• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집B
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• pp.353-358
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• 2000

This paper presents the experimental investigation about miniature heat pipe for notebook PC. The focus of analysis is the operating temperature not to exceed $65^{\circ}C$ maximum allowable CPU surface temperature. Copper is used to heat pipe material and brass is wick material, and working fluid is selected to water. This cooling system is heat spreader method using a aluminum plate, since this method is most commonly used. According to the present study, heat for 3mm heat pipe, 8W, and for 4mm heat pipe, 10W, is found to power dissipation limit respectively, Soon after this investigation, sufficient long term life test should be followed.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2286-2291
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• 2008

Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2001년도 추계학술발표대회 논문집
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• pp.99-104
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• 2001

Thermally induced vibration response of solar array is investigated. The solar array model consists of composite thin walled beam and solar blanket, spreader bar. The composite thin walled beam incorporates a number of nonclassical effects of transverse shear, primary and secondary warping, rotary inertia and anisotropy of constituent materials. The solar blanket is a membrane subjected to uniform tension in the z direction. The spreader bar is a rigid member. A coupled thermal structure analysis that includes the effects of structural deformations on heating and temperature gradient is investigated. A stability criterion given in parameters for establishes the conditions for thermal flutter.

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.31-36
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• 2015

전자소자의 다기능, 고밀도, 고성능, 그리고 소형화는 전자 패키지 기술에 초미세 피치 플립 칩, 3D 패키지, 유연 패키지, 등 새로운 기술 패러다임 전환을 가져왔으며, 이로 인해 패키지 된 칩의 열 관리는 소자의 성능을 좌우하는 중요한 요소로 대두되고 있다. Heat sink, heat spreader, TIM, 열전 냉각기, 등 많은 소자 냉각 방법들 중 본 연구에서는 냉매를 이용한 on-chip 액체 냉각 모듈을 Si 웨이퍼에 제작하고, 마이크로 채널 디자인에 따른 냉각 효과를 분석하였다. 마이크로 채널은 딥 반응성 이온 에칭을 이용하여 형성하였고, 3 종류 디자인(straight MC, serpentine MC, zigzag MC)으로 제작하여 마이크로 채널 디자인이 냉각 효율에 미치는 영향을 관찰하였다. 가열온도 $200^{\circ}C$, 냉매 유동속도 150 ml/min의 경우에서 straight MC가 약 $44^{\circ}C$의 높은 냉각 전후의 온도 차를 보였다. 냉매의 흐름과 상 변화는 형광현미경으로 관찰하였으며, 냉각 전후의 온도 차는 적외선현미경을 이용하여 분석하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.98.3-98
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• 1998

• 한국결정성장학회지
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• 제23권5호
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• pp.235-240
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• 2013

그래핀(Graphene)은 전기 전도성 및 열전도성이 우수하고 1 nm 수준의 초 박막 형 필름 소재를 제조할 수 있다는 장점으로 인하여, 차세대 트랜지스터 소자 및 디스플레이 장치에 적용 가능한 방열 소재로서 많은 연구가 활발히 진행되고 있다. 또한 CVD(chemical vapor deposition)제조법으로 합성된 그래파이트(Graphite)는 구조의 단순성 및 유연성 때문에 안정하고 열에 강한 탄소계 방열소재로 주목 받고 있다. 본 연구는 열전도도가 우수한 폼(foam)형태의 구리를 촉매로 상압과 진공에서의 CVD법을 이용하여 그래핀을 성장시킨 후 구리 폼의 기공 안에 다양한 종류의 그래파이트(Natural graphite, expandable(/expanded) graphite, etc)를 복합 및 안정화시켜 기존보다 높은 열전도도를 가지는 방열소재를 개발하였다. 제조된 금속폼/그래파이트 소재를 OM(optical microscopy)과 SEM(scanning electron microscopy)을 이용하여 표면을 확인하였고 DSC(Differential Scanning Calorimetry), 아르키메데스 법을 활용한 비열, 밀도 결과를 확보하였다. 또한 LFA(Laser Flash Analysis)를 이용하여 열 확산계수 예측을 통한 열전도 특성을 평가하였다.

• Journal of Periodontal and Implant Science
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• 제47권5호
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• pp.292-311
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• 2017

Purpose: Beyond the limited scope of non-specific polyclonal regulatory T cell (Treg)-based immunotherapy, which depends largely on serendipity, the present study explored a target Treg subset appropriate for the delivery of a novel epitope spreader Pep19 antigen as part of a sophisticated form of immunotherapy with defined antigen specificity that induces immune tolerance. Methods: Human polyclonal $CD4^+CD25^+CD127^{lo-}$ Tregs (127-Tregs) and $na\ddot{i}ve$ $CD4^+CD25^+CD45RA^+$ Tregs (45RA-Tregs) were isolated and were stimulated with target peptide 19 (Pep19)-pulsed dendritic cells in a tolerogenic milieu followed by ex vivo expansion. Low-dose interleukin-2 (IL-2) and rapamycin were added to selectively exclude the outgrowth of contaminating effector T cells (Teffs). The following parameters were investigated in the expanded antigen-specific Tregs: the distinct expression of the immunosuppressive Treg marker Foxp3, epigenetic stability (demethylation in the Treg-specific demethylated region), the suppression of Teffs, expression of the homing receptors CD62L/CCR7, and CD95L-mediated apoptosis. The expanded Tregs were adoptively transferred into an $NOD/scid/IL-2R{\gamma}^{-/-}$ mouse model of collagen-induced arthritis. Results: Epitope-spreader Pep19 targeting by 45RA-Tregs led to an outstanding in vitro suppressive T cell fate characterized by robust ex vivo expansion, the salient expression of Foxp3, high epigenetic stability, enhanced T cell suppression, modest expression of CD62L/CCR7, and higher resistance to CD95L-mediated apoptosis. After adoptive transfer, the distinct fate of these T cells demonstrated a potent in vivo immunotherapeutic capability, as indicated by the complete elimination of footpad swelling, prolonged survival, minimal histopathological changes, and preferential localization of $CD4^+CD25^+$ Tregs at the articular joints in a mechanistic and orchestrated way. Conclusions: We propose human $na\ddot{i}ve$ $CD4^+CD25^+CD45RA^+$ Tregs and the epitope spreader Pep19 as cellular and molecular targets for a novel antigen-specific Treg-based vaccination against collagen-induced arthritis.

• Journal of Advanced Marine Engineering and Technology
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• 제35권8호
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• pp.1016-1021
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• 2011

열전소자를 이용한 냉각 장치에 있어서 열전소자발열부측의 제거 열량은 제품의 성능 및 적용범위를 결정하는 주요변수가 되므로 히트싱크의 열저항을 최소화 할 수 있는 최적 조건의 히트싱크 설계를 필요로 한다. 발열부가 작고 상대적으로 히트싱크 면적이 커서 히트싱크 전체면으로 열확산이 필요한 경우 히트싱크의 방열 성능을 향상시키기 위하여 작동유체 R-22의 진동형 히트파이프를 이용하여 열전소자의 발열부측의 발열량(30W, 60W, 80W, 100W)과 공기 유속(1~4 m/s)에 따른 히트싱크의 열저항 실험 및 수치해석 결과와 비교 분석을 통해 히트싱크의 냉각 성능을 향상 시킬 수 있는 방법을 연구하였다.

• Korean Chemical Engineering Research
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• 제56권3호
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• pp.410-415
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• 2018

Expanded graphite (EG)/Ag nanoparticle composites were synthesized by the chemical reduction of Ag ions, followed by the addition of expanded graphite into an Ag reducing solution. The prepared composites showed uniform dispersion of Ag nanoparticles on the surface of expanded graphite and exhibited relatively higher thermal conductivities than those of pure expanded graphite. In the case of 10% Ag content in the composite, the thermal conductivity in the thickness direction was 78% higher than the pure expanded graphite. We suggest that EG/Ag nanoparticle composites are a strong candidate for advanced heat spreading material.

• 한국전기전자재료학회논문지
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• 제26권2호
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.