• Proceedings of the KSME Conference
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• 2000.04a
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• pp.43-48
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• 2000

In this study, a small punch creep(SP-Creep) test using miniaturized specimen$(10{\times}10{\times}0.5mm)$ has been described for the development of the newly semi-destructive creep test method for high temperature structural components such as headers and tubes of boiler turbine casino and rotor and reactor vessel. The SP-Creep testing technique has been applied to 2.25Cr-1Mo(STBA24) steel used widely as boiler tube material and the creep test temperature are varied at $550^{\circ}C{\sim}600^{\circ}C$. The overall deformations of SP-Creep curves are definitely depended with applied load and creep test temperature and show the creep behaviors of three steps like conventional uniaxial creep curves. The steady state creep rate${\delta}_{ss}$ of SP-Creep curve for miniaturized specimen increases with increasing creep temperature, but the exponential value with creep loading is decreased. The activation energy$(Q_{spc})$ during SP-Creep deformation with various test temperatures shows 605.7kJ/mol that is g.eater than 467.4kJ/mol reported in uniaxial creep test. This may be caused by the difference of stress states during creep deformation In two creep test. But from the experimental results, e.g. SP-Creep curve behaviors, the steady state creep rate${\delta}_{ss}$ with creep temperature, and the exponential value(n) with creep loading, it can be summarized that the SP-Creep test may be a useful test method to evaluate the creep properties of the heat resisting material.

• Proceedings of the Korea Concrete Institute Conference
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• 2003.05a
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• pp.1029-1034
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• 2003

The basic Physical properties, Slump, Slump Flow, Air content, Bleeding, and Settlement of concrete was investigateed to test Characteristic of Setting and to evaluate the relation between Model Specimen and Heat of hydration for construction Over the High Temperature (CFT). The objective of this study is to take the partial core after the cementation of Model Specimen, test the compression intensity and analyze the relation to Test Piece.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Journal of the Korean Ceramic Society
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• v.31 no.5
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• pp.543-551
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• 1994

The creep behavior and creep fracture of sintered alumina at high temperature were investigated under four point flexural test. Steady-state creep behavior was observed at low bending stress and primary creep until fracture was observed at hish bending stress. The loading history of bending stress did not affect on steady-state creep rate. Intergranular fracture was dominant for fracture of alumina at room and high temperature. However, transgranular fracture was dominant on creep of alumina under high temperature by nucleation and growth of microcracks due to residual flaws or cavities in the material.

• Journal of the Korean Society for Heat Treatment
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• v.27 no.4
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• pp.180-184
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• 2014

In order to make clear relationship between high temperature tensile properties and fine microstructure of rapidly solidified cast-type Ni-base superalloys without heat treatment required for consolidation process, tensile test was carried out by changing strain rate from $5{\times}10^{-5}s^{-1}$ to $2{\times}10^{-2}s^{-1}$ and test temperature from $900^{\circ}C$ to $1050^{\circ}C$ using IN738LC and Rene'80 melt-spinning ribbons by twin roll process which were superior to ribbons by single roll process from the viewpoint of structure homogeneity. The dependence of tensile strength on strain rate and test temperature was studied and strain rate sensitivity, m, were estimated from tensile test results. From this study, it was found that tensile strength was influenced by ${\gamma}^{\prime}$ particle diameter, test temperature and strain rate, and m of ribbons exhibited above 0.3 over $950^{\circ}C$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.46-49
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• 2008

Drawing process of the high carbon steel wire with high speed is usually performed at room temperature using multi pass. Tn the multi pass drawing, temperature rise affects the mechanical properties of the final product. The excessive temperature rise during the deformation promotes the occurrence of delamination, and deteriorates the torsion property and durability of wire. This paper investigates the occurrence of delamination in the wire through the torsion test and the evaluation of wire temperature. The excessive wire temperature ieads to the occurrence of delamination. Based on the calculation of the wire temperature, a new pass schedule, that can prevent the delamination due to the excessive wire temperature rise, is designed through the isothermal pass schedule.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.1 s.190
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• pp.57-63
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• 2007

Wire drawing process of the high carbon steel with a high speed is usually conducted at room temperature using a number of passes or reductions through consequently located dies. In the multi-pass drawing process, temperature rise in each pass affects the mechanical properties of the final product such as bending, torsion, and tensile property, etc. This temperature rise during the deformation promotes the occurrence of delamination, and deteriorates the torsion property and durability of wire. This study investigates the occurrence of delamination in the wire through the torsion test and the evaluation of wire temperature. The excessive wire temperature leads to the occurrence of the delamination. Based on the calculation of the wire temperature, a new pass schedule, which can prevent the delamination due to the excessive wire temperature rise, is designed through the isothermal pass schedule.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.9
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• pp.1137-1143
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• 2011

The IHX (intermediate heat exchanger) of a VHTR (very high-temperature reactor) is a core component that transfers the high heat generated by the VHTR at $950^{\circ}C$ to a hydrogen production plant. Korea Atomic Energy Research Institute manufactured a small-scale prototype of a PCHE (printed circuit heat exchanger) that was being considered as a candidate for the IHX. In this study, as a part of high-temperature structural integrity evaluation of the small-scale PCHE prototype, we carried out high-temperature structural analysis modeling and macroscopic thermal and elastic structural analysis for the small-scale PCHE prototype under small-scale gas-loop test conditions. The modeling and analysis were performed as a precedent study prior to the performance test in the small-scale gas loop. The results obtained in this study will be compared with the test results for the small-scale PCHE. Moreover, these results will be used in the design of a medium-scale PCHE prototype.

• Journal of Powder Materials
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• v.5 no.3
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• pp.192-198
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• 1998

Microstructure and mechanical properties were examined on rapidly solidified Al-8wt%Fe alloy. High temperature strength test was also undertaken, and it is shown that the refinement in microstructure resulting from extremely rapid cooling rates gives rise to improved high temperature strength, but the elongation to fracture of this material decreases with increasing temperature, particularly in the temperature range up to 30$0^{\circ}C$. Specimens heat-treated for 100 hrs were analyzed with TEM micrographs to understand the thermal stability of this material.

• Proceedings of the Safety Management and Science Conference
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• 2008.04a
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• pp.273-282
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• 2008

To application Arrhenius model for OLED's lifetime, it's needed in high temperature test. Because OLED's character is changed in high temperature, it's important to find limit temperature. We found out $40^{\circ}C$ is proper temperature by result of tests. But that is not enough acceleration to apply in practical affairs. We find new stress to get a bigger accelerated constant.