• Title/Summary/Keyword: Heat-Sink

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Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors (2차원 구조와 3차원 구조에 따른 멀티코어 프로세서의 온도 분석)

  • Choi, Hong-Jun;Ahn, Jin-Woo;Jang, Hyung-Beom;Kim, Jong-Myon;Kim, Cheol-Hong
    • Journal of the Korea Society of Computer and Information
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    • v.16 no.9
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    • pp.1-10
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    • 2011
  • Unfortunately, in current microprocessors, increasing the frequency causes increased power consumption and reduced reliability whereas it improves the performance. To overcome the power and thermal problems in the singlecore processors, multicore processors has been widely used. For 2D multicore processors, interconnection is regarded as one of the major constraints in performance and power efficiency. To reduce the performance degradation and the power consumption in 2D multicore processors, 3D integrated design technique has been studied by many researchers. Compared to 2D multicore processors, 3D multicore processors get the benefits of performance improvement and reduced power consumption by reducing the wire length significantly. However, 3D multicore processors have serious thermal problems due to high power density, resulting in reliability degradation. Detailed thermal analysis for multicore processors can be useful in designing thermal-aware processors. In this paper, we analyze the impact of workload distribution, distance to the heat sink, and number of stacked dies on the processor temperature. We also analyze the effects of the temperature on overall system performance. Especially, this paper presents the guideline for thermal-aware multicore processor design by analyzing the thermal problems in 2D multicore processors and 3D multicore processors.

Combustion Characteristic Study of LNG Flame in an Oxygen Enriched Environment (산소부화 조건에 따른 LNG 연소특성 연구)

  • Kim, Hey-Suk;Shin, Mi-Soo;Jang, Dong-Soon;Lee, Dae-Geun
    • Journal of Korean Society of Environmental Engineers
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    • v.29 no.1
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    • pp.23-30
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    • 2007
  • The ultimate objective of this study is to develop oxygen-enriched combustion techniques applicable to the system of practical industrial boiler. To this end the combustion characteristics of lab-scale LNG combustor were investigated as a first step using the method of numerical simulation by analyzing the flame characteristics and pollutant emission behaviour as a function of oxygen enrichment level. Several useful conclusions could be drawn based on this study. First of all, the increase of oxygen enrichment level instead of air caused long and thin flame called laminar flame feature. This was in good agreement with experimental results appeared in open literature and explained by the effect of the decrease of turbulent mixing due to the decrease of absolute amount of oxidizer flow rate by the absence of the nitrogen species. Further, as expected, oxygen enrichment increased the flame temperatures to a significant level together with concentrations of $CO_2$ and $H_2O$ species because of the elimination of the heat sink and dilution effects by the presence of $N_2$ inert gas. However, the increased flame temperature with $O_2$ enriched air showed the high possibility of the generation of thermal $NO_x$ if nitrogen species were present. In order to remedy the problem caused by the oxygen-enriched combustion, the appropriate amount of recirculation $CO_2$ gas was desirable to enhance the turbulent mixing and thereby flame stability and further optimum determination of operational conditions were necessary. For example, the adjustment of burner with swirl angle of $30\sim45^{\circ}$ increased the combustion efficiency of LNG fuel and simultaneously dropped the $NO_x$ formation.

Characteristics of a planar Bi-Sb multijunction thermal converter with Pt-heater (백금 히터가 내장된 평면형 Bi-Sb 다중접합 열전변환기의 특성)

  • Lee, H.C.;Kim, J.S.;Ham, S.H.;Lee, J.H.;Lee, J.H.;Park, S.I.;Kwon, S.W.
    • Journal of Sensor Science and Technology
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    • v.7 no.3
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    • pp.154-162
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    • 1998
  • A planar Bi-Sb multijunction thermal converter with high thermal sensitivity and small ac-dc transfer error has been fabricated by preparing the bifilar thin film Pt-heater and the hot junctions of thin film Bi-Sb thermopile on the $Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$-diaphragm, which functions as a thermal isolation layer, and the cold junctions on the dielectric membrane supported with the Si-substrate, which acts as a heat sink, and its ac-dc transfer characteristics were investigated with the fast reversed dc method. The respective thermal sensitivities of the converter with single bifilar heater were about 10.1 mV/mW and 14.8 mV/mW in the air and vacuum, and those of the converter with dual bifilar heater were about 5.1 mV/mW and 7.6 mV/mW, and about 5.3 mV/mW and 7.8 mV/mW in the air and vacuum for the inputs of inside and outside heaters, indicating that the thermal sensitivities in the vacuum, where there is rarely thermal loss caused by gas, are higher than those in the air. The ac-dc voltage and current transfer difference ranges of the converter with single bifilar heater were about ${\pm}1.80\;ppm$ and ${\pm}0.58\;ppm$, and those of the converter with dual bifilar heater were about ${\pm}0.63\;ppm$ and ${\pm}0.25\;ppm$, and about ${\pm}0.53\;ppm$ and ${\pm}0.27\;ppm$, respectively, for the inputs of inside and outside heaters, in the frequency range below 10 kHz and in the air.

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