• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.171.1-171.1
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• 2010

Riverbank filtration wells have been developed to supply a heat source/sink of water in the alluvium aquifer to ground water heat pumps for cooling and heating of a green house. In order to look for an appropriate site to carry out the research, two sites of Jinju and Gumi areas were investigated. In the results of the electrical resistivity surveys, Jinju and Gumi areas have the alluvium aquifer in the depth of 6~17 m and 10~20 m under the ground respectively. Two boreholes have been drilled in each site of both areas. The averaged water level at Jinju site is about 3 m under the ground, and 3.5 m and 6.5 m of sandy gravel aquifer layers are existed in each site. While Gumi site has 10 m water level and 2.5 m and 4.6 m of sandy gravel aquifer. Therefore, it is expected that $1,000m^3$/day of water could be withdrawn at Jinju site rather than Gumi site.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.131-137
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• 2012

With the advantages of power savings, increased life expectancy and fast response time over traditional incandescent bulb, LEDs are increasingly used for many applications including automotive, aviation, display, and special lighting applications. Since the high heat generation of LED chips can reduce service life, degrade luminous efficiency, and cause variation of color temperature, many studies have been carried out on the optimization of LED packaging and heat sinks. In this study, a fin expansion type cooling device using heat pipe, instead of a solid aluminum heat sink, was designed for LED security lightings based on thermal resistance analysis. Numerical analysis and experimental validation were carried out to evaluate its cooling performance.

• The Transactions of the Korean Institute of Power Electronics
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• v.9 no.4
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• pp.350-355
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• 2004

This paper deals with the design of a heat dissipation system, which consists of a heat source of power semiconductor devices, a heat sink ;md a fan for the forced air cooling. It suggests the method of appropriately dividing the whole heat transfer system into analytical subsystems and also presents the correspondent analytic or experimental design equations for the subsystems. The experimental results on the designed heat dissipation system for the 400kW IGBT inverter show less than 10［%］ error with respect to the design temperature and therefore verify the validity of the proposed analytical design method in the steady state.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1168-1173
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• 2006

This research is to verify the cooling effect of the acting surface on the rotary motor using heat pipe and conventional cooling fan. In order to show the cooling performance of the rotary motor and heat pipe with the fin-typed heat sink, the surface temperature of the motor and condenser was measured in real time. The experiments were also conducted as for not only cooling device installed with heat pipe only, but with heat pipe and conventional cooling fan simultaneously.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.129-135
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• 2015

This paper shows significant methods that improve the lifespan of LED modules as well as efficiently using an aluminum heat-sink for LED module in high power. It proposes a method that raises stability and lifespan to protect LED modules and the power unit when the LED module has been used for a long hours at high temperatures. During the research, we applied a method of pulse-width modulation (PWM) in order to prevent the phenomenon that the entire power of a system is turned off and the lifespan is reduced when the LED nodule reacts to the high temperatures. To protect the LED module and SMPS based on high efficiency, a temperature sensor is attached underneath the circuit board and the sensor measures the temperature of circuit board when the LED module is powered on. The electrical power connected to SMPS is controlled by PWM when the temperature of the LED module reaches a particular temperature.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.6
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• pp.571-578
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• 2012

In this paper, an experimental investigation is performed to estimate the thermal performance of a natural convective heat sink with plate fins subject to the uniform wall temperature condition. Extensive experiments are performed with various input powers, fin spacings, and heights of the natural convective heat sinks with plate fins. In particular, the effect of the inclination angle on the thermal performance of the heat sink is studied. In order to validate the experimental data, the experimental results are compared with results from previous studies. Based on the experimental results, the appropriate ranges of the previous correlations between the input power, the fin spacing, the fin height, and the inclination angle for the natural convective heat sink with plate fins are evaluated.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.9
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• pp.855-862
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• 2005

An experimental investigation has been carried out for aluminum foam heat sink inserted into the annulus to examine the feasibility as a heat sink for high performance forced water cooling in the annulus. The local wall temperature distribution, inlet and outlet pressures and temperatures, and heat transfer coefficients were measured for heat flux of 13.6, 18.9, 25.1, 31.4 $kw/m^2$ and Reynolds number ranged from 120 to 2000. Experimental results show that the friction factor is higher than clear annulus without aluminum foam, while the significant augmentation in Nu is obtained. This technique can be used for the compactness of the heat exchanger.

• Solar Energy
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• v.9 no.1
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• pp.30-35
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• 1989

This paper dealt with an experiments on temperature vairation in the heat storage zone due to change of vertical location (height) of sink diffuser and flow extraction in small saltless solar pond ($0.5{\times}0.5{\times}1.0M$), and the honeycomb device for this experimental purpose consisted of one-tired, sealed, and air filled by honeycomb panels. As results of experiments, 1) The storage zone was formed under lower region below the honeycomb device. 2) The higher vertical location of sink diffuser was placed, the more mixing phenomenon increased in the pond at steady flow extraction. 3) The more flow extraction increased, the more mixing phenomenon decreased at constant heat exchanger and variable flow extraction.