• Title/Summary/Keyword: Heat lamp

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The Efficiency of External Heat Sources for Infrared Thermography Applied Concrete Structures and the Improvement of the Defect-identification (열화상 기법을 이용한 콘크리트 구조물 결함 검출시 열원의 효율 비교 및 결함검출 능력 향상)

  • Sim, Jun-Gi;Moon, Do-Young;Chung, Lan;Lee, Jong-Seh;Zi, Goangseup
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.13 no.5 s.57
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    • pp.169-179
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    • 2009
  • The purpose of this paper is to find an efficient heat source to amplify the surface temperature of damaged concrete structures for infrared thermography. we compare two different heat sources of far-infrared lamp and halogen lamp each other for their efficiency. The two heat sources were applied to the concrete specimens. Two different concrete specimens were used: one was the concrete containing internal void and the other was wrapped with partially unbonded fiber reinforced polymer sheet. it was found that the far-infrared lamp was more efficient than the halogen lamp. In addition, we propose a new algorithm to make the damage zone displayed clear in the image obtained from the thermographic operation. The algorithm is a combination of Gauss filtering process and the Prewitt mask operation.

Thermal Flow Analysis for Development of LED Fog Lamp for Vehicle (차량 LED 안개등 개발을 위한 열유동 해석)

  • Lee, Suk Young
    • Journal of Energy Engineering
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    • v.28 no.4
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    • pp.35-41
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    • 2019
  • In order to overcome these disadvantages, the halogen light source, which was previously used as a vehicle fog light, has increased power consumption and a short lifetime, and thus, an automobile light source is gradually being replaced with an LED. However, when the vehicle LED fog light is turned on, there is a disadvantage in reducing the life of the fog lamp due to the high heat generated from the LED. The heat generated by the LED inside the fog lamp is mainly emitted by the heatsink, but most of the remaining heat is released to the outside through convection. When cooling efficiency decreases due to convection, thermal energy generates heat to lenses, reflectors, and bezels, which are the main parts of lamps, or generates high temperatures in LED, thereby shortening the life of LED fog lights. In this study, we tried to improve the heat dissipation performance by convection in addition to the heat dissipation method by heat sink, and to determine the installation location of vents that can discharge the internal air or intake the external air of LED fog lamp for vehicle. Thermal fluid analysis was performed to ensure that the optimal data were reflected in the design. The average velocity of air increased in the order of Case3 and Case2 compared to Case1, which is the existing prototype, and the increase rate of Case3 was relatively higher than that of other cases. This is because the vents installed above and below the fog lamps induce the convective phenomena generated according to the temperature difference, and the heat is efficiently discharged with the increase of the air speed.

Cooling Performance of LED Head Lamp with Heat Sink and Cooling Fan (팬과 히트 싱크를 이용한 LED 전조등의 냉각성능 해석)

  • Ko, Man-Seok;Lee, Ju-Han;Oh, Sang-June;Cho, Hyen-Seok;Seo, Tea-Beom
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.33 no.12
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    • pp.947-951
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    • 2009
  • LED has the merits of high reliability, semi-permanent life, rapid-response and its small size for use as light source of head lamp. But the dependence of its performance and life on temperature affect on its practical use. Which dependence makes problem when the LED is heated up to a higher temperature level by self-generation of heat, due to "highly integration" to get enough quantity of light. To solve this problem, effective cooling system is needed that consider conduction, convection and radiation. This study points out the limits of natural convection cooling system and propose of forced convection with heat sink. Also, it describes a correlation between heat sink area and fluid velocity using numerical analysis to optimize the cooling system.

A Study on the radiant Heat Characteristic According to Type and Array of LED Lighting Heatsink (LED 조명등 히트싱크 형상과 배열에 따른 방열특성에 관한 연구)

  • Jang, Hyun;Suh, Jeong Se;Yi, Chung Seob
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.3
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    • pp.54-60
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    • 2013
  • Numerical analysis of the radiant heat characteristic around heatsink according to arrangement and shape of fin on 60W-LED lamp is conducted in this study. In the case of top blow blowing from upper side on LED lamp, there is just little difference in cooling characteristics according to the height of fin. On the other hand, the fin arranged side by side has the advantage of heat transfer enhancement by comparing with zig-zag type because it leads to more loss of flow. In case of making fin round to increase the amount of heat transfer, designing arrangement with the minimized loss of flow has the advantage of characteristic.

NUMERICAL STUDY ON COMBINED HEAT TRANSFER IN NIR HEATING CHAMBER (근적외선 열풍기의 복합열전달에 관한 수치적 연구)

  • Choi, H.K.;Yoo, G.J.;Kim, I.H.
    • Journal of computational fluids engineering
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    • v.12 no.4
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    • pp.7-13
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    • 2007
  • Numerical analysis is carried out for combined heat transfer in an indirected NIR(Near Infrared Ray) heating chamber. Reynolds number and shapes of absorbed cylinder are known as important parameters on the combined heat transfer effects. Reynolds number based on the outer diameter of the cylinder is varied from $10^3$ to $3{\times}10^5$. Four difference heat transfer regimes are observed: forced convection and radiative heat transfer on the outer surface of the cylinder, pure conduction in the cylinder body, pure natural convection and radiation between lamp surface and inner surface of the cylinder, and radiation from the lamp. Flow and temperature characteristics are presented with iso-contour lines for the absorbed circular and elliptic cylinders to compare their differences. The convective and radiative heat transfer fluxes are also compared with different Reynolds numbers. As usual, Reynolds number is an important factor to estimate increasing convective heat transfer as it increases. The shape of absorbed cylinder results overall heat transfer rates remain unchanged.

Development of automatic illumination controller for energy saving (에너지 절약형 자동조명 장치 개발)

  • 최명호;강형곤;김민기;한병성
    • Electrical & Electronic Materials
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    • v.9 no.10
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    • pp.1027-1032
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    • 1996
  • The auto-illumination controller for office, residence, and so on was studied. The system consists of parts of a power supply, a signal oscillator, a lamp controller and two kinds of sensor. The lamp controller has two thyristors triggered by the IR sensor(SCRI) and CdS sensor(SCR2) respectively, When the illuminance around this system is higher than operating value of its sensor, lamp is turned off automatically. Otherwise, the light of lamp gets dim by CdS sensor. In case IR sensor senses the body heat of people around itself, the illuminance of the lamp gets maximum. The illuminance of the lamp can be changed dimmly by control of the variable resistor (RV) connected with SCR2 in series. The turning - on time of the lamp can be also controlled using a variable resistor(Rt) connected with a signal oscillator in parallel. Changing resistance Rt changes the time constant(.tau.), which triggers the gate of SCR2. Though people left the surrounding of lamp, the lamp keeps light for a while.

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A Study on the Heat Radiation of LED Luminaires and the Indoor Temperature Increase (LED 등기구의 발열과 실내온도 상승에 관한 연구)

  • Kim, Dong-Geon;Kil, Gyung-Suk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.9
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    • pp.738-742
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    • 2012
  • This paper conducted a study on how the heat radiation of light emitting diode(LED) luminaires affects the indoor temperature increase. The effect was compared with that of a 20 W compact fluorescent lamp(CFL) and a 50 W MR16 halogen lamp which are most widely used inside of cruises, a LED downlight and a 4W MR16 LED replacing each of them. We installed a luminarie inside a thermally shielded chamber, measuring the temperature changes under the same volume every 5 minutes and compared the result with theoretically calculated heat radiation. The temperature changes in the chamber was measured four times, on seven hours' period in order to keep sufficient time once the temperature reaches the thermal equilibrium state. The results showed that the temperature of the 20 W E26 CFL and the 10 W LED downlight increased by $21.1^{\circ}C$ and $10.4^{\circ}C$ respectively, while that of the 50 W halogen MR16 and the 4 W LED MR16 increased by $33.9^{\circ}C$ and $4.8^{\circ}C$ respectively. The experimental heat radiation were calculated from the results and the experimental heat radiation of the CFL and the LED downlight were 171.5 cal and 86.5 cal, and those of the halogen MR16 and the LED MR16 were 275.3 cal and 36.5 cal. Therefore, the heat radiation was reduced by 49.5% and 86.7%, respectively, by replacing conventional light source with LED. In conclusion, we can expect a reduction of power consumption in air condition system and the effect on indoor temperature increase by application of LED luminaires.

Optical and Thermal Influence Analysis of High-power LED by MCPCB temperature (MCPCB의 온도에 따른 고출력 LED의 광학적, 열적 영향력 분석)

  • Lee, Seung-Min;Yang, Jong-Kyung;Jo, Ju-Ung;Lee, Jong-Chan;Park, Dae-Hee
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.12
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    • pp.2276-2280
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    • 2008
  • In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.