" panel). Even though there were many researches in RF discharge, there was not enough research for display application. Now we propose the RF PDP that is a new display field and we will expect to do more research in this field.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.149-152
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• 2005

We present the characterization of poly-Si TFT fabricated below on Plastic Substrate below $170^{\circ}C$ on plastic substrate using excimer laser crystallization of Xe sputtered Si films. Gate insulator with a breakdown field exceeding 8 MV/cm was deposited by using inductively coupled plasma CVD. Finally, we successfully fabricate TFT with a electron field-effect mobility value greater than $290\;cm^2/Vsec$.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권5호
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• pp.361-366
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• 1999

The life of AC PDP depends largely on the sputtering-resistant property of the protecting layer such as MgO thin-film. However, it is very difficult to measure the sputtering-resistant property in the stable driving conditions of AC PDP. In this paper we have suggested a high speed measurement technique of the sputtering-resistant property of MgO thin-film by applying the MgO thin-film as the target of RF magnetron sputtering system. We have also applied this method to the e-beam MgO and sputter-MgO and e-beam MgO superior to sputter-MgO 3 times over. Also, the relation of Xe gas partial pressure(X) and sputtered thickness(Y) was Y=3.4X+13.5.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.2169-2171
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• 2005

A new structure is proposed to achieve a low sustaining voltage and high luminous efficacy. By measuring minimum sustaining voltage(Vs) discharge current(Ion), discharge(Ioff), and brightness of the light from a 4-inch ac-PDP, performances of the conventional structure and proposed structure are compared. When compared with the conventional structure, proposed structure showed 6.5% Vsm improvement, 22% luminance improvement and 20% light dispersion improvement at the Ne-Xe(8%) gas mixture of 400 torr.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.647-650
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• 2006

Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

• Journal of Radiation Protection and Research
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• 제42권3호
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• pp.141-145
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• 2017

Background: The concrete walls inside the vaults of cyclotron facilities are activated by neutrons emitted by the targets during radioisotope production. Reducing the amount of radioactive waste created in such facilities is very important in case they are decommissioned. Thus, we proposed a strategy of reducing the neutron activation of the concrete walls in cyclotrons during operation. Materials and Methods: A polyethylene plate and B-doped Al sheet (30 wt% of B and 2.5 mm in thickness) were placed in front of the wall in the cyclotron room of a radioisotope production facility for pharmaceutical use. The target was Xe gas, and a Cu block was utilized for proton dumping. The irradiation time, proton energy, and beam current were 8 hours, 30 MeV, and $125{\mu}A$, respectively. To determine a suitable thickness for the polyethylene plate set in front of the B-doped Al sheet, the neutron-reducing effects achieved by inserting such sheets at several depths within polyethylene plate stacks were evaluated. The neutron fluence was monitored using an activation detector and 20-g on de Au foil samples with and without 0.5-mm-thick Cd foil. Each Au foil sample was pasted onto the center of a polyethylene plate and B-doped Al sheet, and the absolute activity of one Au foil sample was measured as a standard using a Ge detector. The resulting relative activities were obtained by calculating the ratio of the photostimulated luminescence of each foil sample to that of the standard Au foil. Results and Discussion: When the combination of a 4-cm-thick polyethylene plate and B-doped Al sheet was employed, the thermal neutron rate was reduced by 78%. Conclusion: The combination of a 4-cm-thick polyethylene plate and B-doped Al sheet effectively reduced the neutron activation of the investigated concrete wall.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.411-411
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• 2012

Over the recent years, surface enhanced Raman spectroscopy (SERS) has dramatically grown as a label-free detecting technique with the high level of selectivity and sensitivity. Conventional SERS-active nanostructured layers have been deposited or patterned on rigid substrates such as silicon wafers and glass slides. Such devices fabricated on a flexible platform may offer additional functionalities and potential applications. For example, flexible SERS-active substrates can be integrated into microfluidic diagnostic devices with round-shaped micro-channel, which has large surface area compared to the area of flat SERS-active substrates so that we may anticipate high sensitivity in a conformable device form. We demonstrate fabrication of flexible SERS-active nanostructured substrates based on soft-lithography for simple, low-cost processing. The SERS-active nanostructured substrates are fabricated using conventional Si fabrication process and inkjet printing methods. A Si mold is patterned by photolithography with an average height of 700 nm and an average pitch of 200 nm. Polydimethylsiloxane (PDMS), a mixture of Sylgard 184 elastomer and curing agnet (wt/wt = 10:1), is poured onto the mold that is coated with trichlorosilane for separating the PDMS easily from the mold. Then, the nano-pattern is transferred to the thin PDMS substrates. The soft lithographic methods enable the SERS-active nanostructured substrates to be repeatedly replicated. Silver layer is physically deposited on the PDMS. Then, gold nanoparticle (AuNP) inks are applied on the nanostructured PDMS using inkjet printer (Dimatix DMP 2831) to deposit AuNPs on the substrates. The characteristics of SERS-active substrates are measured; topology is provided by atomic force microscope (AFM, Park Systems XE-100) and Raman spectra are collected by Raman spectroscopy (Horiba LabRAM ARAMIS Spectrometer). We anticipate that the results may open up various possibilities of applying flexible platform to highly sensitive Raman detection.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.105-105
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• 2012

We have developed a photoemission-assisted plasma-enhanced chemical vapor deposition (PAPE-CVD) [1,2], in which photoelectrons emitting from the substrate surface irradiated with UV light ($h{\nu}$=7.2 eV) from a Xe excimer lamp are utilized as a trigger for generating DC discharge plasma as depicted in Fig. 1. As a result, photoemission-assisted plasma can appear just above the substrate surface with a limited interval between the substrate and the electrode (~10 mm), enabling us to suppress effectively the unintended deposition of soot on the chamber walls, to increase the deposition rate, and to decrease drastically the electric power consumption. In case of the deposition of DLC gate insulator films for the top-gate graphene channel FET, plasma discharge power is reduced down to as low as 0.01W, giving rise to decrease significantly the plasma-induced damage on the graphene channel [3]. In addition, DLC thickness can be precisely controlled in an atomic scale and dielectric constant is also changed from low ${\kappa}$ for the passivation layer to high ${\kappa}$ for the gate insulator. On the other hand, negative electron affinity (NEA) of a hydrogen-terminated diamond surface is attractive and of practical importance for PAPECVD, because the diamond surface under PAPE-CVD with H2-diluted (about 1%) CH4 gas is exposed to a lot of hydrogen radicals and therefore can perform as a high-efficiency electron emitter due to NEA. In fact, we observed a large change of discharge current between with and without hydrogen termination. It is noted that photoelectrons are emitted from the SiO2 (350 nm)/Si interface with 7.2-eV UV light, making it possible to grow few-layer graphene on the thick SiO2 surface with no transition layer of amorphous carbon by means of PAPE-CVD without any metal catalyst.

• 한국전기전자재료학회논문지
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• 제18권4호
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• pp.344-349
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• 2005

The optical and electrical characteristics of plasma display panel(PDP) using the vacuum in-line sealing technology compared with the conventional sealing process in this research. This PDP consisted of MgO protecting layer by e-beam evaporation and battier rib, transparent dielectric layer, dielectric layer, and electrodes by screen printer and then sealed off on Ne-Xe(4 ％) 400 Torr and 430。C. The brightness and luminous efficiency were good as the base vacuum level was higher, and it was to check the advantage of high vacuum level sealing, one of the strong points of the vacuum in-line sealing process. However, the brightness and luminous efficiency was dropped sharply because of a crack on MgO protecting layer by the difference of the expansion and contraction stress on high temperature in the vacuum states between MgO and substrate. Fortunately, the crack was prevented by MgO was deposited on higher temperature than 300。C. Finally, the PDP, was fabricated by the vacuum in-line sealing process, resulted the lower brightness than processing only the thermal annealing treatment in the vacuum chamber, but the luminous efficiency was increased by the reducing power consumption with the decreasing luminous current. The vacuum in-line sealing technology was not to need the additional thermal annealing process and could reduce the fabrication process and bring the excellent optical and electrical properties without the crack of MgO protecting layer than the conventional sealing process.