• 제목/요약/키워드: Heterogeneous materials

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이종재료 레이저 용접부의 피로거동 (The Fatigue Behavior of Laser Weldment in Heterogeneous Materials)

  • 권응관;오택열;곽대순;이종재
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 추계학술대회 논문집
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    • pp.759-764
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    • 1997
  • In this study, Fatigue behavior of laser weldment in heterogeneous materials was investigated. Fatigue strength test and fatigue crack propagation test were performed for specimens with laser weldment in heterogeneous materials, and hardness test was performed. From the fatigue strength test. it was observed that the difference of strength between heterogeneous materials had eflect on crack initiation position and fatigue limit. From the fatigue crack propagation test. it was observed that fatigue behavior of laser weldment in heterogeneous materials is different from that in same materials. The difference of strength between heterogeneous materials and laser weldment had effect on fatigue crack propagation rate.

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Sintering of High K LTCC Compatible Dielectrics

  • Duguey, Sonia;Lebourgeois, Richard;Heintz, Jean-Marc
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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    • pp.376-376
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    • 2006
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찢김 하중에서 단일 재료 및 이종 접합 재료에 따른 이중외팔보 시험편의 접착제 파손 특성 (Adhesive Fracture Characteristic of DCB Specimen due to Single and Heterogeneous Materials under Tearing Load)

  • 김재원;조재웅
    • 한국기계가공학회지
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    • 제20권4호
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    • pp.127-134
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    • 2021
  • In this study, the adhesive fracturing characteristics of a DCB specimen due to single and heterogeneous bonding materials under tearing load was investigated. The experiments were conducted to examine the fracturing properties of the adhesive DCB specimen. As an experimental condition, a forced displacement of 3mm/min was applied to one side while the other side was fixed. As a result of the experiment, it was found that the AL6061-T6 material was superior to the CFRP material in terms of maximum stress, specific strength, and energy release rate when compared to the adhesive fracturing property of a single material. We tested CFRP-AL, a heterogeneous bonding material, and compared its experimental results to the results from the single materials. Based on these results, CFRP-AL with a heterogeneous bonding material was observed to have the superior structural safety compared to single materials for the mode III fracture type.

이종재료의 레이저용접에서 잔류응력 평가 (The Study on Residual Stress of Laser Weldment for the Heterogeneous Materials)

  • 오세헌;민택기
    • 한국공작기계학회논문집
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    • 제13권3호
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    • pp.119-125
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    • 2004
  • Generally, it is used the compensation spring to compensate the inaccuracy of screen image induced by thermal deformation in CRT monitor. Its mechanism is bi-metallic system made of heterogeneous metals and these is bonded by laser welding. But laser welding induces the non-uniform temperature distribution and locally residual stress is yielded by these temperature deviation. This paper studies residual stress of laser weldment using FEA and hole drilling method. The results are followed. In the case of heterogeneous materials weldment, higher residual stress induced in the weldment region of SUS 304 which have larger CTE than Ni 36 and residual stress on the middle of specimen is higher by 10.9% than that of its surface Measured residual stress of SUS 304 yield 481MPa and that of Ni 36 is 140.5MPa in the vicinity of the welding region. And the residual distribution is very similar in comparison with FEA result.

이종 집적 유연 반도체 시스템 구현을 위한 무기물 박막소재의 전사 방법 (Transfer Methods of Inorganic Thin Film Materials for Heterogeneously- Integration Flexible Semiconductor System)

  • 주경현;김정현;박상윤;김강현;이한얼
    • 한국전기전자재료학회논문지
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    • 제37권3호
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    • pp.241-252
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    • 2024
  • With the recent development of emerging technologies, information acquisition and delivery between users has been actively conducted, and inorganic thin film transfer technology that effectively transfers various materials and devices is being studied to develop flexible electronic devices accordingly. This is aimed at innovative structural changes and functional improvement of electronic devices in the era of the Internet of Things (IoT). In particular, advanced technologies such as microLEDs are used to realize high-resolution flexible displays, and the possibility of heterogeneous integrated technologies can be presented by precisely transferring materials to substrates through various transfer process. This paper introduced physical, chemical, and self-assembly transfer methods based on inorganic thin film materials to implement heterogeneous integrated flexible semiconductor systems and introduces the results of application studies of semiconductor devices obtained through different transfer technologies. These studies are expected to bring about innovative changes in the field of smart devices, medical technology, and user interfaces in the future.

비균질 재료에서의 균열거동평가를 위한 멀티스케일 수치해석 (Multiscale Simulation for a Crack Behavior in Heterogeneous Materials)

  • 누룰 파토니;권오헌
    • 한국안전학회지
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    • 제32권4호
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    • pp.1-6
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    • 2017
  • Functionally Graded Materials (FGM) as advanced heterogeneous composite materials have a higher performance than a conventional composite or bimaterial composite under some severe environments. As a heterogeneous material, FGM is commonly used in spacecraft, defense, nuclear and automotive industries due to its excellent properties. The purposes of this study are to evaluate the stress distribution and crack behaviors by the multiscale simulation. FGM contains two or more than two materials that the composition is structured continuously. Two types of FGM model are suggested, which are created by arbitrary prediction of the volume fraction and the exponential function. Aluminum as the metal matrix constituent and silicon carbide as the ceramic particle constituent are structured gradually by two types and the three point bending test also estimated. Moreover, two kinds of crack location were introduced in order to get the influences of material property distribution on the stress intensity factor. From the results we found that the stress intensity factors are increased in the case from softer to stiffer material, while vice versa.

복합재 형상의 FEA기반 설계를 위한 통합 CAD 시스템 (An Integrated CAD System for FEA-based Design of Heterogeneous Objects)

  • 신기훈;김주한
    • 한국CDE학회논문집
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    • 제10권5호
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    • pp.328-338
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    • 2005
  • CAD systems are routinely used by designers for creating part geometries. Interfaces to CAE/CAM systems are also commonplace enabling the FEA-based design optimization and the rapid fabrication of the designed part. However, conventional CAD systems have thus far focused on objects with homogeneous interior. Two recent advances--use of heterogeneous objects such as Functionally Graded Materials (FGM) in parts and Layered Manufacturing Technology (LMT)--have brought to the forefront the need for CAD systems to support the creation of geometry as well as the graded material inside. We first describe the need and the components of such a CAD system for heterogeneous objects. A prototype CAD system is then described with one specific example (thermal barrier type FGM, pressure vessel) in order to illustrate the use of the implemented CAD system. The implemented system is manually integrated with FEA tools for optimal design. Our ongoing work involves the automation of the integration with FEA tools.

임의 형상의 복합재 모델링을 위한 CSG 기반 표현 (CSG-based Representation for Free-form Heterogeneous Object Modeling)

  • 신기훈;이진구
    • 한국CDE학회논문집
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    • 제11권4호
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    • pp.235-245
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    • 2006
  • This paper proposes a CSG-based representation scheme for heterogeneous objects including multi-material objects and Functionally Graded Materials (FGMs). In particular, this scheme focuses on the construction of complicated heterogeneous objects guaranteeing desired material continuities at all the interfaces. In order to create various types of heterogeneous primitives, we first describe methods for specifying material composition functions such as geometry-independent, geometry-dependent functions. Constructive Material Composition (CMC) and corresponding heterogeneous Boolean Operators (e.g. material union, difference, intersection. and partition) are then proposed to illustrate how material continuities are dealt with. Finally, we describe the model hierarchy and data structure for computer representation. Even though the proposed scheme alone is sufficient for modeling all sorts of heterogeneous objects, the proposed scheme adopts a hybrid representation between CSG and decomposition. That is because hybrid representation can avoid the unnecessary growth of binary trees.

Direct Observation of Heterogeneous Nucleation in Al-Si-Cu-Mg Alloy Using Transmission Electron Microscopy and Three-dimensional Atom Probe Tomography

  • Hwang, Jun Yeon;Banerjee, Rajarshi;Diercks, David R.;Kaufman, Michael J.
    • Applied Microscopy
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    • 제43권3호
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    • pp.122-126
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    • 2013
  • The heterogeneous nucleation of the ${\Theta}^{\prime}$ phase on nanoscale precipitates has been investigated using a combination of three-dimensional atom probe tomography and high-resolution transmission electron microscopy. Two types of ${\Theta}^{\prime}$ phases were observed, namely small (~2 nm thick) cylindrical precipitates and larger (~100 nm) globular precipitates and both appear to be heterogeneously nucleated on the nanoscale precipitates. The composition and crystal structure of precipitates were directly analyzed by combination of two advanced characterization techniques.

여러 종류의 에폭시/이종무기물 혼합 콤포지트의 전기적 교류 절연파괴 특성 (Electrical AC Insulation Breakdown Characteristics of Various Epoxy / Heterogeneous Inorganic Mixed Composite)

  • 박재준
    • 전기학회논문지
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    • 제67권11호
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    • pp.1463-1470
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    • 2018
  • In this study, 20 types of samples were prepared by mixing different kinds of inorganic materials to develop insulation materials for epoxy - based GIS substation equipment used under high voltage environmentally friendly insulation gas. One of the electrical characteristics, AC insulation breakdown experiment was performed. As mixing ratio of mixed heterogeneous inorganic materials, the dielectric breakdown strength was increased with increasing filler ratio of micro silica, micro silica : micro Alumina, 1:9, 3:7, 5:5, 7:3, 9:1, and decreased as the filling amount of micro alumina increased. The AC insulation breakdown characteristics were the best when the composition ratio was 9:1. The higher the content of silica, the better the interfacial properties, and the larger the alumina content ratio, the worse the interfacial properties.