• Journal of Magnetics
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• v.7 no.3
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• pp.106-114
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• 2002

To reduce the grain size and the media noise in a typical CrMo/CoCrPtB longitudinal media, a sputtering process which includes the exposure of oxygen onto the surface of CrW$_x$ (x=0, 25, 50, 75, 100 at.%) and CrTi$_{15}$ seedlayers with the thickness of 0.5 nm have been utilized. The main results are: (1) the media grain size and the media noise are reduced when using CrW$_x$ (x=0, 25, 50 at.%) seedlayers, and not reduced when using CrTils or CrW$_x$ (x=75, 100 at.%) seedlayers, (2) AES and RHEED results suggest that W seedlayer, which has the highest melting point, forms layer-like film with very small and dense island grain, due to its high free surface energy and low mobility. On the other hand, CrW$_{50}$ and Cr seedlayers, which have lower melting point than W seedlayer, form island film, (3) to effectively reduce the media grain size and improve the media signal to noise ratio, it is essential to utilize a very thin Cr-based seedlayer with high affinity for oxygen and which forms island-like structure, such as CrW$_{50}$ seedlayer.

• Journal of the Korean Society for Heat Treatment
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• v.14 no.3
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• pp.151-154
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• 2001

$TiO_2$ thin film has wide application because of its high capacitanca, reflection, and good transmissivity in visible range. $TiO_2$ thin film can be made by thermal deposition method, reactive evaporation method, activated reactive evaporation(ARE) method. In the case of thermal deposition, the oxygen deficiency can occur because the melting point of Ti is very high. While in the case of reactive evaporation, high density $TiO_2$ can not be made, because reactive gas($O_2$) and evaporated material(Ti) are not fully combined, activated reactive evaporation, $TiO_2$ is easily deposited at lower gas pressure compared with reactive evaporation because the ionized reactive gas is made by plasma. Therefore, activated reactive evaporation is very useful to deposit the material having the high melting point. In this work, we formed $TiO_2$ thin film by activated reactive evaporation method. The surface of $TiO_2$ thin film was analyzed by X-ray photoelectron spectroscopy. The surface morphology which was analyzed by atomic force microscopy(AFM) shows that feature of the film surface is uniform. The dielectric capacitance, withstanding voltage were $600{\mu}F/cm^2$, 0.4V respectively. In further work, we can increase the withstanding voltage by improving the deposition parameter of substrates.

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.2
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• pp.313-318
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• 2020

Since the engineering plastics having a melting point of higher than 300 degrees have a high mechanical rigidity, chemical resistance, friction and abrasion performance, those are being highlighted as metal replacement materials in various industries. In this study, 3D printer nozzle with excellent heat dissipation characteristics are designed and analytically verified to form engineering plastics with high melting points in 3D printers based on the melt-lamination modeling method. In order to insulate between the heat block heated to a melting point of filament material and the upper part of the nozzle where the filament is transferred, the heat brake part with low thermal conductivity was designed to have two separate parts, and a cooling fin structure is further applied to the heat brake part to lower steady-state temperature by air convection. Optimized structural design on FDM nozzle part reduces the temperature at the heat sink and at the end part of heat brake by 50% and 14% respectively, compared to the conventional BCnozzle structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Journal of Powder Materials
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• v.27 no.2
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• pp.139-145
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• 2020

The powder manufacturing process using the gas atomizer process is easy for mass production, has a fine powder particle size, and has excellent mechanical properties compared to the existing casting process, so it can be applied to various industries such as automobiles, electronic devices, aviation, and 3D printers. In this study, a modified A4032-xSn (x = 0, 1, 3, 5, and 10 wt.%) alloy with low melting point properties is investigated. After maintaining an argon (Ar) gas atmosphere, the main crucible is tilted; containing molten metal at 1,000℃ by melting the master alloy at a high frequency, and Ar gas is sprayed at 10 bar gas pressure after the molten metal inflow to the tundish crucible, which is maintained at 800℃. The manufactured powder is measured using a particle size analyzer, and FESEM is used to observe the shape and surface of the alloy powder. DSC is performed to investigate the change in shape, according to the melting point and temperature change. The microstructure of added tin (Sn) was observed by heat treatment at 575℃ for 10 min. As the content of Sn increased, the volume fraction increased to 1.1, 3.1, 6.4, and 10.9%.

• Journal of the Korean Solar Energy Society
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• v.33 no.1
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• pp.73-78
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• 2013

Hexadecane and exfoliated graphite nanoplate (xGnP)composite was prepared as a shape-stabilized phase change material (SSPCM) in a vacuum to develope thermal energy storage. The Hexadecane as an organic phase change material (PCM) is very stable against phase separation of PCM and has a melting point at $18^{\circ}C$ that is under the thermally comfortable temperature range in buildings. The xGnP is a porous carbon nanotube material with high thermal conductivity. Scanning electron microscope (SEM) and Fourier transformation infrared spectrophotometer (FT-IR)were used to confirm the chemical and physical stability of Hexadecane/xGnP SSPCM. In addition, thermal properties were determined by Deferential scanning calorimeter(DSC) and Thermogravimetric analysis (TGA). The specific heat of Hexadecane/xGnPSSPCM was $10.0J/g{\cdot}K$ at $21.8^{\circ}C$. The melting temperature range of melting and freezing were found to be $16-25^{\circ}C$ and $17-12^{\circ}C$. At this time, the laten heats of melting and freezing were 96.4J/g and 94.8J/g. The Hexadecane was impregnated into xGnP as much about 48.8% of Hexadecane/xGnP SSPCM's mass fraction.

• Journal of Powder Materials
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• v.18 no.2
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• pp.141-148
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• 2011

Carbon material shows relatively high strength at high temperature in vacuum atmosphere and can be easily removed as CO or $CO_2$ gas in oxidation atmosphere. Using these characteristics, we have investigated the applicability of carbon mold for precision casting of high melting point metal such as nickel. Disc shape carbon mold with cylindrical pores was prepared and Ni-base super alloy (CM247LC) was used as casting material. The effects of electroless Nickel plating on wettability and cast parameters such as temperature and pressure on castability were investigated. Furthermore, the proper condition for removal of carbon mold by evaporation in oxidation atmosphere was also examined. The SEM observation of the interface between carbon mold and casting materials (CM247LC), which was infiltrated at temperature up to $1600^{\circ}C$, revealed that there was no particular product at the interface. Carbon mold was effectively eliminated by exposure in oxygen rich atmosphere at $705^{\circ}C$ for 3 hours and oxidation of casting materials was restrained during raising and lowering the temperature by using inert gas. It means that the carbon can be applicable to precision casting as mold material.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.735-738
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• 2000

The characteristics of wire electrical discharge machining (WEDM) are governed by many factors such as the power supply type, operating condition and electrode material. This work deals with the effect of wire electrode materials on the machining characteristics such as, metal removal rate, surface characteristics and surface roughness during WEDM A wire's thermal physical properties are melting point, electrical conductivity and vapor pressure. One of the desired qualities of wire is a low melting point and high vapor pressure to help expel the contaminants from the gap. They are determined by the mix of alloying elements (in the case of plain brass and coated wire) or the base core material(i.e. molybdenum). Experiments have been conducted regarding the choice of suitable wire electrode materials and influence of the properties of these materials on the machinability and surface characteristics in WEDM, the experimental results are presented and discussed from their metallurgical aspect. And the coating effect of various alloying elements(Au, Ag, Cu, Zn, Cr, Mn, etc.) to the Cu or 65-35 brass core on them was reviewed also. The removal rate of some coated wires are higher than that of 65-35 brass electrode wire because the wire is difficult to break due to the wire cooling effect of Zn evaporation latent heat and the Zn oxide on the surface is effective in preventing short circuit. The removal rate increases with increasing Zn content from 35, 40 and Zn coated wire

• Journal of Welding and Joining
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• v.31 no.1
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• pp.58-64
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• 2013

The following results were obtained, microstructures and tensile properties in arc brazed joints of DP(dual phase) steel using Cu-5.3wt%Sn insert metal was investigated as function of brazing current. 1) The Fusion Zone was composed of ${\alpha}Fe+{\gamma}Cu$ and Cu23Sn2. The reason for the formation of these solid solutions. Despite, Fe & Cu were impossible to solid solution at room temperature. It's melting & reaction to something of insert metal & Base Metal (DP Steel) by Arc. Brazing Process has faster cooling rate then Cast Process, Supersaturated solid solution at room temperature. 2) The increase Hardness of Fusion Zone was directly proportional to the rise of welding current. Because, ${\alpha}Fe+{\gamma}Cu$ phase (higher hardness than the Cu23Sn2.(104.1Hv < 271.9Hv)) Volume fraction was Growth, due to increasing the amount of base metal melting by High current. 3) The results of tensile shear test by Brazing, All specimens happen to fracture in Fusion Zone. On the other hand, when Brazing Current increasing tend to rise tensile load. but it was very small, about 26-30% of the base metal. 4) The result of fracture analysis, The crack initiate at Triple Point for meet to Upper B.M/Under B.M/Fusion Zone. This Crack propagated to Fusion zone. So ruptured by tensile strength. The Reason to in the fusion zone fracture, Fusion zone by Brazing of hardness (strength) was very lower then the base metal (DP steel). In addition the Fusion Zone's thickness in triple point was thin than the base metal's thickness in triple point.

• Proceedings of the Korean Fiber Society Conference
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• 2001.10a
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• pp.87-90
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• 2001

Engineering thermoplastics with useful properties at elevated temperatures usually contain aromatic units in its chemical structure, especially symmetrical aryl groups such as 1, 4-phenylene, 4, 4'-biphenylene, and 2, 6-naphthalene. Aromatic groups often impart molecular rigidity, which contributes to high glass transition temperature and good thermal stability, and also to high melting point in semicrystalline polymers. (omitted)