• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.85-86
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• 2012

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.308-313
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• 2003

Thermal mass flow meters (TMFMs) are most widely used for measuring mass flow rates in the semiconductor industry. A TMFM should have a short response time in order to measure the time-varying flow rate rapidly and accurately. Therefore it is important to study transient heat transfer phenomena in the sensor tube of a TMFM that is the most critical part in the TMFM. In the present work, a simple numerical model for transient heat transfer phenomena of the sensor tube of a TMFM is presented. Numerical solutions for the tube and fluid temperatures in a transient state are obtained using the proposed model and compared with experimental results to validate the proposed model. Based on numerical solutions, heat transfer mechanism in a transient state in the sensor tube is explained. Finally, a correlation for predicting the response time of a sensor tube is presented. The correlation is verified by experimental results.

• Journal of Power System Engineering
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• v.7 no.3
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• pp.35-39
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• 2003

In this paper, the heat transfer phenomena in the sensor tube of a mass flow controller(MFC) were studied by experiments. In the sensor tube of MFC, the difference of temperature between inlet and outlet was necessary for calculating the mass flow rate. Therefore, the relations of flow rate, generated heat by heating wire, sensor location and tube thickness were investigated to find the optimized condition. Based on this study, static and dynamic characteristics of sensor can be used for mass flow controller.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.25 no.10
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• pp.707-713
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• 2015

This paper proposes experimental results for control performance deterioration of a piezoelectric actuator under high temperature conditions due to external heat environment. In this work, a heat environment from 30 ℃ to 190 ℃ is established by a heat chamber which is capable of high temperature of heat environment. Inside the heat chamber, an experimental apparatus consisting of the stack type of piezoelectric actuator, laser sensor, gap sensor and temperature sensor is established. After evaluating temperature dependent blocking force, displacement and time response of a piezoelectric actuator inside the heat chamber, tracking control performances are evaluated under various temperature conditions via proportional-integral-derivative(PID) feedback controller. The desired position trajectory has a sinusoidal wave form with a fixed frequency. Control performances are experimentally evaluated at both room temperature and high temperature and presented in time domain.

• Progress in Superconductivity
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• v.12 no.1
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• pp.41-45
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• 2010

Low temperature micro-calorimeters have been employed in the field of high resolution alpha spectrometers. These alpha detectors typically consist of a superconducting or metal absorber and a temperature sensor. The temperature sensor can be a transition edge sensor (TES), a metallic magnetic calorimeter (MMC) or other low temperature detectors for an accurate measurement of temperature change due to an alpha particle absorption. We report a recent study of the heat flow between a replaceable absorber and a temperature sensor. A piece of gold foil in $2.4{\times}2.7{\times}0.03\;mm^3$ is used as an absorber. A $40\;{\mu}m$ diameter Au:Er paramagnetic sensor is attached to another small piece of gold foil in $400{\times}200{\times}30\;{\mu}m^3$ to serve as the temperature sensor. This sensor assembly, Au:Er and gold foil, is placed on a miniature SQUID susceptometer in a gradiometric configuration. The thermal connection between the absorber and the sensor was made with three gold bonding wires. The measured thermal conductance shows a linear dependence to the temperature. The values are in a good agreement with Wiedemann-Franz type thermal conductance of the gold wires.

• International journal of advanced smart convergence
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• v.11 no.4
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• pp.28-40
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• 2022

Although precise temperature control in the heat treatment process is a key factor in process reliability, there are many cases where there is no separate heat source control optimization system in the field. To solve this problem, the program monitors the temperature data according to the heat source change through sensor communication in a recursive method based on multiple variables that affect the process, and the target heat source value and the actual heat treatment heat source to match the internal air temperature and material temperature. A control optimization system was constructed. Through this study, the error rate between the target temperature and the atmosphere (material surface) temperature of around 10.7% with the existing heat source control method was improved to an improved result of around 0.1% using a process optimization algorithm and system.

• 한국가스학회:학술대회논문집
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• 1997.09a
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• pp.229-235
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• 1997

A low power (300 mW) catalytic bead combustible gas sensor is developed and utilized with a computer controlled sampling system for measuring heat content of natural gas. The heat content of gas is proportional to the change in the energy required to exposure to the sample of combustible gas. The heat content of natural gas samples ranging 36.30 - 39.88 MJ/$m^3$ is measured in the range of approximately $1\%$ error, which is comparable to its nominal heat content. Each gas has a slightly different curve of sensitivity vs. sensor temperature. Thus there Is no temperature at which all sensitivities are equal. In calibration process the choice of a optimum operating temperature is an important factor that influences the overall performance of the measurement system.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.3
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• pp.622-629
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• 1988

In order to improve the sensitivity of the wafer type heat flux sensor, some heat flux sensors were manufactured and examined by using thermoelectric semiconductor material (bismuth telluride) whose Seebck coefficient is much larger than those of metallic thermocouple materials. Because the thermoelectric element cannot be bended or welded, a peculiar sensor structure and manufacturing process were designed. As a result, it is revealed that the characteristic sensitivity of the manufactured sensor is about 10 times larger than that of marketed sensor even though there are some troubles in stiffness for reciprocal use. If we make this kind of sensors smaller and thinner, it will be a useful method to measure the local heat flux from the surface of complex configuration.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.2
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• pp.132-136
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• 2004

A flat type $NO_2$ micro gas sensor was fabricated by MEMS technology. In order to heat up gas sensing material such as $WO_3$ to a target temperature, a micro hotplate was built on the gas sensor. The temperature distribution of micro gas sensor was analyzed by a CFD program, FLUENT. The results showed that the temperature of silicon wafer base was almost similar to that of the room temperature, which indicates that the heat generated at the micro hotplate heated up effectively the sensing material and its thermal isolation was kept. The uniformity of temperature on the sensing material can be improved by modifying the shape of micro hotplate.

• Journal of Sensor Science and Technology
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• v.24 no.3
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• pp.155-158
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• 2015

In this paper, in-situ heat cooling with temperature monitoring is reported to solve thermal issues in electric vehicle (EV) batteries. The device consists of a thick graphene cooler on top of the substrate and a platinum-based resistive temperature sensor with an embedded heater above the graphene. The graphene layer is synthesized by using chemical vapor deposition directly on the Ni layer above the Si substrate. The proposed thick graphene heat cooler does not use transfer technology, which involves many process steps and does not provide a high yield. This method also reduces the mechanical damage of the graphene and uses only one photomask. Using this structure, temperature detection and cooling are conducted simultaneously using one device. The temperature coefficient of resistance (TCR) of a $1{\times}1mm^2$ temperature sensor on 1-$\grave{i}m$-thick graphene is $1.573{\times}10^3ppm/^{\circ}C$. The heat source cools down $7.3^{\circ}C$ from $54.4^{\circ}C$ to $47.1^{\circ}C$.